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US4952286A Expired / Lapsed US ⏱️ 0.0 years remaining

Electroplating process

Assignee: Shipley Co Inc
•
Filing: 1988-02-08
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Granted: 1990-08-28
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Expires: 2008-02-08
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Abstract

Abstract A method for metal plating the surface of a nonconducting article. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating. The metal chalcogenide is of a metal that would be catalytic to electroless metal deposition.

Inventors

  • 👤 John J. Bladon
  • 👤 John N. Robinson
  • 👤 Michael Rousseau

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 05:05
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/188; C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K3/425; H05K3/427; Y; Y10; Y10S; Y10S205/00; Y10S205/92

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 131 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a reduced noble metal electroless metal plating catalyst to form a deposit of said reduced noble metal electroless metal plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said electroless metal plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 2
Independent Claim 131 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a reduced noble metal electroless metal plating catalyst to form a deposit of said reduced noble metal electroless metal plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said electroless metal plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 3
Dependent Claim 28 words
The method of claim 1 where the solution containing the dissolved chalcogen is a solution of a member selected from the group consisting of sulfur, selenium and tellurium.
Claim 4
Dependent Claim 12 words
The method of claim 2 where the solution is a sulfur solution.
Claim 5
Dependent Claim 22 words
The method of claim 3 where the solution containing the dissolved chalcogen is a solution of an aqueous soluble metal sulfide salt.
Claim 6
Dependent Claim 30 words
The method of claim 4 where the solution is of an alkali or alkaline earth metal sulfide in a concentration of from 0.001 to 15 grams per liter of solution.
Claim 7
Dependent Claim 16 words
The method of claim 5 where the concentration varies between 0.001 and 2.0 grams per liter.
Claim 8
Dependent Claim 12 words
The method of claim 3 where the article is plated with copper.
Claim 9
Independent Claim 125 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a tin palladium electroless plating catalyst to form a deposit of said tin palladium electroless plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 10
Independent Claim 125 words
A method for electroplating a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an acid solution of a tin palladium electroless plating catalyst to form a deposit of said tin palladium electroless plating catalyst on at least a portion of said surface; b. treating the surface of the nonconductor with a solution containing a dissolved chalcogen capable of reacting with the electroless metal plating catalyst to form a chalcogenide of said plating catalyst as a coating on at least said portion of said surface; and c. metal plating the surface of the nonconductor by passing a current between electrodes immersed in an electrolyte containing dissolved plating metal where one of said electrodes comprises said nonconductor to be plated.
Claim 11
Dependent Claim 28 words
The method of claim 8 where the solution containing the dissolved chalcogen is a solution of a member selected from the group consisting of sulfur, selenium and tellurium.
Claim 12
Dependent Claim 17 words
The method of claim 8 where the solution of the dissolved chalcogen is a solution of sulfur.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-08-27 1994-02-26 1994-08-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-08-27 1998-02-26 1998-08-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-08-27 2002-02-26 2002-08-28 $7700.00 Window Closed / Lapsed

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