Patent US5196103A successfully refreshed from Google Patents.
US5196103A
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Method of making an electrical interconnection device
Assignee: Dow Chemical Co
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Filing: 1991-07-12
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Granted: 1993-03-23
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Expires: 2011-07-12
Abstract
Abstract The present invention refers to an electrical interconnection device having conductive metal layers separated by a dielectric cyclobutarene polymer layer. The adhesion of the conductive metal layer to the dielectric cyclobutarene polymer layer is promoted by a carbide-forming metal interface layer. Further disclosed is a method of making such electrical interconnection device by ion sputtering the dielectric cyclobutarene polymer surface, vapor depositing a carbide-forming metal interface layer onto the sputtered polymer surface, and then vapor depositing the superior conductive metal layer onto the carbide-forming metal interface layer.
Inventors
- 👤 James C. Tou
- 👤 Paul H. Townsend, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:39
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/20; C08; C08G; C08G61/00; C08G61/02; C08G61/04; C08G61/06; C23C14/02; C23C14/021; C23C14/022; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
112 words
A method of adhering a conductive metal layer onto a dielectric cyclobutarene polymer layer, method which comprises a) low energy sputtering the dielectric cyclobutarene polymer surface with a low energy ion/neutral beam to activate the surface by sputtering off the aliphatic hydrogens present on the polymer surface at an energy density such that the polymer surface is roughened to a depth of no more than about 50Å; b) depositing a carbide-forming metal interface layer having a thickness between about 5 and about 200Å onto the sputtered polymer surface: c) depositing the conductive metal layer onto the carbide-forming metal interface layer, and wherein the multilayered structure is built up on a supporting substrate.
Claim 2
Independent Claim
112 words
A method of adhering a conductive metal layer onto a dielectric cyclobutarene polymer layer, method which comprises a) low energy sputtering the dielectric cyclobutarene polymer surface with a low energy ion/neutral beam to activate the surface by sputtering off the aliphatic hydrogens present on the polymer surface at an energy density such that the polymer surface is roughened to a depth of no more than about 50Å; b) depositing a carbide-forming metal interface layer having a thickness between about 5 and about 200Å onto the sputtered polymer surface: c) depositing the conductive metal layer onto the carbide-forming metal interface layer, and wherein the multilayered structure is built up on a supporting substrate.
Claim 3
Dependent Claim
34 words
The method of claim 1 wherein the sputtering is conducted at a power density of less than about 2.0 watts/in 2 and at an energy density of less than about 200 Joules/in 2 .
Claim 4
Dependent Claim
31 words
The method of claim 1 wherein the sputtering is conducted at an energy density such that the cyclobutarene polymer surface is roughened to a depth of no more than about 20Å.
Claim 5
Dependent Claim
21 words
The method of claim 1 wherein the carbide forming metal is a transition metal of Group IV-B, V-B, VI-B or VIII.
Claim 6
Dependent Claim
19 words
The method of claim 4 wherein the carbide forming metal is titanium, chromium, nickel, tungsten or an alloy thereof.
Claim 7
Dependent Claim
12 words
The method of claim 5 wherein the carbide forming metal is titanium.
Claim 8
Dependent Claim
27 words
The method of claim 6 wherein the metal interface layer after a final heat treatment comprises titanium, titanium oxides, titanium-copper alloys, titanium-copper oxides or a mixture thereof.
Claim 9
Dependent Claim
12 words
The method of claim 8 wherein the conductive metal layer is copper.
Claim 10
Dependent Claim
18 words
The method of claim 1 wherein the conductive metal layer is copper, aluminum, silver, gold, magnesium, or platinum.
Claim 11
Dependent Claim
132 words
An improved method of making an electrical interconnection device having means to connect electronic circuitries on a supporting substrate with at least two conductive metal layers separated by a dielectric cyclobutarene polymer layer, wherein the improvement comprises a) low energy sputtering the dielectric cyclobutarene polymer surface with a low energy ion/neutral beam to activate the surface by sputtering off the aliphatic hydrogens present on the polymer surface at an energy density such that the polymer surface is roughened to a depth of no more than about 50Å; b) depositing a carbide-forming metal interface layer having a thickness between about 5 and about 200Å onto the sputtered polymer surface: c) depositing the conductive metal layer onto the carbide-forming metal interface layer, and wherein the multilayered structure is built up on a supporting substrate.
Claim 12
Dependent Claim
132 words
An improved method of making an electrical interconnection device having means to connect electronic circuitries on a supporting substrate with at least two conductive metal layers separated by a dielectric cyclobutarene polymer layer, wherein the improvement comprises a) low energy sputtering the dielectric cyclobutarene polymer surface with a low energy ion/neutral beam to activate the surface by sputtering off the aliphatic hydrogens present on the polymer surface at an energy density such that the polymer surface is roughened to a depth of no more than about 50Å; b) depositing a carbide-forming metal interface layer having a thickness between about 5 and about 200Å onto the sputtered polymer surface: c) depositing the conductive metal layer onto the carbide-forming metal interface layer, and wherein the multilayered structure is built up on a supporting substrate.
Claim 13
Dependent Claim
31 words
The method of claim 10 wherein the sputtering is conducted at an energy density such that the cyclobutarene polymer surface is roughened to a depth of no more than about 20Å.
Claim 14
Dependent Claim
21 words
The method of claim 10 wherein the carbide forming metal is a transition metal of Group IV-B, V-B, VI-B, or VIII.
Claim 15
Dependent Claim
19 words
The method of claim 1 wherein the carbide forming metal is titanium, chromium, nickel, tungsten, or an alloy thereof.
Claim 16
Dependent Claim
12 words
The method of claim 13 wherein the carbide forming metal is titanium.
Claim 17
Dependent Claim
18 words
The method of claim 10 wherein the conductive metal layer is copper, aluminum, silver, gold, magnesium, or platinum.
Claim 18
Dependent Claim
12 words
The method of claim 15 wherein the conductive metal layer is copper.
References Cited (Backward Citations)
US4886681A
Cited
US4902647A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-03-22 | 1996-09-21 | 1997-03-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-03-22 | 2000-09-21 | 2001-03-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-03-22 | 2004-09-21 | 2005-03-23 | $7700.00 | Window Closed / Lapsed |