US5225633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bridge chip interconnect system
Assignee: United States Department of the Air Force
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Filing: 1991-10-04
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Granted: 1993-07-06
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Expires: 2011-10-04
Abstract
Abstract A bridge chip interconnect system is used for electrically interconnecting first and second semiconductor chip devices. The first and second semiconductor chip devices each are mounted adjacent to each other with a space therebetween and respectively have first and second row of ohmic contact pads on their top surfaces. The bridge chip interconnect system includes a rigid bridge base which has a top surface and which is placed in the space between the first and second semiconductor chip devices; and a plurality of conducting beams which are fixed to the top surface of the rigid bridge base and which have dimensions to enable each of them to make contact with one of the ohmic contact pads form each of the first and second row of ohmic contact pads.
Inventors
- 👤 Stewart C. Wigginton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:28
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
201 words
A bridge chip interconnect system comprising: first and second semiconductor chip devices, said first and second semiconductor chip devices each being mounted adjacent to each other with a space therebetween and respectively having a first and second row of ohmic contact pads on their top surfaces; a rigid bridge base which has a top surface and which is placed in the space between the first and second semiconductor chip devices; and a plurality of conducting beams ar fixed to the top surface of the rigid bridge base and which have dimensions to enable each of them to make contact with one of the ohmic contact pads from each of the first and second row of ohmic contact pads on the first and second semiconductor chip devices between which the rigid base is to be fixed, said plurality of conducting beams collectively providing electrical connections between the first and second semiconductor chip devices, wherein said plurality of conducting beams comprise a plurality of conductive leads which are fixed atop said rigid bridge base so that they are spaced apart from each other and which have nonuniform lengths that enable them to contact pairs of ohmic contact points which have similar nonuniform distances.
Claim 2
Dependent Claim
201 words
A bridge chip interconnect system comprising: first and second semiconductor chip devices, said first and second semiconductor chip devices each being mounted adjacent to each other with a space therebetween and respectively having a first and second row of ohmic contact pads on their top surfaces; a rigid bridge base which has a top surface and which is placed in the space between the first and second semiconductor chip devices; and a plurality of conducting beams ar fixed to the top surface of the rigid bridge base and which have dimensions to enable each of them to make contact with one of the ohmic contact pads from each of the first and second row of ohmic contact pads on the first and second semiconductor chip devices between which the rigid base is to be fixed, said plurality of conducting beams collectively providing electrical connections between the first and second semiconductor chip devices, wherein said plurality of conducting beams comprise a plurality of conductive leads which are fixed atop said rigid bridge base so that they are spaced apart from each other and which have nonuniform lengths that enable them to contact pairs of ohmic contact points which have similar nonuniform distances.
Claim 3
Dependent Claim
20 words
A bridge chip interconnect system, as defined in claim 1, wherein said conductive beams are each parallel with each other.
Claim 4
Dependent Claim
36 words
A bridge chip system, as defined in claim 1, wherein said rigid bridge base comprises a block of insulator material which may be fabricated from materials selected from the group consisting of: silicon, ceramics, and wood.
Claim 5
Dependent Claim
36 words
A bridge chip system, as defined in claim 2, wherein said rigid bridge base comprises a block of insulator material which may be fabricated from materials selected from the group consisting of: silicon, ceramics, and wood.
Claim 6
Dependent Claim
35 words
A bridge chip system, as defined in claim 1, wherein said plurality of conductive beams are composed of electrically conductive materials selected from the group consisting of: gold, silver, copper, iron, germanium, aluminum and nickel.
Claim 7
Dependent Claim
35 words
A bridge chip system, as defined in claim 2, wherein said plurality of conductive beams are composed of electrically conductive materials selected from the group consisting of: gold, silver, copper, iron, germanium aluminum and nickel.
Claim 8
Dependent Claim
35 words
A bridge chip system, as defined in claim 4, wherein said plurality of conductive beams are composed of electrically conductive materials selected from the group consisting of: gold, silver, copper, iron, germanium, aluminum and nickel.
Claim 9
Dependent Claim
184 words
A process for electrically interconnecting first and second semiconductor chip devices, said first and second semiconductor chip devices, each being mounted adjacent to each other with a space therebetween and respectively having first and second row of ohmic contact pads on their top surfaces, wherein said process comprises the steps of: providing first and second semiconductor chip devices each being mounted adjacent to each other with a space therebetween and having first and second row of ohmic contact pads on their surfaces; fixing a rigid bridge interconnection system between said first and second semiconductor chip devices such that said rigid bridge interconnection system has a plurality of conducting beams which have nonuniform lengths and dimensions to enable each of them to make contact with one of the ohmic contact pads from each of the first and second row of ohmic contact pads, said plurality of conducting beams thereby collectively providing electrical connections between the first and second semiconductor chip devices; and bonding each of the conducting beams of the rigid bridge ohmic contact pads of the first and second row of ohmic contact points.
Claim 10
Dependent Claim
184 words
A process for electrically interconnecting first and second semiconductor chip devices, said first and second semiconductor chip devices, each being mounted adjacent to each other with a space therebetween and respectively having first and second row of ohmic contact pads on their top surfaces, wherein said process comprises the steps of: providing first and second semiconductor chip devices each being mounted adjacent to each other with a space therebetween and having first and second row of ohmic contact pads on their surfaces; fixing a rigid bridge interconnection system between said first and second semiconductor chip devices such that said rigid bridge interconnection system has a plurality of conducting beams which have nonuniform lengths and dimensions to enable each of them to make contact with one of the ohmic contact pads from each of the first and second row of ohmic contact pads, said plurality of conducting beams thereby collectively providing electrical connections between the first and second semiconductor chip devices; and bonding each of the conducting beams of the rigid bridge ohmic contact pads of the first and second row of ohmic contact points.
Claim 11
Dependent Claim
35 words
A process, as defined in claim 8, wherein said bonding step comprises creating a permanent electrical contact between the respective ohmic contact pads and the conducting beams using techniques that include bump bonding and soldering.
Claim 12
Dependent Claim
52 words
A process, as defined in claim 8, wherein said fixing step is performed using a rigid base which has a top surface and which is placed in the space between the first and second semiconductor chip devices, said rigid bridge base having said plurality of conducting beams mounted on its top surface.
Claim 13
Dependent Claim
52 words
A process, as defined in claim 9, wherein said fixing step is performed using a rigid base which has a top surface and which is placed in the space between the first and second semiconductor chip devices, said rigid bridge base having said plurality of conducting beams mounted on its top surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-05 | 1997-01-04 | 1997-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-05 | 2001-01-04 | 2001-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-05 | 2005-01-04 | 2005-07-06 | $7700.00 | Window Closed / Lapsed |