Patent US4800422A successfully refreshed from Google Patents.
US4800422A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Frostless interface supercooled VLSI system
Assignee: Intellectual Ventures I LLC
•
Filing: 1987-05-07
•
Granted: 1989-01-24
•
Expires: 2007-05-07
Abstract
Abstract A double walled vessel having a styrofoam filling between the double walls internally supports a semiconductor circuit to which is attached at least one flat ribbon cable. The semiconductor circuit is immersed in liquid nitrogen with at least one flat ribbon cable extending to the top lip of the vessel. Carbon conductors are connected to each conductor of the flat ribbon cable and extend to the outer wall of the vessel. Another flat ribbon cable is connected to the carbon conductors and to an electrical connector. A double walled top having a styrofoam filling is secured to the vessel such that the carbon conductors are sealed between the styrofoam filling of the top and the double walled vessel thereby preventing the formation of frost on the flat ribbon cable and connector that is external to the sealed vessel. Various tubings are inserted through the double walled vessel to permit the insertion of liquid nitrogen and the drawing off of gaseous nitrogen.
Inventors
- 👤 Ikuo J. Sanwo
- 👤 Gregory H. Milby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:55
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/30; H10W40/305
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
143 words
A system for supercooling a semiconductor chip comprising: a double wall vessel; a double wall top for sealing said double wall vessel, wherein said double wall vessel and top each have inner and outer walls and a space therebetween; a temperature insulating material filling said space; a semiconductor chip; means within said vessel for supporting said semiconductor chip; electrical conductor means connected to said semiconductor chip, said electrical conductor means extending from said semiconductor chip to the top of the inner wall of said vessel; carbon conductors connected to said electrical conductor means from the inner wall to the outer wall of said vessel and sandwiched between said temperature insulating material of said vessel and said top; electrical conductor means connected to said carbon conductors at the outer wall of said vessel; and a supercooling liquid within said vessel covering said semiconductor chip.
Claim 2
Independent Claim
143 words
A system for supercooling a semiconductor chip comprising: a double wall vessel; a double wall top for sealing said double wall vessel, wherein said double wall vessel and top each have inner and outer walls and a space therebetween; a temperature insulating material filling said space; a semiconductor chip; means within said vessel for supporting said semiconductor chip; electrical conductor means connected to said semiconductor chip, said electrical conductor means extending from said semiconductor chip to the top of the inner wall of said vessel; carbon conductors connected to said electrical conductor means from the inner wall to the outer wall of said vessel and sandwiched between said temperature insulating material of said vessel and said top; electrical conductor means connected to said carbon conductors at the outer wall of said vessel; and a supercooling liquid within said vessel covering said semiconductor chip.
Claim 3
Dependent Claim
29 words
A system for supercooling a semiconductor chip according to claim 1 and further comprising: a fill opening through the double walls of said vessel for adding said supercooling liquid.
Claim 4
Dependent Claim
19 words
A system for supercooling a semiconductor chip according to claim 1 wherein said carbon conductors are discrete carbon resistors.
Claim 5
Dependent Claim
19 words
A system for supercooling a semiconductor chip according to claim 1 wherein said carbon conductors are carbon ribbon strips.
Claim 6
Independent Claim
81 words
A system for supercooling a semiconductor chip comprising: a vessel; a top for sealing said vessel at a juncture between said vessel and said top; a semiconductor chip; mounting means for mounting said semiconductor chip in said vessel; cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel; carbon conductors interposed in said cabling means at a position corresponding to said juncture; and a supercooling liquid covering said semiconductor chip in said vessel.
Claim 7
Independent Claim
81 words
A system for supercooling a semiconductor chip comprising: a vessel; a top for sealing said vessel at a juncture between said vessel and said top; a semiconductor chip; mounting means for mounting said semiconductor chip in said vessel; cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel; carbon conductors interposed in said cabling means at a position corresponding to said juncture; and a supercooling liquid covering said semiconductor chip in said vessel.
Claim 8
Dependent Claim
19 words
The system for supercooling a semiconductor chip according to claim 5 wherein said carbon conductors are discrete carbon resistors.
Claim 9
Dependent Claim
19 words
The system for supercooling a semiconductor chip according to claim 5 wherein said carbon conductors are carbon ribbon strips.
Claim 10
Dependent Claim
20 words
The system for supercooling a semiconductor chip according to claim 5 wherein said semiconductor chip is a VLSI CMOS chip.
Claim 11
Dependent Claim
23 words
The system for supercooling a semiconductor chip according to claim 5 wherein said vessel and said top are lined with a styrofoam material.
Claim 12
Dependent Claim
23 words
The system for supercooling a semiconductor chip according to claim 9 wherein said styrofoam material is lined with a liner of ceramic material.
Claim 13
Independent Claim
68 words
A system for supercooling a semiconductor chip comprising: an insulated vessel; a semiconductor chip; mounting means for mounting said semiconductor chip inside said vessel; cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel; thermally insulating, electrical conductors interposed in said cabling means from inside to outside said vessel; and a supercooling liquid covering said semiconductor chip inside said vessel.
Claim 14
Independent Claim
68 words
A system for supercooling a semiconductor chip comprising: an insulated vessel; a semiconductor chip; mounting means for mounting said semiconductor chip inside said vessel; cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel; thermally insulating, electrical conductors interposed in said cabling means from inside to outside said vessel; and a supercooling liquid covering said semiconductor chip inside said vessel.
References Cited (Backward Citations)
GB1035905A
Cited
US3328642A
Cited
US3475660A
Cited
US3780356A
Cited
US4279127A
Cited
US4395728A
Cited
JPS57190372A
Cited
EP0156238A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-24 | 1992-07-25 | 1993-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-24 | 1996-07-25 | 1997-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-24 | 2000-07-25 | 2001-01-24 | $7700.00 | Window Closed / Lapsed |