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Patent US5199164A successfully refreshed from Google Patents.
US5199164A
Expired / Lapsed
US
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Method of manufacturing semiconductor package
Assignee: Samsung Electronics Co Ltd
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Filing: 1992-03-30
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Granted: 1993-04-06
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Expires: 2012-03-30
Abstract
Abstract The present invention relates to a semiconductor package which is loaded with a plurality of high-performance integrated circuits for high-performance systems such as super computers and large-sized computers. According to the invention, the packaging density of the semiconductor is doubled by stacking upper and lower members and forming substrates loaded with a plurality of chips in a multistep structure so that the size of computers can be minimized and heat emission efficiency can be improved by forming heat sinks in a fin-pin shape.
Inventors
- 👤 Gu S. Kim
- 👤 Young S. Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:42
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/30; H10W90/00; H10W90/401; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07353; H10W72/331; H10W72/334; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/877; H10W72/879; H10W72/884; H10W72/90; H10W72/931; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
82 words
A method of manufacturing a semiconductor package comprising the steps of: forming upper and lower members which are respectively coupled with a pad of Cu-W or Cu-Mo by brazing method. attaching upper and lower substrates loaded with a plurality of chips on said members, interconnecting said chips on said substrates in the members, connecting of said upper member to said lower member, sealing said upper and lower members together, and forming heat sinks at the outside of said upper and lower members.
Claim 2
Independent Claim
82 words
A method of manufacturing a semiconductor package comprising the steps of: forming upper and lower members which are respectively coupled with a pad of Cu-W or Cu-Mo by brazing method. attaching upper and lower substrates loaded with a plurality of chips on said members, interconnecting said chips on said substrates in the members, connecting of said upper member to said lower member, sealing said upper and lower members together, and forming heat sinks at the outside of said upper and lower members.
Claim 3
Dependent Claim
61 words
The method according to claim 1, wherein the step for loading said chips into said substrates after attaching said substrates to each member, comprises the substeps of: forming a thin film provide with said circuit patterns on each substrate, attaching said chips on each thin film by an adhesive agent, and wire-bonding said circuit patterns with said electrodes of said chips.
Claim 4
Dependent Claim
77 words
The method according to claim 1, wherein said connecting step comprises the substeps of: wire-bonding said circuit patterns on said upper and lower substrates with said metal lines at the inside of said upper and lower members in order to connect electrically said metal lines to an exposed part of said conductors where said upper and lower members meet each other, and connecting metal lines extended to the outside of said lower member with each external lead.
Claim 5
Dependent Claim
39 words
The method according to claim 1, wherein said sealing step comprises the substeps of: inserting said connection pad between said upper and lower members to connect each other, and sealing said upper and lower members by a sealing material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |