Patent US4829818A successfully refreshed from Google Patents.
US4829818A
Expired / Lapsed
US
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Flow sensor housing
Assignee: Honeywell Inc
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Filing: 1983-12-27
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Granted: 1989-05-16
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Expires: 2003-12-27
Abstract
Abstract Disclosed is a flow sensor housing comprising a base member having a flow channel formed therein. The base member comprises means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor. The base member comprises the body of a standard semiconductor package. Standard semiconductor package conductors are integral to the base member. Each conductor has first and second terminal portions. The conductors and terminal portions are positioned so that the first terminal portion of a plurality of conductors are each adapted to connect to a higher level package adapted for receiving a standard semiconductor package and so that the second terminal portion of a plurality of conductors are each adapted for electrical connection to the flow sensor.
Inventors
- 👤 Philip J. Bohrer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 21:24
CPC Classifications
G; G01; G01F; G01F15/00; G01F15/14; G01F1/00; G01F1/68; G01F1/684; G01F1/6845
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
132 words
A flow sensor housing comprising: a base member having a flow channel formed therein, the base member comprising means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor, the base member comprising the body of a standard semiconductor package; and standard semiconductor package conductors integral to the base member, each conductor having first and second terminal portions, the conductors and terminal portions being positioned so that the first terminal portion of a plurality of conductors are each adapted to connect to a higher level package adapted for receiving a standard semiconductor package and so that the second terminal portion of a plurality of conductors are each adapted for electrical connection to the flow sensor.
Claim 2
Dependent Claim
132 words
A flow sensor housing comprising: a base member having a flow channel formed therein, the base member comprising means for mounting a flow sensor so that, when a flow sensor is mounted therein, air flowing through the flow channel will be sensed by the flow sensor, the base member comprising the body of a standard semiconductor package; and standard semiconductor package conductors integral to the base member, each conductor having first and second terminal portions, the conductors and terminal portions being positioned so that the first terminal portion of a plurality of conductors are each adapted to connect to a higher level package adapted for receiving a standard semiconductor package and so that the second terminal portion of a plurality of conductors are each adapted for electrical connection to the flow sensor.
Claim 3
Dependent Claim
14 words
The apparatus of claim 1 wherein the standard semiconductor package comprises a dual-in-line package.
Claim 4
Dependent Claim
32 words
The apparatus of claim 2 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by wire bonding.
Claim 5
Dependent Claim
32 words
The apparatus of claim 2 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by solderbump techniques.
Claim 6
Dependent Claim
15 words
The apparatus of claim 1 wherein the standard semiconductor package comprises a pin array package.
Claim 7
Dependent Claim
32 words
The apparatus of claim 5 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by wire bonding.
Claim 8
Dependent Claim
32 words
The apparatus of claim 5 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by solderbump techniques.
Claim 9
Dependent Claim
14 words
The apparatus of claim 1 wherein the standard semiconductor package comprises a single-in-line package.
Claim 10
Dependent Claim
32 words
The apparatus of claim 8 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by wire bonding.
Claim 11
Dependent Claim
32 words
The apparatus of claim 8 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by solderbump techniques.
Claim 12
Dependent Claim
15 words
The apparatus of claim 1 wherein the standard semiconductor package comprises a leadless chip carrier.
Claim 13
Dependent Claim
32 words
The apparatus of claim 11 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by wire bonding.
Claim 14
Dependent Claim
32 words
The apparatus of claim 11 wherein the means for mounting the flow sensor comprises means for electrically connecting the second terminal portion of the conductors to the flow sensor by solderbump techniques.
Claim 15
Dependent Claim
27 words
The apparatus of claim 1 wherein the means for mounting the flow sensor comprises means for orienting the flow sensor for a desired response to the flow.
Claim 16
Dependent Claim
20 words
The apparatus of claim 14 wherein the means for mounting the flow sensor comprises terminal portions adapted for solderbump connection.
Claim 17
Dependent Claim
32 words
The apparatus of claim 14 wherein the means for mounting the flow sensor comprises a cavity in the base member for receiving and positioning at least a portion of the flow sensor.
Claim 18
Dependent Claim
26 words
The apparatus of claim 1 wherein the means for mounting the flow sensor comprises means for orienting the flow sensor for optimum response to the flow.
Claim 19
Dependent Claim
20 words
The apparatus of claim 17 wherein the means for mounting the flow sensor comprises terminal portions adapted for solderbump connection.
Claim 20
Dependent Claim
32 words
The apparatus of claim 17 wherein the means for mounting the flow sensor comprises a cavity in the base member for receiving and positioning at least a portion of the flow sensor.
Claim 21
Dependent Claim
23 words
The apparatus of claim 1 wherein the flow channel comprises nonuniform dimensions for enhancing the velocity of the flow over the flow sensor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-15 | 1992-11-14 | 1993-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-15 | 1996-11-14 | 1997-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-15 | 2000-11-14 | 2001-05-16 | $7700.00 | Window Closed / Lapsed |