Patent US2651104A successfully refreshed from Google Patents.
Patent US5041183A successfully refreshed from Google Patents.
US5041183A
Expired / Lapsed
US
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Method for the preparation of a hot-melt adhesive interconnector
Assignee: Shin-Etsu Polymer Co Ltd
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Filing: 1990-01-09
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Granted: 1991-08-20
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Expires: 2010-01-09
Abstract
Abstract The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets.
Inventors
- 👤 Akio Nakamura
- 👤 Osami Hayashi
- 👤 Hideki Tabei
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:58
CPC Classifications
H; H01; H01R; H01R9/00; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H01R4/00; H01R4/04; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/714; H01R13/00; H01R13/02; H01R13/22; H01R13/24; H01R13/2407; H01R13/2414; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/09; H05K2201/09818; H05K2201/09945; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/11; H05K2203/1189; H05K3/303; H05K3/305; H05K3/36; H05K3/361; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1075; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49208; Y10T29/4922
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
136 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a striped sheet composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin each to serve as an insulating area and strips of an adhesive hot-melt electroconductive resin composition each to serve as a conductive area, which comprises the steps of: (a) stacking films of an electrically insulating adhesive hot-melt resin each coated on one surface with an electroconductive adhesive hot-melt resin composition one on the other in such a manner that the coated surface of a film is contacted with the uncoated surface of the adjacent film; (b) integrating the stack of films to form an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the surface of the stacked films.
Claim 2
Independent Claim
136 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a striped sheet composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin each to serve as an insulating area and strips of an adhesive hot-melt electroconductive resin composition each to serve as a conductive area, which comprises the steps of: (a) stacking films of an electrically insulating adhesive hot-melt resin each coated on one surface with an electroconductive adhesive hot-melt resin composition one on the other in such a manner that the coated surface of a film is contacted with the uncoated surface of the adjacent film; (b) integrating the stack of films to form an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the surface of the stacked films.
Claim 3
Dependent Claim
33 words
The method for the preparation of a hot-melt type adhesive interconnector as claimed in claim 1 wherein the film of an electrically insulating adhesive hot-melt resin has a thickness not exceeding 100 μm.
Claim 4
Dependent Claim
33 words
The method for the preparation of a hot-melt type adhesive interconnector as claimed in claim 1 wherein the adhesive hot-melt resin has a softening temperature in the range from 80 °to 180° C.
Claim 5
Dependent Claim
38 words
The method for the preparation of a hot-melt type adhesive interconnector as claimed in claim 1 wherein the coating layer of the electroconductive ashesive hot-melt resin composition has a thickness in the range from 10 to 50 μm.
Claim 6
Independent Claim
137 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a striped sheet composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin each to serve as an insulating area and strips of an adhesive hot-melt electroconductive resin composition each to serve as a conductive area, which comprises the steps of: (a) stacking films of an electrically conductive adhesive hot-melt resin composition each coated on one surface with an electrically insulating adhesive hot-melt resin one on the other in such a manner that the coated surface of a film is contacted with the uncoated surface of the adjacent film; (b) integrating the stack of films to form an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the surface of the stacked films.
Claim 7
Independent Claim
137 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a striped sheet composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin each to serve as an insulating area and strips of an adhesive hot-melt electroconductive resin composition each to serve as a conductive area, which comprises the steps of: (a) stacking films of an electrically conductive adhesive hot-melt resin composition each coated on one surface with an electrically insulating adhesive hot-melt resin one on the other in such a manner that the coated surface of a film is contacted with the uncoated surface of the adjacent film; (b) integrating the stack of films to form an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the surface of the stacked films.
Claim 8
Independent Claim
178 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a sheet composed of a matrix of an electrically insulating adhesive hot-melt resin to serve as an insulating area and spot areas formed of a hot-melt adhesive electroconductive resin composition discretely distributed in the matrix of the electrically insulating adhesive hot-melt resin each to serve as a conductive area, which comprises the steps of: (a) stacking striped sheets each composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin and strips of an electroconductive adhesive hot-melt resin composition and each coated on one surface with an electrically insulating adhesive hot-melt resin in such a manner that the coated surface of a sheet is contacted with the uncoated surface of the adjacent sheet and all of the conductive strips of the striped sheets run in the same direction; (b) integrating the stacked sheets into an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the running direction of the conductive strips of the striped sheets.
Claim 9
Independent Claim
178 words
A method for the preparation of a hot-melt type adhesive interconnector having a form of a sheet composed of a matrix of an electrically insulating adhesive hot-melt resin to serve as an insulating area and spot areas formed of a hot-melt adhesive electroconductive resin composition discretely distributed in the matrix of the electrically insulating adhesive hot-melt resin each to serve as a conductive area, which comprises the steps of: (a) stacking striped sheets each composed of alternately arranged strips of an electrically insulating adhesive hot-melt resin and strips of an electroconductive adhesive hot-melt resin composition and each coated on one surface with an electrically insulating adhesive hot-melt resin in such a manner that the coated surface of a sheet is contacted with the uncoated surface of the adjacent sheet and all of the conductive strips of the striped sheets run in the same direction; (b) integrating the stacked sheets into an integrally stratified block; and (c) slicing the integrally stratified block in a plane substantially perpendicular to the running direction of the conductive strips of the striped sheets.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-19 | 1995-02-18 | 1995-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-19 | 1999-02-18 | 1999-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-19 | 2003-02-18 | 2003-08-20 | $7700.00 | Window Closed / Lapsed |