Method for fabricating a DRAM cell

Claim 1

A method for fabricating a DRAM cell on a semiconductor body employing a lightly doped drain process comprising the steps of: forming a masking layer on a surface of the semiconductor body; defining an opening in the masking layer; implanting a first dopant of a first conductivity type into the opening defined in the masking layer; implanting a second dopant of the same conductivity type into the opening defined in the masking layer, the second dopant having a diffusivity greater than the diffusivity of the first dopant; depositing a polysilicon layer over a substantial portion of the opening defined in the masking layer; heating the semiconductor body in the presence of oxygen to oxidize an upper portion of the polysilicon layer to form a second silicon oxide layer, said heating causing the first and the second dopants to laterally diffuse; forming the source and drain regions of a MOS transistor, said source region of said MOS transistor being spaced-apart from and electrically connected with at least said second laterally diffused dopant; depositing a second polysilicon on the semiconductor surface to form the gate electrode and word line of a DRAM cell; passivating the surface of the semiconductor body to electrically insulate the capacitor and the transistor; and depositing a metal layer to form the bit line of a DRAM cell.

Claim 2

A method for fabricating a DRAM cell on a semiconductor body employing a lightly doped drain process comprising the steps of: forming a masking layer on a surface of the semiconductor body; defining an opening in the masking layer; implanting a first dopant of a first conductivity type into the opening defined in the masking layer; implanting a second dopant of the same conductivity type into the opening defined in the masking layer, the second dopant having a diffusivity greater than the diffusivity of the first dopant; depositing a polysilicon layer over a substantial portion of the opening defined in the masking layer; heating the semiconductor body in the presence of oxygen to oxidize an upper portion of the polysilicon layer to form a second silicon oxide layer, said heating causing the first and the second dopants to laterally diffuse; forming the source and drain regions of a MOS transistor, said source region of said MOS transistor being spaced-apart from and electrically connected with at least said second laterally diffused dopant; depositing a second polysilicon on the semiconductor surface to form the gate electrode and word line of a DRAM cell; passivating the surface of the semiconductor body to electrically insulate the capacitor and the transistor; and depositing a metal layer to form the bit line of a DRAM cell.

Claim 5

A method for fabricating a DRAM cell on a semiconductor body employing a lightly doped drain process comprising the steps of: forming a first silicon oxide layer on a surface of the semiconductor body; forming a silicon nitride layer on the first silicon oxide layer; defining a first opening in the silicon nitride layer; oxidizing the semiconductor body to form a thick field oxide in the opening defined in the silicon nitride; defining a second opening in the silicon nitride layer for formation of a capacitor electrode; depositing a first dopant of a first conductivity type into the second opening defined in the silicon nitride; depositing a second dopant of the same conductivity type into the second opening defined in the silicon nitride, the second dopant having a diffusivity greater than the diffusivity of the first dopant, the first and the second dopants co-extensively underlying the second opening; depositing a polysilicon layer over a substantial portion of the second opening defined in the silicon nitride leaving a portion of the second opening in the silicon nitride uncovered; heating the semiconductor body in the presence of oxygen to form an insulating layer on the polysilicon layer and form a silicon oxide region in the second opening in the silicon nitride not covered by said polysilicon, said heating causing lateral diffusion of said first and said second dopant; removing the remaining silicon nitride layer; forming the source and drain regions of a MOS transistor, said source region of said MOS transistor being spaced-apart from and electrically connected with at least said second laterally diffused dopant, the second laterally diffused dopant extending under the silicon oxide formed in the region of the second opening not covered by polysilicon; depositing a second polysilicon layer on the semiconductor surface to form the gate electrode and word line of a DRAM cell; passivating the surface of the semiconductor body to insulate the capacitor and the transistor; and depositing a metal layer to form the bit line of a DRAM cell.

Claim 6

A method for fabricating a DRAM cell on a semiconductor body employing a lightly doped drain process comprising the steps of: forming a first silicon oxide layer on a surface of the semiconductor body; forming a silicon nitride layer on the first silicon oxide layer; defining a first opening in the silicon nitride layer; oxidizing the semiconductor body to form a thick field oxide in the opening defined in the silicon nitride; defining a second opening in the silicon nitride layer for formation of a capacitor electrode; depositing a first dopant of a first conductivity type into the second opening defined in the silicon nitride; depositing a second dopant of the same conductivity type into the second opening defined in the silicon nitride, the second dopant having a diffusivity greater than the diffusivity of the first dopant, the first and the second dopants co-extensively underlying the second opening; depositing a polysilicon layer over a substantial portion of the second opening defined in the silicon nitride leaving a portion of the second opening in the silicon nitride uncovered; heating the semiconductor body in the presence of oxygen to form an insulating layer on the polysilicon layer and form a silicon oxide region in the second opening in the silicon nitride not covered by said polysilicon, said heating causing lateral diffusion of said first and said second dopant; removing the remaining silicon nitride layer; forming the source and drain regions of a MOS transistor, said source region of said MOS transistor being spaced-apart from and electrically connected with at least said second laterally diffused dopant, the second laterally diffused dopant extending under the silicon oxide formed in the region of the second opening not covered by polysilicon; depositing a second polysilicon layer on the semiconductor surface to form the gate electrode and word line of a DRAM cell; passivating the surface of the semiconductor body to insulate the capacitor and the transistor; and depositing a metal layer to form the bit line of a DRAM cell.