Surface mounted decoupling capacitor

Claim 1

In combination, a printed circuit board having a series of sockets, and a surface mountable decoupling capacitor assembly, said assembly comprising: an insulative substrate; a single pair of hollow insertable contacts connected to and extending though said substrate, said contacts being spaced from each other a distance representative of a distance between a power supply socket and grounding socket of said printed circuit board; a decoupling capacitor mounted on said substrate, said capacitor having internal stacked interdigitated plates and opposed conductive side plates connecting alternate ones of said stacked plates; a conductive pathway on a surface of said substrate extending from each one of said opposed conductive side plates to one of said hollow insertable contacts; and means connecting said pathways to said conductive side plates, said assembly being insertable into said printed circuit board under a multi-lead pin integrated circuit package positioned on said printed circuit board or on a wave-solderable surface of said printed circuit board such that only a power lead and a ground lead pin of said integrated circuit package pass into respective ones of said contacts to interconnect with respective ones of said power supply socket and grounding socket of said printed circuit board, remaining ones of said led pins being directly inserted into the remainder of said series of sockets.