US4892776A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board material and electroplating bath for the production thereof
Assignee: OHMEGA ELECTRONICS Inc 4031 ELENDA STREET CULVER CITY CALIFORNIA 90230 A CORP OF
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Filing: 1987-09-02
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Granted: 1990-01-09
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Expires: 2007-09-02
Abstract
Abstract An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
Inventors
- 👤 James H. Rice
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:23
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/562; C23; C23F; C23F1/00; C23F1/02; H; H01; H01C; H01C17/00; H01C17/06; H01C17/075; H01C17/14; H01C17/16; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K3/00; H05K3/02; H05K3/06; H05K3/067; H05K3/38; H05K3/382; H05K3/384; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/0392; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/12; H05K2203/122; H05K2203/124; Y; Y10; Y10S; Y10S205/00; Y10S205/92; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12778; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
76 words
A circuit board material comprising: a support layer; at least one electrical resistance layer adhered to the support layer, the resistance layer having a nickel phosphorous composition; and a conductive layer adhered to the resistance material layer, the conductive layer having an activating agent applied thereto before the resistance layer is eeposited onto the conductive layer, wherein the resistance layer of the circuit board material has an electrical resistance of at least 500 ohms per square.
Claim 2
Dependent Claim
76 words
A circuit board material comprising: a support layer; at least one electrical resistance layer adhered to the support layer, the resistance layer having a nickel phosphorous composition; and a conductive layer adhered to the resistance material layer, the conductive layer having an activating agent applied thereto before the resistance layer is eeposited onto the conductive layer, wherein the resistance layer of the circuit board material has an electrical resistance of at least 500 ohms per square.
Claim 3
Dependent Claim
27 words
The circuit board material of claim 1 wherein the resistance layer of the circuit board material has an electrical resistance of at least 1000 ohms per square.
Claim 4
Dependent Claim
90 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one electrical resistance layer adhering to the support layer; and a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer, the electrical resistance layer comprising a nickel-phosphorous composition electro-deposited in a bath having at least 0.25M nickel hypophosphite, wherein the electrical resistance layer and the conductive layer are both removable by a single copper etchant.
Claim 5
Dependent Claim
90 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one electrical resistance layer adhering to the support layer; and a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer, the electrical resistance layer comprising a nickel-phosphorous composition electro-deposited in a bath having at least 0.25M nickel hypophosphite, wherein the electrical resistance layer and the conductive layer are both removable by a single copper etchant.
Claim 6
Dependent Claim
15 words
The printed circuit board material of claim 3 wherein the conductive layer comprises copper metal.
Claim 7
Dependent Claim
25 words
The printed circuit board material of claim 3 wherein the electrical resistance layer comprises from about 10 to about 50 percent by weight of phosphorous.
Claim 8
Dependent Claim
29 words
The printed circuit board material of claim 3 wherein the copper etchant is selected from the group consisting of ferric chloride, cupric chloride, sulfuric-peroxide, persulfates, and ammoniacal alkaline etchants.
Claim 9
Dependent Claim
15 words
The printed circuit board material of claim 6 wherein the copper etchant is chromic acid.
Claim 10
Dependent Claim
24 words
The circuit board material of claim 1 wherein the electrical resistance layer comprises from about 0 to about 50 percent by weight of phosphorous.
Claim 11
Dependent Claim
23 words
The circuit board material of claim 1 wherein the electrical resistance layer comprises from about 30 to about percent by weight of phosphorous.
Claim 12
Dependent Claim
15 words
The printed circuit board material of claim 3 wherein the copper etchant is cupric chloride.
Claim 13
Dependent Claim
25 words
The circuit board material of claim 1 wherein the activating agent is selected from the group consisting of benzotriazole, tolyltriazole, mercaptobenzothiazole, chromates and mixtures thereof.
Claim 14
Dependent Claim
25 words
The circuit board material of claim 3 wherein the activating agent is selected from the group consisting of benzotriazole, tolyltriazole, mercaptobenzothiazole, chromates and mixtures thereof.
Claim 15
Dependent Claim
14 words
The circuit board material according to claim 11 wherein the activating agent is benzotriazole.
Claim 16
Dependent Claim
13 words
The circuit board material of claim 3 wherein the activating agent is banzotriazole.
Claim 17
Dependent Claim
40 words
The circuit board material of claim 3 wherein the activating agent activates the surface of the conductive layer such that an electrical resistance layer having a resistance of greater than about 500 ohms per square deposits on said conductive layer.
Claim 18
Dependent Claim
88 words
A circuit board material comprising: a support layer; at least one electrical resistance layer adhered to the support layer, the resistance layer having a nickel phosphorous composition, the composition including from about 10 to about 50 percent by weight of phosphorous; and a conductive layer adhered to the resistance material layer, the conductive layer having benzotriazole applied thereto before the resistance layer is deposited onto the conductive layer, wherein the resistance layer of the circuit board material has an electrical resistance of at least 500 ohms per square.
Claim 19
Dependent Claim
88 words
A circuit board material comprising: a support layer; at least one electrical resistance layer adhered to the support layer, the resistance layer having a nickel phosphorous composition, the composition including from about 10 to about 50 percent by weight of phosphorous; and a conductive layer adhered to the resistance material layer, the conductive layer having benzotriazole applied thereto before the resistance layer is deposited onto the conductive layer, wherein the resistance layer of the circuit board material has an electrical resistance of at least 500 ohms per square.
Claim 20
Dependent Claim
93 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one electrical resistance layer adhering to the support layer, the electrical resistance layer comprising a nickel phosphorous composition, including from about 10 to about 50 percent phosphorous; and a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer, wherein the nickel phosphorous composition is electro-deposited on the conductive layer in a bath having at least 0.25M nickel hypophosphite.
Claim 21
Dependent Claim
93 words
A printed circuit board material in the form of a multilayer stock comprising: a support layer; at least one electrical resistance layer adhering to the support layer, the electrical resistance layer comprising a nickel phosphorous composition, including from about 10 to about 50 percent phosphorous; and a conductive layer adhering to the resistance layer, the conductive layer having an activating agent applied thereto before the resistance layer is deposited onto the conductive layer, wherein the nickel phosphorous composition is electro-deposited on the conductive layer in a bath having at least 0.25M nickel hypophosphite.
Claim 22
Dependent Claim
14 words
The circuit board material of claim 1 wherein the activating agent is an azole.
Claim 23
Dependent Claim
14 words
The circuit board material of claim 3 wherein the activating agent is an azole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-08 | 1993-07-10 | 1994-01-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-08 | 1997-07-10 | 1998-01-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-08 | 2001-07-10 | 2002-01-09 | $7700.00 | Window Closed / Lapsed |