Patent US5075252A successfully refreshed from Google Patents.
US5075252A
Expired / Lapsed
US
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Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction
Assignee: Individual
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Filing: 1990-05-14
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Granted: 1991-12-24
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Expires: 2010-05-14
Abstract
Abstract A novel implementation of a tape automated bonding process of attaching leads to a semiconductor die is disclosed which utilizes a method of attaching tape leads which extend across the interior surface of the die rather than radially outwardly from the die. Two-layer or three-layer tape construction is used, with the insulation being located between the top of the die and the leads. This technique enables lead placement on opposite sides of the die in interdigitated fashion, allowing die to be installed on a circuit board more closely adjacent than has previously been possible.
Inventors
- 👤 Richard Schendelman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:32
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/10522; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
241 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 2
Independent Claim
241 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 3
Dependent Claim
17 words
A method as defined in claim 1, wherein said tape is a two-layer tape automated bonding tape.
Claim 4
Dependent Claim
19 words
A method as defined in claim 2, wherein said apertures in said layer of insulating material are chemically etched.
Claim 5
Dependent Claim
35 words
A method as defined in claim 1, wherein said tape is a three-layer tape automated bonding tape having an intermediate layer of adhesive between said layer of insulating material and said layer of conductive material.
Claim 6
Dependent Claim
33 words
A method as defined in claim 4, wherein said apertures in said layer of insulating material are punched prior to said layer of conductive material being installed on said layer of insulating material.
Claim 7
Dependent Claim
20 words
A method as defined in claim 1, wherein said removing step is performed using a photo imaging and etching process.
Claim 8
Dependent Claim
15 words
A method as defined in claim 1, wherein said insulating layer is made of polyimide.
Claim 9
Dependent Claim
17 words
A method as defined in claim 1, wherein said layer of conductive material is made of copper.
Claim 10
Dependent Claim
17 words
A method as defined in claim 8, wherein said layer of conductive material is plated with gold.
Claim 11
Dependent Claim
22 words
A method as defined in claim 1, additionally comprising: bumping said terminal pads on said semiconductor die prior to said positioning step.
Claim 12
Dependent Claim
27 words
A method as defined in claim 10, wherein said bumping step is performed using gold as the material for bumping said terminal pads on said semiconductor die.
Claim 13
Dependent Claim
67 words
A method as defined in claim 10, wherein said top surface of said semiconductor die is covered by a passivation layer leaving openings only where said terminal pads are located, said passivation layer overlying a portion of each of said terminal pads on the periphery thereof, and wherein the bump produced by said bumping step overlies a portion of said passivation layer, thereby providing a hermetic seal.
Claim 14
Dependent Claim
16 words
A method as defined in claim 12, wherein said passivation layer is made of silicon nitride.
Claim 15
Dependent Claim
31 words
A method as defined in claim 1, additionally comprising: bumping said first ends of said conductive leads on the side facing said layer of insulating material prior to said positioning step.
Claim 16
Dependent Claim
52 words
A method as defined in claim 1, wherein said electrically connecting step comprises: sequentially bonding each of said first ends of said conductive leads to a corresponding terminal pad on said semiconductor die using a process from the group consisting of thermocompression bonding, thermosonic bonding, ultrasonic bonding, laser bonding, and reflow bonding.
Claim 17
Dependent Claim
46 words
A method as defined in claim 1, wherein said electrically connecting step comprises: simultaneously bonding each of said first ends of said conductive leads to a corresponding terminal pad on said semiconductor die using a process from the group consisting of thermocompression bonding and reflow bonding.
Claim 18
Dependent Claim
23 words
A method as defined in claim 1, additionally comprising: testing said semiconductor die after said electrically connecting step and before said cutting step.
Claim 19
Dependent Claim
24 words
A method as defined in claim 1, additionally comprising: burning in said semiconductor die after said electrically connecting step and before said cutting step.
Claim 20
Dependent Claim
37 words
A method as defined in claim 1, additionally comprising: encapsulating the top of said semiconductor die using an encapsulate material covering said layer of insulating material and the portions of said leads located above said semiconductor die.
Claim 21
Dependent Claim
34 words
A method as defined in claim 19, wherein an aperture is located in said layer of insulating material to allow said encapsulate material to flow therethrough to cover the top of said semiconductor die.
Claim 22
Dependent Claim
25 words
A method as defined in claim 19, wherein said encapsulate material is made of an element from the group consisting of epoxy, silicone, and polyimide.
Claim 23
Dependent Claim
32 words
A method as defined in claim 1, additionally comprising: bending said second ends of said leads in gull wing fashion to facilitate installation of said semiconductor die on a printed circuit board.
Claim 24
Dependent Claim
28 words
A method as defined in claim 1, additionally comprising: grouping said second ends of said leads to facilitate interdigitation of leads on adjacent ones of said semiconductor die.
Claim 25
Dependent Claim
114 words
A method as defined in claim 23, wherein said second ends of said leads are grouped in first, second, and third groups extending from a first and second opposite sides of said semiconductor die, said first and second sides each having a first end and a second end, said first group of leads emanating from the portion of said first side of said semiconductor die adjacent said first end, said second group of leads emanating from the portion of said first side of said semiconductor die adjacent said second end, said third group of leads emanating from a central portion of said second side of said semiconductor die intermediate said first and second ends.
Claim 26
Dependent Claim
89 words
A method as defined in claim 23, wherein said second ends of said leads are grouped in first and second groups extending from a first and second opposite sides of said semiconductor die, said first and second sides each having a first end and a second end, said first group of leads emanating from the portion of said first side of said semiconductor die adjacent said first end, said second group of leads emanating from the portion of said second side of said semiconductor die adjacent said second end.
Claim 27
Dependent Claim
89 words
A method as defined in claim 23, wherein said second ends of said leads are grouped in first and second groups extending from a first and second opposite sides of said semiconductor die, said first and second sides each having a first end and a second end, said first group of leads emanating from the portion of said first side of said semiconductor die adjacent said first end, said second group of leads emanating from the portion of said second side of said semiconductor die adjacent said first end.
Claim 28
Independent Claim
369 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; bumping said terminal pads on said semiconductor die with gold; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die, said second ends of said leads being grouped in first, second, and third groups extending from a first and second opposite sides of said semiconductor die to facilitate interdigitation of leads on adjacent ones of said semiconductor die, said first and second sides each having a first end and a second end, said first group of leads emanating from the portion of said first side of said semiconductor die adjacent said first end, said second group of leads emanating from the portion of said first side of said semiconductor die adjacent said second end, said third group of leads emanating from a central portion of said second side of said semiconductor die intermediate said first and second ends; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 29
Independent Claim
369 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; bumping said terminal pads on said semiconductor die with gold; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die, said second ends of said leads being grouped in first, second, and third groups extending from a first and second opposite sides of said semiconductor die to facilitate interdigitation of leads on adjacent ones of said semiconductor die, said first and second sides each having a first end and a second end, said first group of leads emanating from the portion of said first side of said semiconductor die adjacent said first end, said second group of leads emanating from the portion of said first side of said semiconductor die adjacent said second end, said third group of leads emanating from a central portion of said second side of said semiconductor die intermediate said first and second ends; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 30
Independent Claim
271 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; bumping said terminal pads on said semiconductor die with gold; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die, said second ends of said leads being grouped to facilitate interdigitation of leads on adjacent ones of said semiconductor die; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 31
Independent Claim
271 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads about the periphery thereof, comprising: providing a tape comprising a thin, flat layer of insulating material having a thin, flat layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first end of each of said leads extending over an aperture in said layer of insulating material, said second end of each of said leads extending over an aperture in said layer of insulating material; bumping said terminal pads on said semiconductor die with gold; positioning said semiconductor die below said tape with said first ends of said leads each extending over a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die, said second ends of said leads being grouped to facilitate interdigitation of leads on adjacent ones of said semiconductor die; electrically connecting each of said first ends of said leads to the corresponding terminal pad on said semiconductor die said first end of said lead extends over; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 32
Independent Claim
185 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads, comprising: providing a tape comprising a layer of insulating material having a layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first and second ends of each of said leads each extending over an aperture in said layer of insulating material; electrically connecting each of said first ends of said leads to a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 33
Independent Claim
185 words
A method of attaching leads to a semiconductor die having a plurality of terminal pads, comprising: providing a tape comprising a layer of insulating material having a layer of conductive material disposed thereon, said layer of insulating material having a plurality of apertures therein; removing a portion of the layer of conductive material to form a plurality of conductive leads each having a first end and a second end, said first and second ends of each of said leads each extending over an aperture in said layer of insulating material; electrically connecting each of said first ends of said leads to a corresponding terminal pad on said semiconductor die, the portion of each of said leads adjacent said first end of each of said leads extending inwardly from the periphery of said semiconductor die over the surface of said semiconductor die, said second end of each of said leads extending outwardly from the periphery of said semiconductor die; and cutting said tape to remove said semiconductor die, the portion of said layer of conductive material above said semiconductor die, and said leads from said tape.
Claim 34
Independent Claim
135 words
A method of fabricating a semi-conductor die having a plurality of leads connected thereto comprising: a) providing a die having a plurality of terminal pads, and a plurality of sides; b) providing a plurality of leads, each of which have a rearward portion connected to a rear end and a forward portion connected to a forward end, c) positioning said leads over said die so that: 1) said rearward portion extends over said die from the periphery of one side thereof inwardly of said die, and 2) said forward portion extends over said die from the interior thereof outwardly to the periphery thereof at a side other than said one side, and d) connecting each said rear end of said leads to each terminal pad on one side of said die at the periphery thereof.
Claim 35
Independent Claim
135 words
A method of fabricating a semi-conductor die having a plurality of leads connected thereto comprising: a) providing a die having a plurality of terminal pads, and a plurality of sides; b) providing a plurality of leads, each of which have a rearward portion connected to a rear end and a forward portion connected to a forward end, c) positioning said leads over said die so that: 1) said rearward portion extends over said die from the periphery of one side thereof inwardly of said die, and 2) said forward portion extends over said die from the interior thereof outwardly to the periphery thereof at a side other than said one side, and d) connecting each said rear end of said leads to each terminal pad on one side of said die at the periphery thereof.
Claim 36
Dependent Claim
15 words
The method of claim 30 wherein said leads are in the form of a tape.
Claim 37
Dependent Claim
16 words
The method of claim 31 wherein said tape includes an insulative support layer for said leads.
Claim 38
Dependent Claim
17 words
The method of claim 32 wherein said support layer is disposed between the leads and said die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1994-12-23 | 1995-06-24 | 1995-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-23 | 1999-06-24 | 1999-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-23 | 2003-06-24 | 2003-12-24 | $7700.00 | Window Closed / Lapsed |