Monolithic microwave integrated circuit with probing pads

Claim 1

A monolithic microwave integrated circuit wafer used as an intermediate product in the production of integrated circuits, comprising: a substrate; and a plurality of separate and distinct circuits, similar to each other, integrated on the surface of said substrate, each such circuit having at least two stages that are resistance-capacitance coupled to one another, each of said stages including at least one resistor, at least one capacitor having an upper electrode, a transistor and one or more bonding pads, each of said separate and distinct circuits also including composing pads, at least one of which is mounted on said upper electrode of said at least one capacitor in each of the separate and distinct circuits to avoid deterioration of high frequency characteristics, and said composing pads being connected between at least one terminal of said transistor and said at least one resistor in each of said stages for measuring direct current and high frequency characteristics of at least said transistor in each of said circuits to thereby identify inoperative circuits in said plurality of separate and distinct circuits of said substrate so as to aid in chip selection before the substrate is diced into physically separate circuit chips.