US4781801A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of copper plating gravure rolls
Assignee: Mcgean Rohco Inc
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Filing: 1987-02-03
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Granted: 1988-11-01
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Expires: 2007-02-03
Abstract
Abstract A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight of from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound, and about 0.5 to about 5 mg/l of a grain refining compound having the nucleus ##STR1## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180.
Inventors
- 👤 C. Richard Frisby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 11:15
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
144 words
A method of depositing on a gravure roll a layer of copper which does not significantly anneal upon aging and is especially adapted to receive electronic engraving, said method comprising the steps of submerging a gravure roll in an electroplating bath including from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound and about 0.5 to about 5.0 mg/l of a grain refining compound having the nucleus ##STR8## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180; and passing electrical current through the bath to deposit copper on the gravure roll.
Claim 2
Independent Claim
144 words
A method of depositing on a gravure roll a layer of copper which does not significantly anneal upon aging and is especially adapted to receive electronic engraving, said method comprising the steps of submerging a gravure roll in an electroplating bath including from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound and about 0.5 to about 5.0 mg/l of a grain refining compound having the nucleus ##STR8## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180; and passing electrical current through the bath to deposit copper on the gravure roll.
Claim 3
Dependent Claim
46 words
A process according to claim 1 wherein said polyether surfactant is present in an amount of about 80 mg/l, said grain refining compound is present in an amount of about 3 mg/l, and said benzene brightener compound is present in an amount of about 10 mg/l.
Claim 4
Dependent Claim
34 words
A process according to claim 1 wherein a current of from about 60 to about 450 A/sq.ft. is applied to the surface of the gravure roll to deposit about 0.015 inch of copper thereon.
Claim 5
Dependent Claim
25 words
A process according to claim 3 wherein the bath is operated at a temperature in the range of from about 70° to about 120° F.
Claim 6
Dependent Claim
19 words
A process according to claim 1 wherein the bath contains from about 20 to about 80 ppm of chloride.
Claim 7
Dependent Claim
13 words
A process according to claim 1 wherein the grain refining compound is 2-imidazolidinethione.
Claim 8
Dependent Claim
13 words
A process according to claim 1 wherein the grain refining compound is 2-thiohydantoin.
Claim 9
Dependent Claim
13 words
A process according to claim 1 wherein the grain refining compound is 1,1'-thiocarbonyldiimidazole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-01 | 1992-05-02 | 1992-11-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-01 | 1996-05-02 | 1996-11-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-01 | 2000-05-02 | 2000-11-01 | $7700.00 | Window Closed / Lapsed |