Patent US5070596A successfully refreshed from Google Patents.
US5070596A
Expired / Lapsed
US
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Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
Assignee: Intersil Corp
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Filing: 1990-10-31
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Granted: 1991-12-10
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Expires: 2010-10-31
Abstract
Abstract Integrated circuits are formed by bonding two substrates together on a moat or recess. If the moat is exposed at a side wall, an optical fiber is inserted therein and communicates optically with a photoelectric device in the substrate by a slant side wall of the moat. If the moat is sealed by a cover layer resulting from removing all or most of the top substrate leaving the bonding layer as a cover, a pressure responsive device is formed on the cover layer directly or in the remaining top substrate over the sealed cavity.
Inventors
- 👤 Stephen J. Gaul
- 👤 Craig J. McLachlan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 11:34
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0042; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/4214; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099; Y10T29/49103; Y10T29/49799
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
82 words
A method of fabricating a pressure transducer comprising: forming a cavity in a first surface of a first substrate; forming a bonding layer on a second surface of a second substrate; positioning said second substrate on said first substrate with said bonding layer therebetween and covering said cavity; heating to bond said first and second substrates to each other; removing said second substrate leaving said bonding layer sealing said cavity; and forming a pressure sensor on said bonding layer over said cavity.
Claim 2
Independent Claim
82 words
A method of fabricating a pressure transducer comprising: forming a cavity in a first surface of a first substrate; forming a bonding layer on a second surface of a second substrate; positioning said second substrate on said first substrate with said bonding layer therebetween and covering said cavity; heating to bond said first and second substrates to each other; removing said second substrate leaving said bonding layer sealing said cavity; and forming a pressure sensor on said bonding layer over said cavity.
Claim 3
Dependent Claim
30 words
A method according to claim 1, wherein forming a bonding layer includes thermally oxidizing said second substrate or chemical vapor deposition of an oxide bonding layer on said second surface.
Claim 4
Dependent Claim
24 words
A method according to claim 2, wherein said oxide bonding layer is formed to a thickness in the range of 1000 to 40000 Angstroms.
Claim 5
Dependent Claim
17 words
A method according to claim 1, wherein said second substrate is removed by grinding followed by etching.
Claim 6
Dependent Claim
21 words
A method according to claim 1, wherein forming said pressure sensor includes forming a thin film resistor on said bonding layer.
Claim 7
Dependent Claim
39 words
A method according to claim 1, wherein removing said second substrate is performed to reduce the second substrate to a thin second substrate layer and forming said pressure sensor includes forming diffused resistors in said thin second substrate layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-09 | 1995-06-10 | 1995-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-09 | 1999-06-10 | 1999-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-09 | 2003-06-10 | 2003-12-10 | $7700.00 | Window Closed / Lapsed |