Patent US2966561A successfully refreshed from Google Patents.
Patent US5161009A successfully refreshed from Google Patents.
US5161009A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ic module having a folding junction structure
Assignee: Casio Computer Co Ltd
•
Filing: 1991-05-31
•
Granted: 1992-11-03
•
Expires: 2011-05-31
Abstract
Abstract An IC module includes a film substrate, a plurality of wiring leads, an electrically insulative plastic, and an IC chip. A junction structure of the IC module comprises the IC module, an electronic component, and an electrically conductive bonding compound to couple the IC module to the electronic component. The film substrate is provided with an opening. The plurality of wiring leads are arranged on the film substrate in a manner that some respective portions of the wiring leads bridge the opening provided in the film substrate, the electrically insulative plastic coats the some respective portions of the wiring leads which bridge the opening, and the IC chip is coupled to the wiring leads. The IC module is folded at a part where the some respective portions of the wiring leads bridge the opening.
Inventors
- 👤 Minoru Tanoi
- 👤 Masayasu Kizaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:33
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0277; H05K1/028; H10; H10W; H10W72/00; H01; H01R; H01R12/00; H01R12/70; H01R12/7076; H10W70/00; H10W70/60; H10W70/67; H10W70/688; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10007; H05K2201/10128; H05K2201/10136; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K3/36; H05K3/361; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
74 words
An IC module comprising: a film substrate with an opening provided therein; a plurality of wiring leads arranged on the surface of said film substrate with some portions of said wiring leads bridging said opening; an electrically insulative plastic coating said some portions of said wiring leads bridging said opening; and an IC chip coupled to said wiring leads; wherein said film substrate is folded at a part thereof where said opening is located.
Claim 2
Dependent Claim
74 words
An IC module comprising: a film substrate with an opening provided therein; a plurality of wiring leads arranged on the surface of said film substrate with some portions of said wiring leads bridging said opening; an electrically insulative plastic coating said some portions of said wiring leads bridging said opening; and an IC chip coupled to said wiring leads; wherein said film substrate is folded at a part thereof where said opening is located.
Claim 3
Dependent Claim
19 words
The IC module as defined in claim 1, wherein said film substrate is further provided with a device hole.
Claim 4
Dependent Claim
18 words
The IC module as defined in claim 2, wherein said electrically insulative plastic is an epoxy resin-based plastic.
Claim 5
Dependent Claim
20 words
The IC module as defined in claim 2, wherein said opening has its space filled with said electrically insulative plastic.
Claim 6
Dependent Claim
18 words
The IC module as defined in claim 1, wherein said electrically insulative plastic is an epoxy resin-based plastic.
Claim 7
Dependent Claim
20 words
The IC module as defined in claim 1, wherein said opening has its space filled with said electrically insulative plastic.
Claim 8
Dependent Claim
120 words
An IC module comprising: a first film substrate; a second film substrate arranged with a substantially uniform gap provided between itself and said first film substrate; a plurality of wiring leads arranged on the surfaces respectively of said first and second film substrates with some portions of said wiring leads bridging said gap provided between said first and second film substrates; an electrically insulative plastic coating said some portions of said wiring leads bridging said gap provided between said first and second film substrates; and an IC chip coupled to said wiring leads; wherein said wiring leads are folded at a part where said some portions of said wiring leads bridge said gap between said first and second film substrates.
Claim 9
Dependent Claim
120 words
An IC module comprising: a first film substrate; a second film substrate arranged with a substantially uniform gap provided between itself and said first film substrate; a plurality of wiring leads arranged on the surfaces respectively of said first and second film substrates with some portions of said wiring leads bridging said gap provided between said first and second film substrates; an electrically insulative plastic coating said some portions of said wiring leads bridging said gap provided between said first and second film substrates; and an IC chip coupled to said wiring leads; wherein said wiring leads are folded at a part where said some portions of said wiring leads bridge said gap between said first and second film substrates.
Claim 10
Dependent Claim
26 words
The IC module as defined in claim 7, wherein at least one of said first and second film substrates is further provided with a device hole.
Claim 11
Dependent Claim
18 words
The IC module as defined in claim 8, wherein said electrically insulative plastic is an epoxy resin-based plastic.
Claim 12
Dependent Claim
18 words
The IC module as defined in claim 7, wherein said electrically insulative plastic is an epoxy resin-based plastic.
Claim 13
Dependent Claim
99 words
A junction structure of an IC module comprising: an IC module including, a film substrate with an opening provided therein, a plurality of wiring leads arranged on the surface of said film substrate having some respective portions bridging said opening, and respective outer ends, an electrically insulative plastic coating said some respective portions of said wiring leads which bridge said opening, and an IC chip coupled to said wiring leads; an electronic component with respective connection terminals; and connection means for coupling said respective outer ends of said wiring leads to said respective connection terminals of said electronic component.
Claim 14
Dependent Claim
99 words
A junction structure of an IC module comprising: an IC module including, a film substrate with an opening provided therein, a plurality of wiring leads arranged on the surface of said film substrate having some respective portions bridging said opening, and respective outer ends, an electrically insulative plastic coating said some respective portions of said wiring leads which bridge said opening, and an IC chip coupled to said wiring leads; an electronic component with respective connection terminals; and connection means for coupling said respective outer ends of said wiring leads to said respective connection terminals of said electronic component.
Claim 15
Dependent Claim
22 words
The junction structure of the IC module as defined in claim 11, wherein said electronic component includes a liquid crystal display panel.
Claim 16
Dependent Claim
26 words
The junction structure of the IC module as defined in claim 12, wherein said film substrate is folded at a part where said opening is located.
Claim 17
Dependent Claim
26 words
The junction structure of the IC module as defined in claim 11, wherein said film structure is folded at a part where said opening is located.
Claim 18
Dependent Claim
131 words
A junction structure of an IC module comprising: an IC module including, a first film substrate; a second film substrate arranged with a substantially uniform gap provided between itself and said first film substrate, a plurality of wiring leads arranged on the surfaces respectively of said first and second film substrates with some respective portions bridging said gap provided between first and second film substrates, and respective outer ends, an electrically insulative plastic coating said some respective portions of said wiring leads bridging said gap provided between said first and second film substrates, and an IC chip coupled to said wiring leads; an electronic component with respective connection terminals; and connection means for coupling said respective outer ends of said wiring leads to said respective connection terminals of said electronic component.
Claim 19
Dependent Claim
131 words
A junction structure of an IC module comprising: an IC module including, a first film substrate; a second film substrate arranged with a substantially uniform gap provided between itself and said first film substrate, a plurality of wiring leads arranged on the surfaces respectively of said first and second film substrates with some respective portions bridging said gap provided between first and second film substrates, and respective outer ends, an electrically insulative plastic coating said some respective portions of said wiring leads bridging said gap provided between said first and second film substrates, and an IC chip coupled to said wiring leads; an electronic component with respective connection terminals; and connection means for coupling said respective outer ends of said wiring leads to said respective connection terminals of said electronic component.
Claim 20
Dependent Claim
22 words
The junction structure of the IC module as defined in claim 15, wherein said electronic component includes a liquid crystal display panel.
Claim 21
Dependent Claim
41 words
The junction structure of the IC module as defined in claim 15, wherein said wiring leads are folded at a part where said some respective portions of said wiring leads bridge said gap provided between said first and second film substrates.
Claim 22
Dependent Claim
41 words
The junction structure of the IC module as defined in claim 16, wherein said wiring leads are folded at a part where said some respective portions of said wiring leads bridge said gap provided between said first and second film substrates.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-03 | 1996-05-04 | 1996-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-03 | 2000-05-04 | 2000-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-03 | 2004-05-04 | 2004-11-03 | $7700.00 | Window Closed / Lapsed |