Apparatus and process for the production of micro-pore free high ductility metal foil

Claim 2

An essentially micro-pore free and inclusion free electrodeposited copper foil characterized by having no more than one micro-pore having an area greater than or equal to about 5×10 -8 mm 2 present in an area of 1×10 -5 mm 2 when observed at a magnification of at least 6000x.

Claim 3

The essentially micro-pore free and inclusion free electrodeposited metal foil of claim 1 wherein said foil has a biaxial stress resistance as measured by the bulge pressure required to burst the foil in excess of about 50 psi at temperatures of less than about 550° F.

Claim 4

The essentially micro-pore free and inclusion free electrodeposited metal foil of claim 2 wherein the bulge pressure required to burst the foil is in excess of about 70 psi at temperatures of less than about 350° F.

Claim 5

The essentially micro-pore free and inclusion free electrodeposited metal foil of claim 1 wherein said foil has a ductility characterized by an elongation of greater than 10% at a temperature of 75° F. for one ounce copper foil.

Claim 6

The essentially micro-pore free and inclusion free electrodeposited metal foil of claim 1 wherein said metal foil is one half ounce copper foil requiring a bulge pressure in excess of 60 psi to burst said foil at temperatures of less than 550° F.

Claim 7

The essentially micro-pore free and inclusion free electrodeposited copper foil of claim 1 wherein the thickness of said foil is from about 0.0005 inches to about 0.015 inches.

Claim 8

The essentially micro-pore free and inclusion free electrodeposited copper foil of claim 1 wherein the thickness of said foil is from about 0.0005 inch to about 0.003 inch.

Claim 9

A process for producing essentially micro-pore free and inclusion free copper foil having improved ductility comprising the steps of: providing a tank containing an electrolyte solution; providing in said tank a cathode having a continuous plating surface at least partially immersed in said electrolyte solution, said immersed plating surface defining the extent of the plating zone; generating a substantially uniform current distribution throughout said plating zone for promoting formation of said substantially uniform metal foil; said generating step comprising providing an anode; applying a current having a desired current density to said cathode and said anode for plating metal values from said electrolyte solution onto said plating surface; filtering said electrolyte so that it is essentially free of chloride and sulfide ions, organic materials and other contaminants and particulates; and providing a flow rate of said electrolyte past said cathode sufficient to prevent oxygen accumulation along said cathode.

Claim 10

A process for producing essentially micro-pore free and inclusion free copper foil having improved ductility comprising the steps of: providing a tank containing an electrolyte solution; providing in said tank a cathode having a continuous plating surface at least partially immersed in said electrolyte solution, said immersed plating surface defining the extent of the plating zone; generating a substantially uniform current distribution throughout said plating zone for promoting formation of said substantially uniform metal foil; said generating step comprising providing an anode; applying a current having a desired current density to said cathode and said anode for plating metal values from said electrolyte solution onto said plating surface; filtering said electrolyte so that it is essentially free of chloride and sulfide ions, organic materials and other contaminants and particulates; and providing a flow rate of said electrolyte past said cathode sufficient to prevent oxygen accumulation along said cathode.

Claim 11

The process of claim 8 including filtering said electrolyte through activated carbon and further including pretreating said activated carbon to remove inorganic impurities.

Claim 12

The process of claim 9 including said pretreating step comprises leaching said carbon with a solution containing from about 2.5% by volume to about 20% by volume sulfuric acid.

Claim 13

The process of claim 10 including said pretreating step comprises leaching said carbon with a solution containing from about 5% by volume to about 10% by volume sulfuric acid.

Claim 14

The process of claim 8 including providing a copper sulfate electrolyte free from organics, chlorides and other additives and contaminants to thereby manufacture a copper metal deposit.

Claim 15

The process of claim 8 including providing an electrolyte containing a concentration of metal values of a desired metal.

Claim 16

The process of claim 8 including said cathode is a rotating drum.

Claim 17

The process of claim 8 including said cathode is an endless belt.

Claim 18

The process of claim 8 including the step of recrystallizing the foil so produced by heating said foil to a temperature in excess of 350° F.