Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
107 words
A method of manufacturing a chip coil, comprising the steps of: (a) preparing a substrate having an insulating surface; (b) forming a conductive film on the whole insulating surface of said substrate by a thin-film technique; (c) removing an unnecessary portion of said conductive film by etching to form a coil conductor and a pair of terminal electrodes; (d) forming an insulation film of a polyimide or polyamide resin on said substrate so as to cover said coil conductor and said pair of terminal electrodes; and (e) removing an unnecessary portion of said insulation film by photolithographic etching to expose at least said pair of terminal electrodes.
Claim 2
Independent Claim
107 words
A method of manufacturing a chip coil, comprising the steps of: (a) preparing a substrate having an insulating surface; (b) forming a conductive film on the whole insulating surface of said substrate by a thin-film technique; (c) removing an unnecessary portion of said conductive film by etching to form a coil conductor and a pair of terminal electrodes; (d) forming an insulation film of a polyimide or polyamide resin on said substrate so as to cover said coil conductor and said pair of terminal electrodes; and (e) removing an unnecessary portion of said insulation film by photolithographic etching to expose at least said pair of terminal electrodes.
Claim 3
Dependent Claim
40 words
A manufacturing method in accordance with claim 1, wherein said step (c) includes a step of forming a spiral coil conductor, the outermost end of which is connected to one terminal electrode and the innermost end of which is open.
Claim 4
Dependent Claim
67 words
A manufacturing method in accordance with claim 2, further comprising the steps of: (f) etching said insulation film by photolithography to form a throughhole at a portion corresponding in position to said innermost end of said spiral coil conductor; and (g) forming a connecting conductor which connects said innermost end of said spiral coil conductor to the other terminal electrode through said throughhole on said insulation film.
Claim 5
Dependent Claim
42 words
A manufacturing method in accordance with claim 3, wherein said step (g) includes the steps of (g-1) forming a further conductive film on the whole surface of said insulation film and (g-2) etching said further conductive film to form said connecting conductor.
Claim 6
Dependent Claim
54 words
A manufacturing method in accordance with claim 4, further comprising steps of: (h) forming a further insulation film on said substrate so as to cover said terminal electrodes, said insulation film and said connecting conductor; and (i) removing an unnecessary portion of said further insulation film to expose said first and second terminal electrodes.
Claim 7
Dependent Claim
25 words
A manufacturing method in accordance with claim 1, wherein said insulation film is formed in step (d) of a polyimide or polyamide resin having photosensitivity.
Claim 8
Dependent Claim
60 words
A manufacturing method in accordance with claim 1, wherein said insulation film is formed in step (d) of a polyimide or polyamide film having substantially no photosensitivity, and said step of removing an unnecessary portion of said insulation film in step (e) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.
Claim 9
Dependent Claim
25 words
A manufacturing method in accordance with claim 3, wherein said insulation film is formed in step (d) of a polyimide or polyamide resin having photosensitivity.
Claim 10
Dependent Claim
60 words
A manufacturing method in accordance with claim 3, wherein said insulation film is formed in step (d) of a polyimide or polyamide film having substantially no photosensitivity, and said step of removing an unnecessary portion of said insulation film in step (e) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.
Claim 11
Dependent Claim
29 words
A manufacturing method in accordance with claim 9, wherein step (f) includes coating a portion of said insulation film that is not to be removed with a photo-resist film.