Patent US5221419A successfully refreshed from Google Patents.
US5221419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming laminate for microwave oven package
Assignee: CAMINE RESOURCES Inc
•
Filing: 1992-04-21
•
Granted: 1993-06-22
•
Expires: 2012-04-21
Abstract
Abstract A laminate structure useful for incorporating into a package structure for the microwave cooking of foodstuffs for consumption comprises an outer layer polymeric material, an outer layer of microwave transparent material, a grid layer having an electroconductive surface surrounding transmissive apertures located between the outer layers, and a thin layer of electroconductive material of sufficient thickness so that a portion of incident microwave energy is converted to thermal energy also located between the outer layers. The structure is useful in providing controlled surface heating and microwave transmittance to achieve a more uniformly heated product employing less structural material than the prior art.
Inventors
- 👤 D. Gregory Beckett
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:25
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/043; B32B15/12; B32B15/20; B32B3/00; B32B3/26; B32B3/266; B32B7/00; B32B7/04; B32B7/12; B65; B65D; B65D81/00; B65D81/34; B65D81/3446; B32B2311/00; B32B2311/24; B32B2439/00; B32B2439/70; B65D2581/00; B65D2581/34; B65D2581/3401; B65D2581/3402; B65D2581/3405; B65D2581/3406; B65D2581/3437; B65D2581/3439; B65D2581/344; B65D2581/3452; B65D2581/3454; B65D2581/3463; B65D2581/3466; B65D2581/3467; B65D2581/3471; B65D2581/3472; B65D2581/3477; B65D2581/3478; B65D2581/3486; B65D2581/3489; B65D2581/3494
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
106 words
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises: forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a polymeric film layer, directly depositing a thin layer of electroconductive material over said grid layer to adhere to said electroconductive surface and to said polymeric film layer in said apertures, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and adhering said thin electroconductive material layer to a substrate layer of microwave transparent material.
Claim 2
Independent Claim
106 words
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises: forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a polymeric film layer, directly depositing a thin layer of electroconductive material over said grid layer to adhere to said electroconductive surface and to said polymeric film layer in said apertures, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and adhering said thin electroconductive material layer to a substrate layer of microwave transparent material.
Claim 3
Dependent Claim
36 words
The method of claim 1 wherein said first laminate is formed by: laminating a layer of electroconductive material to said polymeric film layer, and effecting selective demetallization of said electroconductive material layer to form said grid.
Claim 4
Dependent Claim
63 words
The method of claim 2 wherein said selective demetallization is effected by: applying a pattern of etchant-resistant material to said electroconductive material layer in the pattern of said electroconductive surface in said grid, and applying an etchant for said electroconductive material to said electroconductive material layer to remove said electroconductive material from locations not bearing said etchant-resistant material, thereby forming said transmissive aperture.
Claim 5
Dependent Claim
17 words
The method of claim 3 wherein said thin layer of electroconductive material is applied by vapor deposition.
Claim 6
Independent Claim
85 words
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises: forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a thin layer of electroconductive material supported on a polymeric film layer, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and adhering said grid layer to a substrate layer of microwave transparent material.
Claim 7
Independent Claim
85 words
A method of forming a laminate structure useful for forming a food package for a microwave oven, which comprises: forming a first laminate comprising a layer of material defining a grid having an electroconductive surface surrounding transmissive apertures adhered to a thin layer of electroconductive material supported on a polymeric film layer, said thin electroconductive material layer having a thickness sufficient to convert a portion of incident microwave energy to thermal energy, and adhering said grid layer to a substrate layer of microwave transparent material.
Claim 8
Dependent Claim
38 words
The method of claim 5 wherein said first laminate is formed by: laminating a layer of electroconductive material to said thin layer of electroconductive material, and effecting selective demetallization of said electroconductive material layer to form said grid.
Claim 9
Dependent Claim
63 words
The method of claim 6 wherein said selective demetallization is effected by: applying a pattern of etchant-resistant material to said electroconductive material layer in the pattern of said electroconductive surface in said grid, and applying an etchant for said electroconductive material to said electroconductive material layer to remove said electroconductive material from locations not bearing said etchant-resistant material, thereby forming said transmissive apertures.
Claim 10
Dependent Claim
28 words
The method of claim 1 including applying a layer of etchant-resistant material to said thin layer of electroconductive material prior to laminating said layer of electroconductive material thereto.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-21 | 1996-12-21 | 1997-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-21 | 2000-12-21 | 2001-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-21 | 2004-12-21 | 2005-06-22 | $7700.00 | Window Closed / Lapsed |