Patent US5004672A successfully refreshed from Google Patents.
US5004672A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrophoretic method for applying photoresist to three dimensional circuit board substrate
Assignee: Shipley Co Inc
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Filing: 1989-07-10
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Granted: 1991-04-02
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Expires: 2009-07-10
Abstract
Abstract A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby (a) providing the board with a conductive surface and (b) applying a photoresist by electrophoretic deposition.
Inventors
- 👤 Eugene D. D'Ottavio
- 👤 Robert E. Hawkins
- 👤 Stephen S. Rodriguez
- 👤 James Rychwalski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/108; G; G03; G03F; G03F7/00; G03F7/16; G03F7/164; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K1/00; H05K1/02; H05K1/0284; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/062
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
112 words
A process for forming a three dimensional circuit board comprising the steps of: (a) providing a molded three dimensional circuit board substrate free of metal on its surface; (b) metallizing the three dimensional surface of the circuit board substrate; (c) building up the metallized surface with a metal selected from the group of copper, nickel, tin or mixtures thereof; (d) electrophoretically applying a photoresist composition to the built up, metallized surface whereby photoresist is evenly deposited on all surfaces of the metallized surface; (e) exposing and developing the photoresist in a desired image pattern; (f) removing metal bared by development by contact with an etchant; and (g) removing the remaining undeveloped photoresist.
Claim 2
Dependent Claim
112 words
A process for forming a three dimensional circuit board comprising the steps of: (a) providing a molded three dimensional circuit board substrate free of metal on its surface; (b) metallizing the three dimensional surface of the circuit board substrate; (c) building up the metallized surface with a metal selected from the group of copper, nickel, tin or mixtures thereof; (d) electrophoretically applying a photoresist composition to the built up, metallized surface whereby photoresist is evenly deposited on all surfaces of the metallized surface; (e) exposing and developing the photoresist in a desired image pattern; (f) removing metal bared by development by contact with an etchant; and (g) removing the remaining undeveloped photoresist.
Claim 3
Dependent Claim
15 words
The process of claim 1, wherein the metallized surface is built up by electroless deposition.
Claim 4
Dependent Claim
15 words
The process of claim 1, wherein the metallized surface is built up by electrolytic deposition.
Claim 5
Dependent Claim
115 words
A process for forming a three dimensional circuit board comprising the steps of: (a) providing a molded three dimensional circuit board substrate free of metal on its surface; (b) metallizing the three dimensional surface of the circuit board substrate; (c) electrophoretically applying a photoresist composition to the metallized surface whereby photoresist is evenly deposited on all surfaces of the metallized surface; (d) exposing and developing the photoresist in a desired image pattern; (e) building up the metallized surface with a metal selected from the group of copper, nickel, solder, tin or mixtures thereof; (f) removing the remaining undeveloped photoresist; and (g) removing the metal bared by removal of the photoresist by contact with an etchant.
Claim 6
Dependent Claim
115 words
A process for forming a three dimensional circuit board comprising the steps of: (a) providing a molded three dimensional circuit board substrate free of metal on its surface; (b) metallizing the three dimensional surface of the circuit board substrate; (c) electrophoretically applying a photoresist composition to the metallized surface whereby photoresist is evenly deposited on all surfaces of the metallized surface; (d) exposing and developing the photoresist in a desired image pattern; (e) building up the metallized surface with a metal selected from the group of copper, nickel, solder, tin or mixtures thereof; (f) removing the remaining undeveloped photoresist; and (g) removing the metal bared by removal of the photoresist by contact with an etchant.
Claim 7
Dependent Claim
15 words
The process of claim 4, wherein the metallized surface is built up by electroless deposition.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-01 | 1994-10-01 | 1995-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-01 | 1998-10-01 | 1999-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-01 | 2002-10-01 | 2003-04-02 | $7700.00 | Window Closed / Lapsed |