Patent US4906953A successfully refreshed from Google Patents.
US4906953A
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Broadband microstrip to coplanar waveguide transition by anisotropic etching of gallium arsenide
Assignee: Varian Medical Systems Inc
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Filing: 1988-09-08
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Granted: 1990-03-06
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Expires: 2008-09-08
Abstract
Abstract A broadband interconnection between a microstrip and a coplanar waveguide is provided without use of via holes by using anisotropic etching to form a sloped surface between connection points. The sloped surface is then metallized to provide the interconnection.
Inventors
- 👤 Chia-Geng Li
- 👤 Steve G. Bandy
- 👤 Majid Riaziat
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:18
CPC Classifications
H; H01; H01P; H01P11/00; H01P5/00; H01P5/08
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
155 words
A broadband interconnection device used for interconnection between a microstrip and a coplanar waveguide, comprising: a monolithic semiconductor wafer having a coplanar waveguide defined at a first edge on an upper surface, said coplanar waveguide including a conductor and a pair of ground planes, a conductor of a microstrip defined on an opposite edge of said top surface, and a ground plane of said microstrip on a bottom surface, said conductor of said coplanar waveguide being electrically connected to said conductor of said microstrip; a pair of sloped surfaces in said monolithic semiconductor wafer, said surfaces sloping from said pair of ground planes of said coplanar waveguide on said upper surface to said ground plane of said microstrip on said bottom surface, said pair of sloped surfaces being metalized with high conductivity metal, said high conductivity metal being in contact with said ground plane of said microstrip and said ground planes of said coplanar waveguide.
Claim 2
Dependent Claim
155 words
A broadband interconnection device used for interconnection between a microstrip and a coplanar waveguide, comprising: a monolithic semiconductor wafer having a coplanar waveguide defined at a first edge on an upper surface, said coplanar waveguide including a conductor and a pair of ground planes, a conductor of a microstrip defined on an opposite edge of said top surface, and a ground plane of said microstrip on a bottom surface, said conductor of said coplanar waveguide being electrically connected to said conductor of said microstrip; a pair of sloped surfaces in said monolithic semiconductor wafer, said surfaces sloping from said pair of ground planes of said coplanar waveguide on said upper surface to said ground plane of said microstrip on said bottom surface, said pair of sloped surfaces being metalized with high conductivity metal, said high conductivity metal being in contact with said ground plane of said microstrip and said ground planes of said coplanar waveguide.
Claim 3
Dependent Claim
14 words
The device of claim 1 wherein said sloped surface is formed by anisotropic etching.
Claim 4
Dependent Claim
28 words
The device of claim 1 wherein said sloped surface subtends an angle of no less than forty degrees and no more than seventy degrees with said ground planes.
References Cited (Backward Citations)
US4543544A
Cited
US4806892A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-05 | 1993-09-04 | 1994-03-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-05 | 1997-09-04 | 1998-03-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-05 | 2001-09-04 | 2002-03-06 | $7700.00 | Window Closed / Lapsed |