Liquid cooling type high frequency solid state device

Claim 1

A liquid cooling type high frequency solid state apparatus, comprising: a solid state chip; at least one matching circuit, having a cut-off dimension and connected to said solid state chip; a carrier supporting said solid state chip and said matching circuit and constituting, together with said solid state shio and said matching circuit, a device to be cooled; a coolant vessel for containing a liquid coolant, with a space for coolant vapor at the top thereof, at least a part of said solid state device contacting the liquid coolant for boiling the and evaporation the liquid coolant; condensing means for condensing the coolant vapor contained in the space at the top of said coolant vessel; and amplitude modulation reduction means for reducing amplitude modulation of said solid state device due to the boiling of the liquid coolant, said amplitude modulation reduction means comprising: radiator means, disposed on both sides of and adjacent to said solid state chip, for radiating heat generated by said solid state chip; and two parallel metallic bars, disposed on both sides of said solid state chip with said radiator means therebetween, for preventing wave leakage from said matching circuit, a distance between said two bars being equal to the cut-off dimension.