Patent US4615684A successfully refreshed from Google Patents.
US4952286A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroplating process
Assignee: Shipley Co Inc
•
Filing: 1988-02-08
•
Granted: 1990-08-28
•
Expires: 2008-02-08
Abstract
Abstract A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.
Inventors
- 👤 John J. Bladon
- 👤 John N. Robinson
- 👤 Michael Rousseau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 03:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/188; C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K3/425; H05K3/427; Y; Y10; Y10S; Y10S205/00; Y10S205/92
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
131 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a reduced noble metal electroless metal plating catalyst to form a deposit of said reduced noble metal electroless metal plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said electroless metal plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 2
Independent Claim
131 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a reduced noble metal electroless metal plating catalyst to form a deposit of said reduced noble metal electroless metal plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said electroless metal plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 3
Dependent Claim
28 words
The method of claim 1 where the solution containing the dissolved chalcogen is a solution of a member selected from the group consisting of sulfur, selenium and tellurium.
Claim 4
Dependent Claim
12 words
The method of claim 2 where the solution is a sulfur solution.
Claim 5
Dependent Claim
22 words
The method of claim 3 where the solution containing the dissolved chalcogen is a solution of an aqueous soluble metal sulfide salt.
Claim 6
Dependent Claim
30 words
The method of claim 4 where the solution is of an alkali or alkaline earth metal sulfide in a concentration of from 0.001 to 15 grams per liter of solution.
Claim 7
Dependent Claim
16 words
The method of claim 5 where the concentration varies between 0.001 and 2.0 grams per liter.
Claim 8
Dependent Claim
12 words
The method of claim 3 where the article is plated with copper.
Claim 9
Independent Claim
125 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a tin palladium electroless plating catalyst to form a deposit of said tin palladium electroless plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 10
Independent Claim
125 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a tin palladium electroless plating catalyst to form a deposit of said tin palladium electroless plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 11
Dependent Claim
28 words
The method of claim 8 where the solution containing the dissolved chalcogen is a solution of a member selected from the group consisting of sulfur, selenium and tellurium.
Claim 12
Dependent Claim
17 words
The method of claim 8 where the solution of the dissolved chalcogen is a solution of sulfur.
References Cited (Backward Citations)
US844304A
Cited
US3011920A
Cited
US3099608A
Cited
US3658661A
Cited
US3533918A
Cited
US3874882A
Cited
US3993491A
Cited
US3993799A
Cited
US4166012A
Cited
US4683036A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-27 | 1994-02-26 | 1994-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-27 | 1998-02-26 | 1998-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-27 | 2002-02-26 | 2002-08-28 | $7700.00 | Window Closed / Lapsed |