High-density package

Claim 2

A chip carrier comprising: a chip carrier body having a cavity therein, and a lower mounting space, on the bottom of said cavity, for mounting at least one integrated circuit chip; at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity; at least one heat plate mounted above said lower mounting space within said cavity; said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon; at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface; a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate; wherein said heat plate comprises openings to expose plural ones of said contact pads on said bonding ledges.

Claim 3

The chip carrier of claim 1, wherein said heat plate has openings therein to expose all of said contact pads and at least one of said bonding ledges.

Claim 4

The chip carrier of claim 1, wherein said leads from said chips mounted on said heat plate comprise conductive traces supported at least partially by a polymer strip which extends across multiple anse of said conductive traces.

Claim 5

The chip carrier of claim 1, wherein said chip carrier body comprises a multilayer cofired ceramic body.

Claim 6

The chip carrier of claim 1, wherein a first and second heat plate are enclosed in said cavity, said second heat plate lying above said first heat plate, and wherein said chip carrier body includes at least first and second bonding ledges, said second bonding ledge being higher than said first bonding ledge. and said second heat plate being attached with low thermal resistance to said second bonding ledge.

Claim 7

The chip carrier of claim 1, wherein said heat plate comprises a metal which has a thermal coefficient of expansion within 20% of that of alumina.

Claim 8

The chip carrier of claim 1, wherein said second mounting surface on said heat plate is substantially planar.

Claim 9

The chip carrier of claim 1, wherein said second mounting surface on said heat plate includes more than one substantially planar portion, said respective planar portions having different heights, whereby said chips mounted on said heat plate are not all of the same height.

Claim 10

The chip carrier of claim 8, wherein said chips mounted on the most protrusive portions of said mounting surface of said heat plate are connected to a first set of parallel leads supported in a flexible polymer strip, and at least some of said chips which are not mounted on said most protruding portion of said heat plate are connected to leads supported by a second flexible polymer strip, wherein said first polymer strip at least partially overlies said second polymer strip.

Claim 11

The chip carrier of claim 1, wherein the average heat dissipation of the chips mounted on said first mounting surface is higher than the average heat dissipation of the chips mounted on said second mounting surface.

Claim 12

The chip carrier of claim 1, wherein the total heat dissipation of all of the chips mounted on said first mounting surface of said chip carrier body is more than twice the total heat dissipation of all of the chips mounted on said second mounting surface on said heat plate.

Claim 13

The chip carrier of claim 1, wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges by discrete bonding wires, and wherein said second mounting surface on said heat plate faces away from said first mounting surface on said chip carrier body.

Claim 14

The chip carrier of claim 1, wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges through leads supported on a flexible polymer strip, and wherein said chips are mounted on the face of said heat plate which faces toward said first mounting surface.

Claim 15

The chip carrier of claim 1, wherein a low thermal resistance theremal contact makes a low resistance thermal contact between said heat plate and said lid.

Claim 16

The chip carrier of claim 15, wherein said thermal contact comprises a very soft metal.

Claim 17

A circuit board assembly comprising: a board substrate; a plurality of chip carrier packages affixed to said substrate; and a plurality of traces interconnecting said chip carrier packages to configure a desired macroscopic circuit configuration; wherein at least some of said chip carriers comprise: (a) a chip carrier body having a cavity therein, and a lower mounting space on the bottom of said cavity, for mounting at least one integrated circuit chip; (b) at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity; (c) at least one heat plate mounted above said lower mounting space within said cavity; (d) said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon said heat plate comprising openings which expose plural ones of said contact pads on said bonding ledges; (e) at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface; (f) a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and (g) a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate.

Claim 18

A circuit board assembly comprising: a board substrate; a plurality of chip carrier packages affixed to said substrate; and a plurality of traces interconnecting said chip carrier packages to configure a desired macroscopic circuit configuration; wherein at least some of said chip carriers comprise: (a) a chip carrier body having a cavity therein, and a lower mounting space on the bottom of said cavity, for mounting at least one integrated circuit chip; (b) at least one bonding ledge having contact pads thereon in proximity to said mounting space inside said cavity; (c) at least one heat plate mounted above said lower mounting space within said cavity; (d) said heat plate being attached with low thermal resistance to said body of said chip carrier, said heat plate having a second mounting surface thereon for mounting at least one integrated circuit chip thereon said heat plate comprising openings which expose plural ones of said contact pads on said bonding ledges; (e) at least one integrated circuit chip mounted on said lower mounting space, and at least one integrated circuit chip mounted on said second mounting surface; (f) a plurality of connecting leads linking contact pads on said integrated circuits to selected contact pads on said bonding ledges; and (g) a lid hermetically sealed to said body of said chip cavity, said lid and said chip cavity enclosing therebetween said lower mounting space, said heat plate, and said chips mounted to said space and said heat plate.

Claim 19

The chip carrier of claim 1, wherein said heat plate is attached to said bonding ledge, and said contact pads on said bonding ledge are positioned within said openings of said heat plate.

Claim 20

The chip carrier of claim 1, wherein said openings in heat plate are indentations around the periphery of said heat plate.

Claim 21

The chip carrier of 17, wherein said openings in heat plate are indentations around the periphery of said heat plate.

Claim 22

The chip carrier of 17, wherein said openings in heat plate are indentations around the periphery of said heat plate.

Claim 23

The board assembly of claim 16, wherein said heat plate has openings therein to expose all of said contact pads and at least one of said bonding ledges.

Claim 24

The board assembly of claim 16, wherein said leads from said chips mounted on said heat plate comprise conductive traces supported at least partially by a polymer strip which extends across multiple ones of said conductive traces.

Claim 25

The board assembly of claim 16, wherein said chip carrier body comprises a multilayer co-fired ceramic body.

Claim 26

The board assembly of claim 16, wherein a first and second heat plate are enclosed in said cavity, said second heat plate lying above said first heat plate, and wherein said chip carrier body includes at least first and second bonding ledges, said second bonding ledge being higher than said first bonding ledge, and said second heat plate is attached with low thermal resistance to said second bonding ledge.

Claim 27

The board assembly of claim 16, wherein said heat plate comprises a metal which has a thermal coefficient of expansion within 20% of that of alumina.

Claim 28

The board assembly of claim 16, wherein said second mounting surface on said heat plate is substantially planar.

Claim 29

The board assembly of claim 16, wherein said second mounting surface on said heat plate includes more than one substantially planar portion, said respective planar portions having different heights, whereby said chips mounted on said heat plate are not all of the same height.

Claim 30

The board assembly of claim 26, wherein said chips mounted on the most protrusive portions of said mounting surface of said heat plate are connected to a first set of parallel leads supported in a flexible polymer strip, and at least some of said chips which are not mounted on said most protruding portion of said heat plate are connected to leads supported by a second flexible polymer strip, wherein said first polymer strip at least partially overlies said second polymer strip.

Claim 31

The board assembly of claim 16, wherein the average heat dissipation of the chips mounted on said first mounting surface is higher than the average heat dissipation of the chips mounted on said second mounting surface.

Claim 32

The board assembly of claim 16, wherein the total heat dissipation of all of the chips mounted on said first mounting surface of said chip carrier body is more than twice the total heat dissipation of all of the chips mounted on said second mounting surface on said heat plate.

Claim 33

The board assembly of claim 16, wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges by discrete bonding wires, and wherein said second mounting surface on said heat plate faces away from said first mounting surface on said chip carrier body.

Claim 34

The board assembly of claim 16, wherein said chips mounted on said heat plate are connected to said contact pads on said bonding ledges through leads supported on a flexible polymer strip, and wherein said chips are mounted on the face of said heat plate which faces toward said first mounting surface.

Claim 35

The board assembly of claim 16, wherein a low thermal resistance thermal contact material makes thermal contact between said heat plate and said lid.

Claim 36

The board assembly of claim 32, wherein said thermal contact material comprises a very soft metal.

Claim 37

The board assembly of claim 16, wherein said heat plate is attached to said bonding ledge, and said contact pads on said bonding ledge are positioned within said openings of said heat plate.

Claim 38

The board assembly of claim 16, wherein said openings in heat plate are indentations around the periphery of said heat plate.

Claim 39

The board assembly of claim 34, wherein said openings in heat plate are in dentations around the periphery of said heat plate.