Wafer support assembly

Claim 1

Wafer support means for retaining an individual wafer therein, comprising: at least three clip means for resiliently gripping edgewise said wafer; each of said clip means being spaced apart from each other and aligned in a first generally circular pattern of diameter greater than said wafer, the angular spacing between adjacent ones of said clip means being less than 180 degrees; each of said clip means having a resilient wire arm extending generally central inwardly of said circular pattern; each of said clip means extending in the direction transverse to that of said circular pattern a distance which is small relative to the diameter of said circular pattern; each of said clip means having at the end of said resilient arm nearest said center a finger portion opening generally centrally inward, said finger portions lying in a second circular pattern of diameter somewhat less than that of said wafer, said finger portion being arcuate in form; said finger portion engaging the edge of said wafer to be retained therein and exerting resilient pressure centrally inwardly on said wafer; said arms defining a portion depressible to facilitate acceptance and removal of said wafer; each said resilient wire arm including a distal portion nearest said center, terminating in said finger portion, and a proximal portion, said proximal portion being straight and at a right angle to said distal portion comprising said depressible portion, and lying generally in a plane parallel with the plane defined by said first circular pattern; two actuator means placed in proximity of each said clip for actuating each said clip in orthogonal directions; whereby a relatively thin support means is provided into which said individual wafer may be rapidly inserted and removed and while retained therein, transported and accessed on both sides for processing.