US5164328A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
Assignee: NXP USA Inc
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Filing: 1992-05-11
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Granted: 1992-11-17
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Expires: 2012-05-11
Abstract
Abstract A method of joining an integrated circuit die (10) and a sensor die (11) by the use of solder bumps (12) for the formation of a hybrid circuit assembly. Sensor die (11) and integrated circuit die (10) are manufactured separately from each other. These two components are then joined by at least one solder bump to make a hybrid circuit assembly. A dielectric sealant (21) is deposited around the outside edges of sensor (11) to prevent foreign material such as encapsulating material from interfering in the operation of the sensor. The hybrid circuit assembly is encapsulated in a plastic material (14).
Inventors
- 👤 William C. Dunn
- 👤 Brooks L. Scofield, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:58
CPC Classifications
G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; B; B81; B81C; B81C1/00; B81C1/00015; B81C1/00222; B81C1/00238; H; H10; H10W; H10W90/00; G01P2015/0805; G01P2015/0822; G01P2015/0825; G01P2015/0828
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
85 words
A method of joining an accelerometer on an integrated circuit chip, comprising: providing the accelerometer having a solid first surface and a second surface; positioning the accelerometer on the integrated circuit and making an electrical contact between the accelerometer and the integrated circuit by solder bumps located between the second surface and the integrated circuit; and applying a dielectric sealant along edges of the accelerometer, sealing te accelerometer to the integrated circuit chip, thereby protecting a functional area of the accelerometer from any surrounding environment.
Claim 2
Independent Claim
85 words
A method of joining an accelerometer on an integrated circuit chip, comprising: providing the accelerometer having a solid first surface and a second surface; positioning the accelerometer on the integrated circuit and making an electrical contact between the accelerometer and the integrated circuit by solder bumps located between the second surface and the integrated circuit; and applying a dielectric sealant along edges of the accelerometer, sealing te accelerometer to the integrated circuit chip, thereby protecting a functional area of the accelerometer from any surrounding environment.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein the sealing is done by using a frit glass and then firing the frit glass.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein teh sealing is done by using an epoxy.
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein te sealing is done by using an elastomer.
Claim 6
Independent Claim
71 words
A method of mounting an accelerometer die having an undivided surface on an integrated circuit chip, comprising: using metal bumps for making electrical contact to the accelerometer and defining a functional area; aligning the accelerometer in an inverted position such that the metal bumps make electrical contact with the integrated circuit; and sealing around edges of the accelerometer sothat a functional area of the accelerometer is isolated from any surrounding environment.
Claim 7
Independent Claim
71 words
A method of mounting an accelerometer die having an undivided surface on an integrated circuit chip, comprising: using metal bumps for making electrical contact to the accelerometer and defining a functional area; aligning the accelerometer in an inverted position such that the metal bumps make electrical contact with the integrated circuit; and sealing around edges of the accelerometer sothat a functional area of the accelerometer is isolated from any surrounding environment.
Claim 8
Dependent Claim
15 words
The method of claim 5 wherein the sealing is done by using a frit glass.
Claim 9
Independent Claim
126 words
A method of joining an accelerometer having an undivided top surface and a bottom surface to an integrated circuit chip, wherein portions of the accelerometer move in response to acceleration, the accelerometer being joined to the integrated circuit by solder bumps which will conduct signals from capacitor plates on the bottom surface of the accelerometer to the integrated circuit, the method comprising: aligning the accelerometer in such a manner so that the solder bumps come into electrical contact with the integrated circuit; and sealing around edges of the accelerometer thereby holding the accelerometer in a fixed relationship to the integrated circuit while providing space between the accelerometer and the integrated circuit chip for the portion which moves to have an area in which it can move.
Claim 10
Independent Claim
126 words
A method of joining an accelerometer having an undivided top surface and a bottom surface to an integrated circuit chip, wherein portions of the accelerometer move in response to acceleration, the accelerometer being joined to the integrated circuit by solder bumps which will conduct signals from capacitor plates on the bottom surface of the accelerometer to the integrated circuit, the method comprising: aligning the accelerometer in such a manner so that the solder bumps come into electrical contact with the integrated circuit; and sealing around edges of the accelerometer thereby holding the accelerometer in a fixed relationship to the integrated circuit while providing space between the accelerometer and the integrated circuit chip for the portion which moves to have an area in which it can move.
Claim 11
Dependent Claim
18 words
The method of claim 7 further including teh step of encapsulating the integrated circuit chip and the accelerometer.
Claim 12
Independent Claim
86 words
A method of packaging an accelerometer in combination with an integrated circuit, comprising: providing an accelerometer with an undivided first surface and a second surface having at least one solder bump on the second surface for making electrical contact to the accelerometer; mounting the accelerometer on the integrated circuit chip in a manner so that the solder bump provides electrical contact between the second surface of the accelerometer and the integrated circuit chip; sealing around the accelerometer; and encapsulating the accelerometer and the integrated circuit chip.
Claim 13
Independent Claim
86 words
A method of packaging an accelerometer in combination with an integrated circuit, comprising: providing an accelerometer with an undivided first surface and a second surface having at least one solder bump on the second surface for making electrical contact to the accelerometer; mounting the accelerometer on the integrated circuit chip in a manner so that the solder bump provides electrical contact between the second surface of the accelerometer and the integrated circuit chip; sealing around the accelerometer; and encapsulating the accelerometer and the integrated circuit chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |