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US4858073A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal substrated printed circuit
Assignee: Akzo America Inc
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Filing: 1988-03-21
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Granted: 1989-08-15
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Expires: 2008-03-21
Abstract
Abstract A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperature thermal plastic, such as polyetherimide. A semiconductor die is attached to a relatively thick metal heat spreader which in turn is attached to at least a portion of the copper foil. The resultant structure is a semiconductor package which has a thermal performance comparable to that of typical hybrid ceramic packages.
Inventors
- 👤 Vernon C. Gregory
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 15:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0058; H05K3/0061; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/03; H05K1/05; H05K1/056; H05K1/18; H05K1/189; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0154; H05K2201/06; H05K2201/066; H05K2201/09; H05K2201/09009; H05K2201/09018; H05K2201/10; H05K2201/10227; H05K2201/1034; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10742; H05K2201/1075; H05K2201/1084; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/03; H05K2203/0369; H05K2203/11; H05K2203/1115; H05K2203/17; H05K2203/175; H05K2203/30; H05K2203/302; H05K3/30; H05K3/32; H05K3/34; H05K3/3405; H05K3/341; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 47
Claim 1
Independent Claim
164 words
An electronic metal printed circuit board structure including in combination: a metal substrate; an electrical insulation layer of plastic film having first and second sides; conductive foil means bonded to the first side of said plastic film, said conductive foil means having a first predetermined thickness; a heat dissipating conductor plate having a thickness greater than said first predetermined thickness attached to at least a portion of said conductive foil means; semiconductor means mounted in heat exchanging proximity to said conductor plate; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding the second side of said plastic film to said metal substrate, the combined thickness of said plastic film and said bonding means being less than twenty microns, and substantially less than the thickness of said conductor plate and said metal substrate, to permit heat dissipation into said metal substrate from said foil means and said conductor plate while providing electrical insulation between said substrate and said conductive foil means.
Claim 2
Dependent Claim
164 words
An electronic metal printed circuit board structure including in combination: a metal substrate; an electrical insulation layer of plastic film having first and second sides; conductive foil means bonded to the first side of said plastic film, said conductive foil means having a first predetermined thickness; a heat dissipating conductor plate having a thickness greater than said first predetermined thickness attached to at least a portion of said conductive foil means; semiconductor means mounted in heat exchanging proximity to said conductor plate; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding the second side of said plastic film to said metal substrate, the combined thickness of said plastic film and said bonding means being less than twenty microns, and substantially less than the thickness of said conductor plate and said metal substrate, to permit heat dissipation into said metal substrate from said foil means and said conductor plate while providing electrical insulation between said substrate and said conductive foil means.
Claim 3
Dependent Claim
14 words
The combination according to claim 1 wherein said plastic film is polyimide plastic film.
Claim 4
Dependent Claim
25 words
The combination according to claim 2 wherein said means bonding said second side of said insulation layer to said metal substrate comprises a fusible thermoplastic.
Claim 5
Dependent Claim
12 words
The combination according to claim 3 wherein said fusible thermoplastic is polyetherimide.
Claim 6
Dependent Claim
14 words
The combination according to claim 4 wherein said metal substrate comprises a heat sink.
Claim 7
Dependent Claim
15 words
The combination according to claim 5 wherein said metal substrate is an aluminum heat sink.
Claim 8
Dependent Claim
25 words
The combination according to claim 6 wherein the thickness of said conductor plate is several times greater than the thickness of said conductive foil means.
Claim 9
Dependent Claim
14 words
The combination according to claim 7 wherein said semiconductor means comprises a silicon die.
Claim 10
Dependent Claim
16 words
The combination according to claim 8 wherein said silicon die is mounted on said conductor plate.
Claim 11
Dependent Claim
26 words
The combination according to claim 9 wherein said silicon die is soldered to said conductor plate, and said conductor plate is soldered to said conductive foil.
Claim 12
Dependent Claim
21 words
The combination according to claim 9 wherein said semiconductor means is attached in thermal heat exchanging relationship to said conductor plate.
Claim 13
Dependent Claim
36 words
The combination according to claim 1 wherein the surface of said metal substrate is non-planar and said plastic film and said conductive foil means are flexible and are contoured to said surface of said metal substrate.
Claim 14
Dependent Claim
18 words
The combination according to claim 12 wherein said conductive foil means and said conductor plate both are copper.
Claim 15
Dependent Claim
14 words
The combination according to claim 13 wherein said plastic film is polyimide plastic film.
Claim 16
Dependent Claim
25 words
The combination according to claim 14 wherein said means bonding said second side of said plastic film to said metal substrate comprises a fusible thermoplastic.
Claim 17
Dependent Claim
27 words
The combination according to claim 15 wherein said means bonding said second side of said plastic film to said metal substrate comprises a layer of thermoplastic film.
Claim 18
Dependent Claim
25 words
The combination according to claim 14 wherein the thickness of said conductor plate is several times greater than the thickness of said conductive foil means.
Claim 19
Dependent Claim
14 words
The combination according to claim 17 wherein said semiconductor means comprises a silicon die.
Claim 20
Dependent Claim
16 words
The combination according to claim 18 wherein said silicon die is mounted on said conductor plate.
Claim 21
Dependent Claim
15 words
The combination according to claim 1 wherein said metal substrate is a flat metal spring.
Claim 22
Dependent Claim
13 words
The combination according to claim 20 wherein said spring is made of beryllium-copper.
Claim 23
Dependent Claim
21 words
The combination according to claim 14 wherein said semiconductor means is attached in thermal heat exchanging relationship to said conductor plate.
Claim 24
Dependent Claim
26 words
The combination according to claim 22 wherein said silicon die is soldered to said conductor plate, and said conductor plate is soldered to said conductive foil.
Claim 25
Dependent Claim
14 words
The combination according to claim 23 wherein said plastic film is polyimide plastic film.
Claim 26
Dependent Claim
27 words
The combination according to claim 24 wherein said means bonding the second side of said plastic film to said metal substrate comprises a layer of thermoplastic film.
Claim 27
Dependent Claim
31 words
The combination according to claim 1 wherein the mass per unit area of said conductor plate is several times greater than the mass per unit area of said conductive foil means.
Claim 28
Dependent Claim
14 words
The combination according to claim 1 wherein said semiconductor means comprises a silicon die.
Claim 29
Dependent Claim
25 words
The combination according to claim 1 wherein said means bonding said second side of said plastic film to said metal substrate comprises a fusible thermoplastic.
Claim 30
Dependent Claim
12 words
The combination according to claim 28 wherein said fusible thermoplastic is polyetherimide.
Claim 31
Dependent Claim
14 words
The combination according to claim 29 wherein said plastic film is polyimide plastic film.
Claim 32
Dependent Claim
108 words
An electronic metal printed circuit board structure including in combination: a metal substrate board; a polyimide film having first and second sides; a flexible, conductive foil printed circuit bonded to said first side of said polyimide film; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding the second side of said polyimide film to the surface of said metal substrate board, the thickness of said polyimide film and said bonding means being less than twenty microns to permit substantial heat dissipation into said metal substrate board from said conductive foil printed circuit while providing electrical insulation between said foil printed circuit and said board.
Claim 33
Dependent Claim
108 words
An electronic metal printed circuit board structure including in combination: a metal substrate board; a polyimide film having first and second sides; a flexible, conductive foil printed circuit bonded to said first side of said polyimide film; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding the second side of said polyimide film to the surface of said metal substrate board, the thickness of said polyimide film and said bonding means being less than twenty microns to permit substantial heat dissipation into said metal substrate board from said conductive foil printed circuit while providing electrical insulation between said foil printed circuit and said board.
Claim 34
Dependent Claim
46 words
The combination according to claim 31 wherein said bonding means comprises a thermoplastic layer; wherein said thermoplastic layer thermally bonds said polyimide film to said surface of said metal substrate and the combined thickness of said film and said thermoplastic layer is less than twenty microns.
Claim 35
Dependent Claim
13 words
The combination according to claim 32 wherein said conductive foil is copper foil.
Claim 36
Dependent Claim
39 words
The combination according to claim 33 further including a metal heat dissipating plate electrically insulated from said metal surface and bonded to at least a portion of one of said flexible conductive foil printed circuit and said polyimide film.
Claim 37
Dependent Claim
12 words
The combination according to claim 34 wherein said metal plate is copper.
Claim 38
Dependent Claim
29 words
The combination according to claim 35 wherein said metal plate has a mass per unit of area substantially greater than the mass per unit area of said conductive foil.
Claim 39
Dependent Claim
46 words
The combination according to claim 31 further including a metal heat dissipating plate electrically insulated from the surface of said metal substrate by said polyimide film and bonded to at least a portion of one of said flexible conductive foil printed circuit and said polyimide film.
Claim 40
Dependent Claim
29 words
The combination according to claim 37 wherein said metal substrate has a mass per unit of area substantially greater than the mass per unit area of said conductive foil.
Claim 41
Dependent Claim
134 words
An electronic metal printed circuit board structure including in combination: a carrier layer of electrically insulating plastic film having first and second sides; a heat dissipating metal plate providing the structural rigidity for said structure, said plate having a thickness substantially greater than the thickness of said plastic film; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding said first side of said plastic film to said heat dissipating metal plate, the combined thickness of said bonding means and said plastic film being less than twenty microns; and at least one electrical conductor bonded to said second side of said plastic film opposite said metal plate, the thickness of said plastic film and said bonding means permitting substantial heat transfer therethrough from said second side thereof to said metal plate.
Claim 42
Dependent Claim
134 words
An electronic metal printed circuit board structure including in combination: a carrier layer of electrically insulating plastic film having first and second sides; a heat dissipating metal plate providing the structural rigidity for said structure, said plate having a thickness substantially greater than the thickness of said plastic film; bonding means selected from the group consisting of polyetherimide, polysulphone and polyethersulphone bonding said first side of said plastic film to said heat dissipating metal plate, the combined thickness of said bonding means and said plastic film being less than twenty microns; and at least one electrical conductor bonded to said second side of said plastic film opposite said metal plate, the thickness of said plastic film and said bonding means permitting substantial heat transfer therethrough from said second side thereof to said metal plate.
Claim 43
Dependent Claim
17 words
The combination according to claim 39 further including semiconductor means mounted in electrical connection with said conductor.
Claim 44
Dependent Claim
24 words
The combination according to claim 40 wherein said semiconductor means is mounted in heat exchanging proximity through said plastic film to said metal plate.
Claim 45
Dependent Claim
37 words
The combination according to claim 41 further including encapsulation means encapsulating said plastic film, said metal plate, at least the portion of said conductor bonded to said plastic film, and said semiconductor means in a component housing.
Claim 46
Dependent Claim
24 words
The combination according to claim 40 wherein said semiconductor means is mounted in heat exchanging proximity through said plastic film to said metal plate.
Claim 47
Dependent Claim
35 words
The combination according to claim 39 further including encapsulation means for encapsulating said plastic film, said metal plate and, at least the portion of said conductor bonded to said plastic film, in a component housing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |