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US4841680A Expired / Lapsed US ⏱️ 0.0 years remaining

Inverted cell pad material for grinding, lapping, shaping and polishing

Assignee: DuPont Electronic Materials Holding Inc
•
Filing: 1988-09-20
•
Granted: 1989-06-27
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Expires: 2008-09-20
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Abstract

Abstract A polishing pad material is provided with a cellular polymeric layer containing elongated cells normal to the major surfaces of the material, such that the cell openings on the polishing surface of the material comprise a majority of the surface area, and the cells have a mean diameter of about 50 to 200 microns with the diameter of the surface openings being preferably larger than the cell diameters below the surface. The cells are preferably cone-shaped and have a depth at least 1.5 times the diameter of the surface openings. The pad material is formed from a poromeric material, preferably polyurethane elastomer, with microporous cell walls having pore diameters less than 0.1 times the diameter of the cells. The polishing pad material may be made according to conventional poromeric technology, but instead of removing the usual top poromeric skin, the poromeric layer is inverted and the original bottom poromeric skin and any attached substrate are removed to open and expose the cells at a plane corresponding to their largest diameters.

Inventors

  • 👤 Mark F. Hoffstein
  • 👤 Takehisa Shinagawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 02:30
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/11; B24B37/20; B24B37/24; B24D; B24D3/00; B24D3/02; B24D3/20; B24D3/28; B24D3/32; B29; B29C; B29C44/00; B29C44/20; B29C44/32; B29C44/321; C; C08; C08J; C08J9/00; C08J9/0061; C08J9/28; B29K; B29K2075/00; B29L; B29L2031/00; B29L2031/736; C08J2375/00; C08J2375/04; C08J2427/00; Y; Y02; Y02P; Y02P20/00; Y02P20/50; Y02P20/582; Y10; Y10T; Y10T428/00; Y10T428/249921; Y10T428/249953; Y10T428/249981

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 87 words
A polishing pad material comprising a cellular polymeric layer containing elongated cells which are generally oriented normal to and have an opening on the polishing surface of said material, said cell openings comprising a majority of the surface area of said polishing surface, the depth of said cells is at least 1.5 times the diameter of the surface openings, and said cells having a mean diameter of about 50 to 200 microns with the diameter of said openings being generally larger than the diameter beneath the surface.
Claim 2
Dependent Claim 87 words
A polishing pad material comprising a cellular polymeric layer containing elongated cells which are generally oriented normal to and have an opening on the polishing surface of said material, said cell openings comprising a majority of the surface area of said polishing surface, the depth of said cells is at least 1.5 times the diameter of the surface openings, and said cells having a mean diameter of about 50 to 200 microns with the diameter of said openings being generally larger than the diameter beneath the surface.
Claim 3
Dependent Claim 15 words
A polishing pad material according to claim 1 wherein said layer is a poromeric material.
Claim 4
Dependent Claim 16 words
A polishing pad material according to claim 2 wherein said poromeric material comprises a polyurethane elastomer.
Claim 5
Dependent Claim 38 words
A polishing pad material according to claim 2 wherein said poromeric material has microporous walls between the cells, the diameter of the pores of the microporous walls being less than 0.1 times the mean diameter of the cells.
Claim 6
Dependent Claim 25 words
A pad material according to claim 1 wherein said layer is affixed to a substrate on the surface of the layer opposite from said openings.
Claim 7
Dependent Claim 21 words
A polishing pad material according to claim 1 wherein said cells are generally cone-shaped with the opening on the polishing surface.
Claim 8
Dependent Claim 29 words
In a method of polishing objects with a pad material and an abrasive slurry, the improvement comprising using the polishing pad material of claim 1 as the pad material.
Claim 9
Dependent Claim 32 words
A method according to claim 7 wherein said object to be polished is selected from the group consisting of semiconductor wafers, metallurgical samples, memory disk surfaces, optical components, lenses and wafer masks.

References Cited (Backward Citations)

US26385A Cited
US2319873A Cited
US2996409A Cited
USRE26385E Cited
US3284274A Cited
US3504457A Cited
US3841031A Cited
JPS5523954A Cited
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US4537817A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-06-26 1992-12-26 1993-06-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-06-26 1996-12-26 1997-06-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-06-26 2000-12-26 2001-06-27 $7700.00 Window Closed / Lapsed

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