Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes

Claim 1

A miniature electric assembly for isolating voltage referenced transmission lines, said assembly comprising: (a) a generally planar substrate; (b) a lower conductive reference layer covering and generally conforming to the upper surface of the planar substrate; (c) a conductor; (d) a lower dielectric layer comprising a first layer covering the upper surface of the lower conductive reference layer and a second layer substantially entirely encasing the conductor along its length and supporting said encased conductor substantially entirely above the upper surface of the first layer; (e) an upper conductive reference layer covering the lower dielectric layer and substantially encasing the supported conductor along its length and the lower dielectric layer; and (f) an upper dielectric layer covering the upper conductive reference layer.

Claim 20

A method for producing a miniature electric assembly having isolated voltage referenced transmission lines, said method comprising (a) depositing a lower conductive reference layer contacting and covering the upper surface of a generally planar substrate; (b) depositing a first dielectric layer contacting and covering to the upper surface of the lower conductive layer; (c) depositing a conductor contacting the surface of the first dielectric layer; (d) removing a portion of the first dielectric layer, except underneath the deposited conductor, forming a pedestal dielectric base supporting the conductor along its length; (e) depositing a second dielectric layer contacting and covering any remaining exposed portion of the first dielectric layer and substantially encasing the conductor and pedestal dielectric base; (f) depositing an upper conductive reference layer contacting and covering the upper surface of the second dielectric and encased conductor; and (g) depositing a third dielectric layer contacting and covering the upper surface of the upper conductive reference layer.

Claim 21

A method for producing a miniature electric assembly having isolated voltage referenced transmission lines, said method comprising (a) depositing a lower conductive reference layer contacting and covering the upper surface of a generally planar substrate; (b) depositing a first dielectric layer contacting and covering to the upper surface of the lower conductive layer; (c) depositing a conductor contacting the surface of the first dielectric layer; (d) removing a portion of the first dielectric layer, except underneath the deposited conductor, forming a pedestal dielectric base supporting the conductor along its length; (e) depositing a second dielectric layer contacting and covering any remaining exposed portion of the first dielectric layer and substantially encasing the conductor and pedestal dielectric base; (f) depositing an upper conductive reference layer contacting and covering the upper surface of the second dielectric and encased conductor; and (g) depositing a third dielectric layer contacting and covering the upper surface of the upper conductive reference layer.

Claim 26

A method for producing a miniature electric assembly having isolated voltage referenced transmission lines, said method comprising (a) depositing a lower conductive reference layer contacting and covering the upper surface of a generally planar substrate; (b) depositing a first dielectric layer contacting and covering to the upper surface of the lower conductive layer; (c) depositing a conductor contacting the surface of the first dielectric layer; (d) depositing a dielectric cap contacting the upper surface of the conductor; (e) removing a substantial portion of the height of the first dielectric, except underneath the deposited conductor, forming a pedestal dielectric base supporting the conductor along its length above the newly formed upper surface of the now thinner first dielectric; (f) depositing a second dielectric layer contacting and covering any remaining exposed portion of the first dielectric layer and forming a dielectric sidewall which contacts and substantially encases the sides of the dielectric cap, the conductor and the pedestal dielectric base; (g) depositing an upper conductive reference layer covering and substantially encasing the surfaces of the dielectric cap, the dielectric cap and the pedestal dielectric base; and (h) depositing a third dielectric layer contacting and covering the upper surface of the upper conductive layer.

Claim 27

A method for producing a miniature electric assembly having isolated voltage referenced transmission lines, said method comprising (a) depositing a lower conductive reference layer contacting and covering the upper surface of a generally planar substrate; (b) depositing a first dielectric layer contacting and covering to the upper surface of the lower conductive layer; (c) depositing a conductor contacting the surface of the first dielectric layer; (d) depositing a dielectric cap contacting the upper surface of the conductor; (e) removing a substantial portion of the height of the first dielectric, except underneath the deposited conductor, forming a pedestal dielectric base supporting the conductor along its length above the newly formed upper surface of the now thinner first dielectric; (f) depositing a second dielectric layer contacting and covering any remaining exposed portion of the first dielectric layer and forming a dielectric sidewall which contacts and substantially encases the sides of the dielectric cap, the conductor and the pedestal dielectric base; (g) depositing an upper conductive reference layer covering and substantially encasing the surfaces of the dielectric cap, the dielectric cap and the pedestal dielectric base; and (h) depositing a third dielectric layer contacting and covering the upper surface of the upper conductive layer.

Claim 29

A method according to claim wherein said method includes the additional step of removing a portion of the first dielectric to permit electrical connection between the conductor and the lower or upper conductive reference planes.