DRAM-cell having an isolation merged trench and its method of manufacture

Claim 1

A method for forming a DRAM cell having an isolation merged trench, comprising the steps of: (a) preparing a silicon substrate on which a p-well is formed; (b) sequentially forming a first oxide film, a first silicon nitride film and a second oxide film on said p-well; (c) etching back said first oxide film, said first silicon nitride film, said oxide film and said p-well at a portion to form a first trench therein by using a trench mask to form said first trench; (d) forming a second silicon nitride film as a first spacer on an interior side wall surface of said first trench; (e) etching back said p-well in a depth direction of said first trench to form a second trench; (f) implanting impurity ions to said p-well through an interior side wall of said second trench and forming a side wall field oxide film on said interior side wall to prevent leakage current from occurring; (g) forming a third oxide film as a second spacer on said interior side wall of said second trench; (h) etching back the remainder of said p-well and a predetermined depth of said silicon substrate in a depth direction in said second trench to form a third trench; (i) doping ions of an n-type impurity to the exposed p-well and said silicon substrate to form an n+ diffusion layer therein; (j) removing said second spacer and forming a fourth oxide film as a first capacitor dielectric on the surface of said n+ diffusion layer; (k) removing said first spacer and said second oxide film, forming an n+ polysilicon of a storing electrode on the inside surfaces of said first, second and third trenches and annealing to form an n+ layer in a portion of said p-well having said n+ polysilicon contacted thereof; (l) forming a fifth oxide film as a second capacitor dielectric on the surface of said n+ polysilicon; (m) forming a first polysilicon layer as a third spacer on the surface of said second capacitor dielectric; (n) removing said first capacitor dielectric at the bottom of said third trench and filling a second polysilicon layer as a plate electrode within the interior of said third trench to connect said n+ diffusion layer and said plate electrode with each other; (o) sequentially forming a field oxide film, a gate oxide film and a word line; and (p) forming a silicon oxide film on said word line and etching back said silicon oxide film at a portion of said n+ layer for electrically connecting a bit line formed on said silicon oxide.

Claim 2

A method for forming a DRAM cell having an isolation merged trench, comprising the steps of: (a) preparing a silicon substrate on which a p-well is formed; (b) sequentially forming a first oxide film, a first silicon nitride film and a second oxide film on said p-well; (c) etching back said first oxide film, said first silicon nitride film, said oxide film and said p-well at a portion to form a first trench therein by using a trench mask to form said first trench; (d) forming a second silicon nitride film as a first spacer on an interior side wall surface of said first trench; (e) etching back said p-well in a depth direction of said first trench to form a second trench; (f) implanting impurity ions to said p-well through an interior side wall of said second trench and forming a side wall field oxide film on said interior side wall to prevent leakage current from occurring; (g) forming a third oxide film as a second spacer on said interior side wall of said second trench; (h) etching back the remainder of said p-well and a predetermined depth of said silicon substrate in a depth direction in said second trench to form a third trench; (i) doping ions of an n-type impurity to the exposed p-well and said silicon substrate to form an n+ diffusion layer therein; (j) removing said second spacer and forming a fourth oxide film as a first capacitor dielectric on the surface of said n+ diffusion layer; (k) removing said first spacer and said second oxide film, forming an n+ polysilicon of a storing electrode on the inside surfaces of said first, second and third trenches and annealing to form an n+ layer in a portion of said p-well having said n+ polysilicon contacted thereof; (l) forming a fifth oxide film as a second capacitor dielectric on the surface of said n+ polysilicon; (m) forming a first polysilicon layer as a third spacer on the surface of said second capacitor dielectric; (n) removing said first capacitor dielectric at the bottom of said third trench and filling a second polysilicon layer as a plate electrode within the interior of said third trench to connect said n+ diffusion layer and said plate electrode with each other; (o) sequentially forming a field oxide film, a gate oxide film and a word line; and (p) forming a silicon oxide film on said word line and etching back said silicon oxide film at a portion of said n+ layer for electrically connecting a bit line formed on said silicon oxide.