US5219608A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of spraying release agent
Assignee: Sharp Corp
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Filing: 1991-08-15
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Granted: 1993-06-15
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Expires: 2011-08-15
Abstract
Abstract A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.
Inventors
- 👤 Kazumasa Aoki
- 👤 Kazuya Fujita
- 👤 Hirofumi Uchida
- 👤 Takaaki Tsuda
- 👤 Takamichi Maeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:30
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/17; B29C45/83; B29C33/00; B29C33/56; B29C33/58; H; H10; H10W; H10W74/00; H10W74/01; H10W74/016
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
78 words
A method of spraying release agent on a semiconductor chip molding die provided with a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, and a runner disposed between said pot and said cavities for conducting the resin from said pot to said cavities, said method comprising the steps of: spraying said pot and said runner with fluorine-based release agent; and selectively spraying only said cavities with silicone-based release agent.
Claim 2
Independent Claim
78 words
A method of spraying release agent on a semiconductor chip molding die provided with a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, and a runner disposed between said pot and said cavities for conducting the resin from said pot to said cavities, said method comprising the steps of: spraying said pot and said runner with fluorine-based release agent; and selectively spraying only said cavities with silicone-based release agent.
Claim 3
Dependent Claim
31 words
A method as claimed as claim 1, wherein said step of spraying said fluorine-based release agent is a step of spraying the whole of said die with said fluorine-based release agent.
Claim 4
Dependent Claim
35 words
A method as claimed as claim 1, wherein said step of spraying said fluorine-based release agent is a step of spraying only said pot and a part of said runner with said fluorine-based release agent.
Claim 5
Dependent Claim
26 words
A method as claimed as claim 1, wherein said step of spraying said fluorine-based release agent is executed before said step of spraying silicone-based release agent.
Claim 6
Dependent Claim
28 words
A method as claimed as claim 1, wherein said step of spraying silicone-based release agent is executed before said step of spraying said fluorine-based release agent release agent.
Claim 7
Dependent Claim
16 words
A method as claimed in claim 1, wherein said non-silicone release agent is fluorine-based release agent.
Claim 8
Independent Claim
87 words
A method of spraying release agent on a semiconductor chip molding die provided with a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, and a runner disposed between said pot and said cavities for conducting the resin from said pot to said cavities, said method comprising the steps of: spraying said pot and said runner with specific release agent having lower releasability than that of silicone-based release agent; and selectively spraying only said cavities with silicone-based release agent.
Claim 9
Independent Claim
87 words
A method of spraying release agent on a semiconductor chip molding die provided with a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, and a runner disposed between said pot and said cavities for conducting the resin from said pot to said cavities, said method comprising the steps of: spraying said pot and said runner with specific release agent having lower releasability than that of silicone-based release agent; and selectively spraying only said cavities with silicone-based release agent.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-14 | 1996-12-14 | 1997-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-14 | 2000-12-14 | 2001-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-14 | 2004-12-14 | 2005-06-15 | $7700.00 | Window Closed / Lapsed |