Method of making multilayer printed circuit board

Claim 1

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a power-ground plane sandwich component comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of said sandwich component; providing a single-trace component comprised of a circuit trace formed on a partially cured dielectric layer; assembling said components such that one side of said sandwich component is adjacent to and contiguous with the dielectric layer of said single-trace component; and laminating said components to form said board, the dielectric layer of said single-trace component becoming fully cured by said laminating.

Claim 2

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a power-ground plane sandwich component comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of said sandwich component; providing a single-trace component comprised of a circuit trace formed on a partially cured dielectric layer; assembling said components such that one side of said sandwich component is adjacent to and contiguous with the dielectric layer of said single-trace component; and laminating said components to form said board, the dielectric layer of said single-trace component becoming fully cured by said laminating.

Claim 3

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a power-ground plane sandwich component comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of said sandwich component; providing a double-trace component comprised of a partially cured dielectric layer having a circuit trace formed on both sides thereof; providing an insulating layer component comprised of a partially cured dielectric layer; assembling said components such that said insulating layer component is between said sandwich component and said double-trace component; and laminating said components to form said board, said partially cured dielectric layers becoming fully cured by said laminating.

Claim 4

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a power-ground plane sandwich component comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of said sandwich component; providing a double-trace component comprised of a partially cured dielectric layer having a circuit trace formed on both sides thereof; providing an insulating layer component comprised of a partially cured dielectric layer; assembling said components such that said insulating layer component is between said sandwich component and said double-trace component; and laminating said components to form said board, said partially cured dielectric layers becoming fully cured by said laminating.

Claim 7

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a plurality of power-ground plane sandwich components each comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of each sandwich component; forming patterns in said power and ground planes after their respective dielectric layers are fully cured; providing additional components comprised of one or more layers required by said board, certain ones of said layers comprising partially cured dielectric material; assembling said components such that said power-ground plane sandwiches are at spaced internal positions within the multilayer board; and laminating said components to form said board, said partially cured dielectric material becoming fully cured by said laminating.

Claim 8

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing a plurality of power-ground plane sandwich components each comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; fully curing the dielectric layer of each sandwich component; forming patterns in said power and ground planes after their respective dielectric layers are fully cured; providing additional components comprised of one or more layers required by said board, certain ones of said layers comprising partially cured dielectric material; assembling said components such that said power-ground plane sandwiches are at spaced internal positions within the multilayer board; and laminating said components to form said board, said partially cured dielectric material becoming fully cured by said laminating.

Claim 9

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing first and second power-ground plane sandwich components each comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; curing the dielectric layer of each sandwich component; forming patterns in said power and ground planes after their respective dielectric layers are fully cured; providing first and second single-trace components each comprised of a circuit trace formed on a partially cured dielectric layer; providing a double-trace component comprised of a partially cured dielectric layer having a circuit trace formed on both sides thereof; providing first and second insulating layer components each comprised of a partially cured dielectric layer; assembling said components such that said first and second single-trace components are respectively located at the upper and lower ends of said board with their respective circuit traces outward and their respective dielectric layers inward, said first sandwich is located with one side adjacent to and contiguous with the dielectric layer of said first single-trace component, said second sandwich is located with one side adjacent to and contiguous with the dielectric layer of said second single-trace component, said first insulating layer component is contiguously located between the other side of said first sandwich and one side of said double-trace component, and said second insulating component is contiguously located between the other side of said second sandwich and the other side of said double-trace components; and laminating said components to form said board, said partially cured dielectric layers becoming fully cured by said laminating.

Claim 10

A method of making a multilayer printed circuit board comprised of interleaved contiguous conductive and insulative dielectric layers, said method comprising: providing first and second power-ground plane sandwich components each comprised of a curable dielectric layer contiguously sandwiched between a conductive power plane layer and a conductive ground plane layer; curing the dielectric layer of each sandwich component; forming patterns in said power and ground planes after their respective dielectric layers are fully cured; providing first and second single-trace components each comprised of a circuit trace formed on a partially cured dielectric layer; providing a double-trace component comprised of a partially cured dielectric layer having a circuit trace formed on both sides thereof; providing first and second insulating layer components each comprised of a partially cured dielectric layer; assembling said components such that said first and second single-trace components are respectively located at the upper and lower ends of said board with their respective circuit traces outward and their respective dielectric layers inward, said first sandwich is located with one side adjacent to and contiguous with the dielectric layer of said first single-trace component, said second sandwich is located with one side adjacent to and contiguous with the dielectric layer of said second single-trace component, said first insulating layer component is contiguously located between the other side of said first sandwich and one side of said double-trace component, and said second insulating component is contiguously located between the other side of said second sandwich and the other side of said double-trace components; and laminating said components to form said board, said partially cured dielectric layers becoming fully cured by said laminating.