Patent US2850403A successfully refreshed from Google Patents.
Patent US5207437A successfully refreshed from Google Patents.
US5207437A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic electrostatic wafer chuck
Assignee: FM Industries Inc
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Filing: 1991-10-29
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Granted: 1993-05-04
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Expires: 2011-10-29
Abstract
Abstract An electrostatic chuck for semiconductor wafers comprised of a multilayered ceramic, including a back-side-metal layer pattern adjacent the upper wafer receiving surface for generating an electrostatic force. Intermediate via layers connect the pattern to a back-side-metal layer at the bottom of the chuck to which power leads can be connected. A number of small passages, extending from the bottom of the chuck to its upper surface, allow helium heat transfer without the need for surface grooves.
Inventors
- 👤 Michael S. Barnes
- 👤 Dennis K. Coultas
- 👤 John C. Forster
- 👤 John H. Keller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 23:20
CPC Classifications
B; B23; B23Q; B23Q3/00; B23Q3/15; H; H10; H10P; H10P72/00; H10P72/70; H10P72/72; Y; Y10; Y10T; Y10T279/00; Y10T279/23
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
140 words
An electrostatic chuck for holding semiconductor wafers against a top surface of said chuck, comprising in combination: a plurality of laminates fused together to form a support body, one of said laminates disposed adjacent said top surface having a back-side-metal electrode pattern for generating an electrostatic force to hold said semiconductor wafer to said top surface, and another of said laminates having a back-side-metal pattern on an exterior surface of said support body for connection to a power source; a plurality of vias formed in said laminates electrically connecting said pattern for generating an electrostatic force to said pattern for connection to a power source; and a plurality of apertures formed in said laminates and aligned in said fused support body to form a passage for a fluid coolant, said passage extending from said exterior surface to said top surface.
Claim 2
Dependent Claim
140 words
An electrostatic chuck for holding semiconductor wafers against a top surface of said chuck, comprising in combination: a plurality of laminates fused together to form a support body, one of said laminates disposed adjacent said top surface having a back-side-metal electrode pattern for generating an electrostatic force to hold said semiconductor wafer to said top surface, and another of said laminates having a back-side-metal pattern on an exterior surface of said support body for connection to a power source; a plurality of vias formed in said laminates electrically connecting said pattern for generating an electrostatic force to said pattern for connection to a power source; and a plurality of apertures formed in said laminates and aligned in said fused support body to form a passage for a fluid coolant, said passage extending from said exterior surface to said top surface.
Claim 3
Dependent Claim
23 words
An electrostatic chuck as in claim 1, wherein said back-side-metal electrode pattern for generating an electrostatic force comprises sets of interleaved "U"-shaped conductors.
Claim 4
Dependent Claim
23 words
An electrostatic chuck as in claim 1, wherein said back-side-metal electrode pattern for generating an electrostatic force comprises sets of interleaved comb-shaped conductors.
Claim 5
Dependent Claim
37 words
An electrostatic chuck as in claim 2, wherein said back-side-metal electrode pattern on an exterior surface of said support body and said plurality of vias connect said sets of "U"-shaped conductors to a potential of one polarity.
Claim 6
Dependent Claim
56 words
An electrostatic chuck as in claim 2, wherein said back-side-metal electrode pattern on an exterior surface of said support body and said plurality of vias connect one of said "U"-shaped conductors of said set to a potential of one polarity and the other of said "U"-shaped conductor of said set to a potential of opposite polarity.
Claim 7
Dependent Claim
37 words
An electrostatic chuck as in claim 3, wherein said back-side-metal electrode pattern on an exterior surface of said support body and said plurality of vias connect said sets of comb-shaped conductors to a potential of one polarity.
Claim 8
Dependent Claim
51 words
An electrostatic chuck as in claim 3, wherein said back-side-metal electrode pattern on an exterior surface of said support body and said plurality of vias conenct one of said sets of comb-shaped conductors to a potential of one polarity and the other of said sets to a potential of opposite polarity.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-03 | 1996-11-02 | 1997-05-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-03 | 2000-11-02 | 2001-05-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-03 | 2004-11-02 | 2005-05-04 | $7700.00 | Window Closed / Lapsed |