Integrated miniaturized sensor for measuring total dissolved gas and liquid vapor

Claim 2

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of predetermined shape which supports a pressure sensitive wafer means, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said housing and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through said housing in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer, said membrane support layer overlying and being integrated with said pressure sensitive wafer means including a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means such that said pressure sensitive wafer means is spaced from direct contact with said membrane support layer to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said gas porous membrane support layer such that dissolved gas and liquid vapor of a liquid diffuse through said gas permeable membrane means into said porous membrane support layer and into said gas chamber so that gas pressure in said porous membrane support layer reflects the total gas and liquid vapor pressure in the liquid and is sensed by said pressure sensor, e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed by said pressure sensor and a signal is generated by said integrated circuitry and transmitted to said readout means remote from said pressure sensitive wafer means.

Claim 3

The improved sensor device according to claim 1 and wherein said housing includes central opening means therethrough so that a sealed cavity is defined on one side of the pressure sensitive wafer means opposite said gas chamber so that said connecting wire means is able to connect to said integrated circuitry for said pressure sensitive wafer means.

Claim 4

The improved sensor device according to claim 2 and wherein said heating element means is provided within said housing and within said sealed cavity to prevent the formation of condensation.

Claim 5

The improved sensor device according to claim 2 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 6

The improved sensor device according to claim 2 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 7

The improved sensor device according to claim 1 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 8

The improved sensor device according to claim 2 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 9

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally cylindrical shape having an outer cylindrical support surface and an end support surface, said housing further having a cavity therein opening onto said end support surface to define space for receiving a pressure sensitive wafer means, said housing also including a rear portion at the end thereof opposite said end support surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said cavity in said housing and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through said housing and said rear portion in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said housing cylindrical support surface and end support surface to define a cup shape, said membrane support layer overlying and being integrated with said pressure sensitive wafer means including a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means such that said pressure sensitive wafer means is spaced from direct contact with said membrane support layer to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor of a liquid diffuse through said gas permeable membrane means into said porous membrane support layer so that gas pressure in said porous membrane support layer reflects the total gas and liquid vapor pressure in the liquid and is sensed by said pressure sensor, e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said integrated circuitry and transmitted to a readout means remote from said pressure sensitive wafer means.

Claim 10

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally cylindrical shape having an outer cylindrical support surface and an end support surface, said housing further having a cavity therein opening onto said end support surface to define space for receiving a pressure sensitive wafer means, said housing also including a rear portion at the end thereof opposite said end support surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said cavity in said housing and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through said housing and said rear portion in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said housing cylindrical support surface and end support surface to define a cup shape, said membrane support layer overlying and being integrated with said pressure sensitive wafer means including a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means such that said pressure sensitive wafer means is spaced from direct contact with said membrane support layer to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor of a liquid diffuse through said gas permeable membrane means into said porous membrane support layer so that gas pressure in said porous membrane support layer reflects the total gas and liquid vapor pressure in the liquid and is sensed by said pressure sensor, e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said integrated circuitry and transmitted to a readout means remote from said pressure sensitive wafer means.

Claim 11

The improved sensor device according to claim 8 and wherein said housing means includes central opening means therethrough so that a sealed cavity is defined on one side of the pressure sensitive wafer means opposite said gas chamber so that said connecting wire means is able to connect to said integrated circuitry for said pressure sensor.

Claim 12

The improved sensor device according to claim 9 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 13

The improved sensor device according to claim 9 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 14

The improved sensor device according to claim 8 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 15

The improved sensor device according to claim 8 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 16

The improved sensor device according to claim 8 and wherein heating element means is provided within said housing and within said cavity to prevent the formation of condensation.

Claim 17

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally round shape having a bottom wall with an interior surface and also having an upstanding edge wall means around the entire periphery of said bottom wall for supporting seal means, and further including pressure sensitive wafer means support operably attached to said interior surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said housing on said pressure sensitive wafer means support and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through said housing in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said pressure sensitive wafer means support, said porous membrane support layer overlying and being integrated with said pressure sensitive wafer means support and including a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means such that said pressure sensitive wafer means is spaced from direct contact with said membrane support layer to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor diffuse through said gas permeable membrane means into said porous membrane support layer and into said gas chamber so that gas pressure in said porous membrane support layer reflects the total gas and liquid vapor pressure in the liquid and is sensed by said pressure sensor, and e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said pressure sensor and transmitted to a readout means remote from said pressure sensitive wafer means.

Claim 18

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally round shape having a bottom wall with an interior surface and also having an upstanding edge wall means around the entire periphery of said bottom wall for supporting seal means, and further including pressure sensitive wafer means support operably attached to said interior surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said housing on said pressure sensitive wafer means support and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through said housing in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said pressure sensitive wafer means support, said porous membrane support layer overlying and being integrated with said pressure sensitive wafer means support and including a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means such that said pressure sensitive wafer means is spaced from direct contact with said membrane support layer to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor diffuse through said gas permeable membrane means into said porous membrane support layer and into said gas chamber so that gas pressure in said porous membrane support layer reflects the total gas and liquid vapor pressure in the liquid and is sensed by said pressure sensor, and e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said pressure sensor and transmitted to a readout means remote from said pressure sensitive wafer means.

Claim 19

The improved sensor device according to claim 15 and wherein said pressure sensitive wafer means includes central opening means therethrough so that a sealed cavity is defined on one side of the pressure sensitive wafer means opposite said gas chamber so that said connecting wire means is able to connect to said pressure sensor.

Claim 20

The improved sensor device according to claim 16 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 21

The improved sensor device according to claim 16 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 22

The improved sensor device according to claim 15 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 23

The improved sensor device according to claim 15 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 24

The improved sensor device according to claim 15 and wherein heating element means is provided within said housing and within said sealed cavity to prevent the formation of condensation.

Claim 25

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally elongated shape having an outer cylindrical support surface and an end support surface, said housing further having bore means extending generally through the entire length thereof to define a minimum gas volume space and also having cross opening means extending between and interconnecting said cylindrical support surface and said bore means for diffusing dissolved gas and liquid vapor to said bore means, said housing also including a rear portion at the end thereof opposite said end support surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said rear portion of said housing and at one end of said bore means and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through the rear portion of said housing in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said housing cylindrical support surface and said end support surface and being integrated with said cylindrical support surface, said housing and said bore means therein defining a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means, said pressure sensitive wafer means being spaced from direct contact with membrane support layer by said elongate housing to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor of a liquid diffuse through said gas permeable membrane means into said porous membrane support layer and through said cross opening means into said bore means so that gas pressure in said porous membrane support layer, cross opening means and bore means, reflects the total gas and liquid vapor pressure in the liquid, and is sensed by said pressure sensor, e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said integrated circuitry and transmitted to a readout remote from said pressure sensitive wafer means.

Claim 26

An improved sensor device for measuring total dissolved gas and liquid vapor, comprising: a) a water proof housing of generally elongated shape having an outer cylindrical support surface and an end support surface, said housing further having bore means extending generally through the entire length thereof to define a minimum gas volume space and also having cross opening means extending between and interconnecting said cylindrical support surface and said bore means for diffusing dissolved gas and liquid vapor to said bore means, said housing also including a rear portion at the end thereof opposite said end support surface, b) pressure sensitive wafer means including integrated circuitry for required signal supported in said rear portion of said housing and at one end of said bore means and including mounting means for mechanical support and a pressure sensor supported on said mounting means, said pressure sensor being connected by connecting wire means for transmitting signal extending through the rear portion of said housing in sealed relationship thereto to an instrument and instrument readout means for indicating total dissolved gas and liquid vapor pressure, c) a gas porous, mechanically rigid membrane support layer overlying said housing cylindrical support surface and said end support surface and being integrated with said cylindrical support surface, said housing and said bore means therein defining a gas chamber of predetermined minimum volume adjacent said pressure sensitive wafer means, said pressure sensitive wafer means being spaced from direct contact with membrane support layer by said elongate housing to assure that only gas pressure is sensed by said pressure sensor, d) gas permeable membrane means supported on and by said porous membrane support layer such that dissolved gas and liquid vapor of a liquid diffuse through said gas permeable membrane means into said porous membrane support layer and through said cross opening means into said bore means so that gas pressure in said porous membrane support layer, cross opening means and bore means, reflects the total gas and liquid vapor pressure in the liquid, and is sensed by said pressure sensor, e) said pressure sensitive wafer means, said porous membrane support layer, and said gas permeable membrane means being liquid sealed with respect to said housing to that liquid in which the sensor device is being used is prevented from entering said device, whereby only dissolved gas and liquid vapor diffusing through said gas permeable membrane means are sensed and a signal is generated by said integrated circuitry and transmitted to a readout remote from said pressure sensitive wafer means.

Claim 27

The improved sensor device according to claim 22 and wherein said housing includes central opening means therethrough so that a sealed cavity is defined on one side of the pressure sensitive wafer means opposite said gas chamber so that said connecting wire means is able to connect to said integrated circuitry for said pressure sensor.

Claim 28

The improved sensor device according to claim 22 and wherein said pressure sensor is a piezoresistive pressure transducer.

Claim 29

The improved sensor device according to claim 22 and wherein said pressure sensor is a piezocapacitive pressure transducer.

Claim 30

The improved sensor device according to claim 22 and wherein heating element means is provided within said housing and within said sealed cavity to prevent the formation of condensation.

Claim 31

The improved sensor device according to claim 22 and wherein vent tube means extend from said pressure sensor to one of the liquid medium and atmosphere so that differential or gauge pressure is measured.