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US4865684A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for producing a semiconductor laser mirror by ionic machining

Assignee: Individual
•
Filing: 1988-02-12
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Granted: 1989-09-12
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Expires: 2008-02-12
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Abstract

Abstract A semiconductor (10) is subject to ionic etching (14) through a mask, whereof one side determines the location of the mirror. This mask is constituted by a crystalline layer (12), whereof the side (16) is a crystallographic plane.

Inventors

  • 👤 Noureddine Bouadma

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 15:17
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/028

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 80 words
Process for producing a semiconductor laser mirror in a planar semiconductor structure, comprising the steps of: forming a single crystalline layer by epitaxy on said semiconductor structure, said single crystalline layer having crystallographic planes; chemically etching said single crystalline layer along a crystallographic plane perpendicular to the plane of the semiconductor structure; carrying out an ionic etching of said semiconductor structure in a direction inclined with respect to said crystallographic plane through said single crystalline layer acting as a mask.
Claim 2
Dependent Claim 80 words
Process for producing a semiconductor laser mirror in a planar semiconductor structure, comprising the steps of: forming a single crystalline layer by epitaxy on said semiconductor structure, said single crystalline layer having crystallographic planes; chemically etching said single crystalline layer along a crystallographic plane perpendicular to the plane of the semiconductor structure; carrying out an ionic etching of said semiconductor structure in a direction inclined with respect to said crystallographic plane through said single crystalline layer acting as a mask.
Claim 3
Dependent Claim 84 words
Process for producing a semiconductor laser mirror in a planar semiconductor structure, comprising the steps of: forming a strip of a single crystalline material, said strip having at least one cleaved face which is a crystallographic plane; bonding said strip to the semiconductor structure so that said crystallographic plane is perpendicular to the plane of the semiconductor structure; carrying out an ionic etching of said semiconductor structure in a direction inclined with respect to said crystallographic plane through said strip acting as a mask.
Claim 4
Dependent Claim 84 words
Process for producing a semiconductor laser mirror in a planar semiconductor structure, comprising the steps of: forming a strip of a single crystalline material, said strip having at least one cleaved face which is a crystallographic plane; bonding said strip to the semiconductor structure so that said crystallographic plane is perpendicular to the plane of the semiconductor structure; carrying out an ionic etching of said semiconductor structure in a direction inclined with respect to said crystallographic plane through said strip acting as a mask.

References Cited (Backward Citations)

US4248688A Cited
US4354898A Cited
EP0073548A1 Cited
DE3138704A1 Cited
US4547956A Cited
US4397711A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-09-11 1993-03-13 1993-09-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-09-11 1997-03-13 1997-09-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-09-11 2001-03-13 2001-09-12 $7700.00 Window Closed / Lapsed

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