Patent US4864722A successfully refreshed from Google Patents.
US4864722A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low dielectric printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1988-03-16
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Granted: 1989-09-12
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Expires: 2008-03-16
Abstract
Abstract The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.
Inventors
- 👤 Donald J. Lazzarini
- 👤 John P. Wiley
- 👤 Robert T. Wiley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 06:49
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/024; H05K3/00; H05K3/46; H05K3/4611; H05K3/4623; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2203/00; H05K2203/06; H05K2203/061; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
75 words
A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes having a dielectric constant of approximately less than 3.0 and vias disposed within each sub-assembly for providing electrical communication between said signal planes.
Claim 2
Dependent Claim
75 words
A high performance printed circuit board assembly comprising at least two circuitized power plane sub-assemblies adjacently laminated to each other wherein each of said sub-assemblies is characterized by signal planes disposed about two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes having a dielectric constant of approximately less than 3.0 and vias disposed within each sub-assembly for providing electrical communication between said signal planes.
Claim 3
Dependent Claim
25 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric has a dielectric constant in a range approximately between 1.4 and 3.0.
Claim 4
Dependent Claim
15 words
The high performance printed circuit board assembly of claim 1, wherein said dielectric comprises polytetrafluoroethylene.
Claim 5
Dependent Claim
20 words
The high performance printed circuit board assembly of claim 1, wherein each circuitized power plane sub-assembly is of modular construction.
Claim 6
Dependent Claim
24 words
The high performance printed circuit board assembly of claim 1, wherein said two sub-assemblies are adjacently laminated to each other by a bonding film.
Claim 7
Dependent Claim
25 words
The high performance printed circuit board assembly of claim 1, wherein said two sub-assemblies are adjacently laminated to each other by a brominated epoxy resin.
Claim 8
Dependent Claim
51 words
A high performance printed circuit board assembly, comprising at least two modular sub-assemblies adjacently laminated together, each of said modular sub-assemblies characterized by a signal plane disposed on opposite sides of two internal power planes that face each other and electrically communicating by means of vias formed within each respective sub-assembly.
Claim 9
Dependent Claim
51 words
A high performance printed circuit board assembly, comprising at least two modular sub-assemblies adjacently laminated together, each of said modular sub-assemblies characterized by a signal plane disposed on opposite sides of two internal power planes that face each other and electrically communicating by means of vias formed within each respective sub-assembly.
Claim 10
Dependent Claim
23 words
The high performance printed circuit board assembly of claim 7, wherein said two modular sub-assemblies are adjacently laminated together by a bonding film.
Claim 11
Dependent Claim
24 words
The high performance printed circuit board assembly of claim 7, wherein said two modular sub-assemblies are adjacently laminated together by a brominated epoxy resin.
Claim 12
Independent Claim
100 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies, each respective sub-assembly characterized by a signal plane disposed on opposite sides of two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes, and electrically communicating by means of plated vias where necessary; and (b) laminating at least two sub-assemblies together to form a composite; and (c) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 13
Independent Claim
100 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies, each respective sub-assembly characterized by a signal plane disposed on opposite sides of two internal power planes facing each other, each of said sub-assemblies having a dielectric between said signal and power planes, and electrically communicating by means of plated vias where necessary; and (b) laminating at least two sub-assemblies together to form a composite; and (c) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 14
Dependent Claim
35 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, further comprising the step of: (d) testing each respective sub-assembly for electrical integrity prior to the laminating step (b).
Claim 15
Dependent Claim
101 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) circuitizing with a power distribution pattern one side of a first core comprising a sheet of an electrical conductor disposed on either side of a dielectric layer; (ii) circuitizing a second core similar to step (i); (iii) laminating said first and second cores together with said power distribution patterns facing each other to form a sub-assembly; and (iv) circuitizing said sub-assembly to provide a signal plane on either side thereof.
Claim 16
Dependent Claim
30 words
The method of constructing a high performance printed circuit board assembly, in accordance with claim 12, further comprising the step of: (v) fabricating plated vias in said sub-assembly where necessary.
Claim 17
Dependent Claim
28 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 13, further comprising the step of: (vi) testing said sub-assembly for electrical integrity.
Claim 18
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 12, wherein the laminating of the first and second cores together in step (iii) includes the use of a bonding film.
Claim 19
Dependent Claim
37 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 12, wherein the laminating of the first and second cores together in step (iii) includes the use of a brominated epoxy resin.
Claim 20
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the laminating step (b) comprises the use of a bonding film for laminating said sub-assemblies.
Claim 21
Dependent Claim
33 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 10, wherein the laminating step (b) comprises the use of a brominated epoxy resin for laminating said sub-assemblies.
Claim 22
Independent Claim
106 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about two internal power planes facing each other and separated therefrom by means of a dielectric layer having a dielectric constant of less than 3.0; (b) repeating step (a) to form a number of sub-assemblies the same or similar to said first circuitized power core sub-assembly; (c) laminating at least two sub-assemblies together to form a composite; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 23
Independent Claim
106 words
A method of constructing a high performance printed circuit board assembly utilizing a modular construction technique, comprising the steps of: (a) fabricating a first circuitized power core sub-assembly having X-Y signal planes disposed about two internal power planes facing each other and separated therefrom by means of a dielectric layer having a dielectric constant of less than 3.0; (b) repeating step (a) to form a number of sub-assemblies the same or similar to said first circuitized power core sub-assembly; (c) laminating at least two sub-assemblies together to form a composite; and (d) constructing a printed circuit board assembly by building a multi-laminate structure using said composite.
Claim 24
Dependent Claim
35 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, further comprising the step of: (e) testing each respective sub-assembly for electrical integrity prior to the laminating step (c).
Claim 25
Dependent Claim
102 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) circuitizing with a power distribution pattern one side of a first core comprising a sheet of an electrical conductor disposed on either side of a dielectric layer; (ii) circuitizing a second core in accordance with step (i); (iii) laminating said first and second cores together with said power distribution patterns facing each other to form a sub-assembly; and (iv) circuitizing said sub-assembly to provide a signal plane on either side thereof.
Claim 26
Dependent Claim
30 words
The method of constructing a high performance printed circuit board assembly, in accordance with claim 21, further comprising the step of: (v) fabricating plated vias in said sub-assembly where necessary.
Claim 27
Dependent Claim
28 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 22, further comprising the step of: (vi) testing said sub-assembly for electrical integrity.
Claim 28
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein said dielectric layer has a dielectric constant in a range approximately between 1.4 and 3.0.
Claim 29
Dependent Claim
22 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 24, wherein said dielectric layer comprises polytetrafluoroethylene.
Claim 30
Dependent Claim
36 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 21, wherein the laminating of the first and second cores together in step (iii) includes the use of a bonding film.
Claim 31
Dependent Claim
37 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 21, wherein the laminating of the first and second cores together in step (iii) includes the use of a brominated epoxy resin.
Claim 32
Dependent Claim
32 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the laminating step (c) comprises the use of a bonding film for laminating said sub-assemblies.
Claim 33
Dependent Claim
33 words
The method of constructing a high performance printed circuit board assembly in accordance with claim 19, wherein the laminating step (c) comprises the use of a brominated epoxy resin for laminating said sub-assemblies.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-09-11 | 1993-03-13 | 1993-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-11 | 1997-03-13 | 1997-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-09-11 | 2001-03-13 | 2001-09-12 | $7700.00 | Window Closed / Lapsed |