US4864722A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low dielectric printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1988-03-16
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Granted: 1989-09-12
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Expires: 2008-03-16
Abstract
Abstract The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.
Inventors
- 👤 Donald J. Lazzarini
- 👤 John P. Wiley
- 👤 Robert T. Wiley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 02:47
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/024; H05K3/00; H05K3/46; H05K3/4611; H05K3/4623; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2203/00; H05K2203/06; H05K2203/061; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
75 words
A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes having a dielectric constant of approximately less than 3.0 and vias disposed within each sub-assembly for providing electrical communication between said signal planes.
Claim 2
Dependent Claim
75 words
A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes having a dielectric constant of approximately less than 3.0 and vias disposed within each sub-assembly for providing electrical communication between said signal planes.
Claim 3
Dependent Claim
25 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric has a dielectric constant in a range approximately between 1.4 and 3.0.
Claim 4
Dependent Claim
15 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric comprises polytetrafluoroethylene.
Claim 5
Dependent Claim
20 words
The high performance printed circuit board assembly of claim 1, wherein each circuitized power plane sub-assembly is of modular construction.
Claim 6
Dependent Claim
24 words
The high performance printed circuit board assembly of claim 1, wherein said two sub-assemblies are adjacently laminated to each other by a bonding film.
Claim 7
Dependent Claim
25 words
The high performance printed circuit board assembly of claim 1, wherein said two sub-assemblies are adjacently laminated to each other by a brominated epoxy resin.
Claim 8
Dependent Claim
51 words
A high performance printed circuit board assembly, comprising at least two modular sub-assemblies adjacently laminated together, each of said modular sub-assemblies characterized by a signal plane disposed on opposite sides of two internal power planes that face each other and electrically communicating by means of vias formed within each respective sub-assembly.
Claim 9
Dependent Claim
51 words
A high performance printed circuit board assembly, comprising at least two modular sub-assemblies adjacently laminated together, each of said modular sub-assemblies characterized by a signal plane disposed on opposite sides of two internal power planes that face each other and electrically communicating by means of vias formed within each respective sub-assembly.
Claim 10
Dependent Claim
23 words
The high performance printed circuit board assembly of claim 7, wherein said two modular sub-assemblies are adjacently laminated together by a bonding film.
Claim 11
Dependent Claim
24 words
The high performance printed circuit board assembly of claim 7, wherein said two modular sub-assemblies are adjacently laminated together by a brominated epoxy resin.
Claim 12
Independent Claim
100 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies, each respective sub-assembly characterized by a signal plane disposed on opposite sides of two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes, and electrically communicating by means of plated vias where necessary; and (b) laminating at least two sub-assemblies together to form a composite; and (c) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 13
Independent Claim
100 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies, each respective sub-assembly characterized by a signal plane disposed on opposite sides of two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes, and electrically communicating by means of plated vias where necessary; and (b) laminating at least two sub-assemblies together to form a composite; and (c) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 14
Dependent Claim
35 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, further comprising the step of: (d) testing each respective sub-assembly for electrical integrity prior to the laminating step (b).
Claim 15
Dependent Claim
101 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) circuitizing with a power distribution pattern one side of a first core comprising a sheet of an electrical conductor disposed on either side of a dielectric layer; (ii) circuitizing a second core similar to step (i); (iii) laminating said first and second cores together with said power distribution patterns facing each other to form a sub-assembly; and (iv) circuitizing said sub-assembly to provide a signal plane on either side thereof.
Claim 16
Dependent Claim
30 words
The method of constructing a high performance printed circuit board assembly, in accordance with claim 12, further comprising the step of: (v) fabricating plated vias in said sub-assembly where necessary.
Claim 17
Dependent Claim
28 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 13, further comprising the step of: (vi) testing said sub-assembly for electrical integrity.
Claim 18
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 12, wherein the laminating of the first and second cores together in step (iii) includes the use of a bonding film.
Claim 19
Dependent Claim
37 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 12, wherein the laminating of the first and second cores together in step (iii) includes the use of a brominated epoxy resin.
Claim 20
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the laminating step (b) comprises the use of a bonding film for laminating said sub-assemblies.
Claim 21
Dependent Claim
33 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the laminating step (b) comprises the use of a brominated epoxy resin for laminating said sub-assemblies.
Claim 22
Independent Claim
106 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about two internal power planes facing each other and separated therefrom by means of a dielectric layer having a dielectric constant of less than 3.0; (b) repeating step (a) to form a number of sub-assemblies the same or similar to said first circuitized power core sub-assembly; (c) laminating at least two sub-assemblies together to form a composite; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 23
Independent Claim
106 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about two internal power planes facing each other and separated therefrom by means of a dielectric layer having a dielectric constant of less than 3.0; (b) repeating step (a) to form a number of sub-assemblies the same or similar to said first circuitized power core sub-assembly; (c) laminating at least two sub-assemblies together to form a composite; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 24
Dependent Claim
35 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, further comprising the step of: (e) testing each respective sub-assembly for electrical integrity prior to the laminating step (c).
Claim 25
Dependent Claim
102 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) circuitizing with a power distribution pattern one side of a first core comprising a sheet of an electrical conductor disposed on either side of a dielectric layer; (ii) circuitizing a second core in accordance with step (i); (iii) laminating said first and second cores together with said power distribution patterns facing each other to form a sub-assembly; and (iv) circuitizing said sub-assembly to provide a signal plane on either side thereof.
Claim 26
Dependent Claim
30 words
The method of constructing a high performance printed circuit board assembly, in accordance with claim 21, further comprising the step of: (v) fabricating plated vias in said sub-assembly where necessary.
Claim 27
Dependent Claim
28 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 22, further comprising the step of: (vi) testing said sub-assembly for electrical integrity.
Claim 28
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein said dielectric layer has a dielectric constant in a range approximately between 1.4 and 3.0.
Claim 29
Dependent Claim
22 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 24, wherein said dielectric layer comprises polytetrafluoroethylene.
Claim 30
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 21, wherein the laminating of the first and second cores together in step (iii) includes the use of a bonding film.
Claim 31
Dependent Claim
37 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 21, wherein the laminating of the first and second cores together in step (iii) includes the use of a brominated epoxy resin.
Claim 32
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the laminating step (c) comprises the use of a bonding film for laminating said sub-assemblies.
Claim 33
Dependent Claim
33 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the laminating step (c) comprises the use of a brominated epoxy resin for laminating said sub-assemblies.
References Cited (Backward Citations)
US3305416A
Cited
US3795047A
Cited
US3972755A
Cited
US4299873A
Cited
US4526835A
Cited
US4591659A
Cited
US4640866A
Cited
US4644093A
Cited
US4675789A
Cited
US4747897A
Cited
US4710854A
Cited
US4661301A
Cited
US4755783A
Cited
US4755911A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-09-11 | 1993-03-13 | 1993-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-11 | 1997-03-13 | 1997-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-09-11 | 2001-03-13 | 2001-09-12 | $7700.00 | Window Closed / Lapsed |