Patent US5220298A successfully refreshed from Google Patents.
US5220298A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit having a built-in noise filter
Assignee: Toshiba Corp
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Filing: 1991-07-23
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Granted: 1993-06-15
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Expires: 2011-07-23
Abstract
Abstract A semiconductor integrated circuit comprising a semiconductor chip provided within a package, inner leads connected to the semiconductor chip, and a high-frequency noise filter connected to the inner leads. The semiconductor chip includes a high-frequency circuit. Thereby, this semiconductor integrated circuit prevents an around circuit from being damaged by high-frequency noise generated from the high-frequency circuit, without installing the noise filter around the semiconductor integrated circuit.
Inventors
- 👤 Masashi Nagase
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:06
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W42/00; H10W42/20; H10W42/281; H10W42/287; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
64 words
A semiconductor integrated circuit comprising: an integrated circuit package; a semiconductor chip provided within said package; inner leads connected to said semiconductor chip and extending from the chip through the package; and means for preventing said inner leads from transmitting noise of a predetermined frequency, said means being connected to the inner leads within the package and being independent of circuitry within the chip.
Claim 2
Dependent Claim
64 words
A semiconductor integrated circuit comprising: an integrated circuit package; a semiconductor chip provided within said package; inner leads connected to said semiconductor chip and extending from the chip through the package; and means for preventing said inner leads from transmitting noise of a predetermined frequency, said means being connected to the inner leads within the package and being independent of circuitry within the chip.
Claim 3
Dependent Claim
16 words
A semiconductor integrated circuit according to claim 1, wherein said semiconductor chip includes a high-frequency circuit.
Claim 4
Dependent Claim
15 words
A semiconductor integrated circuit according to claim 1, wherein said predetermined frequency is high frequency.
Claim 5
Dependent Claim
18 words
A semiconductor integrated circuit according to claim 1, wherein said preventing means has a plurality of divided forms.
Claim 6
Dependent Claim
31 words
A semiconductor integrated circuit according to claim 1, wherein said preventing means consists of two parts, and said inner leads are sandwiched by the two parts of the preventing means vertically.
Claim 7
Dependent Claim
38 words
A semiconductor integrated circuit according to claim 1, wherein a plurality of said preventing means are provided, and each of said means is connected to only some of said inner leads and not to the other inner leads.
Claim 8
Dependent Claim
16 words
A semiconductor integrated circuit according to claim 1, wherein said preventing means includes a ferrite core.
Claim 9
Dependent Claim
15 words
A semiconductor integrated circuit according to claim 1, wherein said preventing means includes a capacitor.
Claim 10
Dependent Claim
16 words
A semiconductor integrated circuit according to claim 1, wherein said package includes an electrically conductive material.
Claim 11
Dependent Claim
26 words
A semiconductor integrated circuit according to claim 1, wherein said package includes an insulating material, and the surface of the package includes an electrically conductive material.
Claim 12
Dependent Claim
27 words
A semiconductor integrated circuit according to claim 1, wherein said package includes an insulating material, and the surface of the package includes an electromagnetic wave absorbing material.
Claim 13
Dependent Claim
19 words
A semiconductor integrated circuit according to claim 11, wherein said electromagnetic wave absorbing material is connected to circuit ground.
Claim 14
Dependent Claim
33 words
A semiconductor integrated circuit according to claim 1, wherein a plurality of said inner leads are provided, and some of the inner leads are not connected to said preventing means and are branched.
Claim 15
Independent Claim
86 words
A method of manufacturing a semiconductor integrated circuit, comprising: a first step of connecting preventing means to a frame for said semiconductor integrated circuit, said preventing means preventing inner leads of said frame from transmitting noise of a predetermined frequency; a second step of mounting a semiconductor chip at a center portion of said frame, following the first step; and a third step of connecting the inner leads of the frame to bonding pads of the semiconductor chip by means of wires, following the second step.
Claim 16
Independent Claim
86 words
A method of manufacturing a semiconductor integrated circuit, comprising: a first step of connecting preventing means to a frame for said semiconductor integrated circuit, said preventing means preventing inner leads of said frame from transmitting noise of a predetermined frequency; a second step of mounting a semiconductor chip at a center portion of said frame, following the first step; and a third step of connecting the inner leads of the frame to bonding pads of the semiconductor chip by means of wires, following the second step.
Claim 17
Dependent Claim
14 words
A method according to claim 14, wherein said semiconductor chip includes a high-frequency circuit.
Claim 18
Dependent Claim
17 words
A method according to claim 14, wherein said preventing means is divided into a plurality of parts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-14 | 1996-12-14 | 1997-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-14 | 2000-12-14 | 2001-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-14 | 2004-12-14 | 2005-06-15 | $7700.00 | Window Closed / Lapsed |