Ceramic package and method for making same

Claim 1

A ceramic package suitable for a semiconductor device comprising a) a ceramic base component having a first portion for receiving a semiconductor chip and a second portion outward from said first portion, b) a plurality of bonding pads of an electrically conductive metallic material covering a first area of said second portion of said base component and suitable for being electrically connected to said chip, c) a first bus of an electrically conductive metallic material covering a second area of said second portion of said base component and suitable for being electrically connecting to said chip, d) a second bus of an electrically conductive metallic material covering a third area of said second portion of said base component and suitable for being electrically connecting to said chip, said bonding pad, said first and second buses being electrically insulated from each other, e) a signal shielding component bonded to said base component outward of and electrically insulated from said bonding pad and said first and second buses, said shielding component comprising first and second electrically conductive metallic layers electrically insulated from each other by a first layer of a dielectric material, all of said layers being substantially in alignment, and said first electrically conductive metallic layer being electrically connected to said first bus and said second electrically conductive metallic layer being electrically connected to said second bus, f) a second layer of a dielectric material covering the surface of said shielding component opposing the surface bonded to said base component, and g) a glass frit bonded to said second layer of dielectric material having the metallic leads that extend from a metallic lead frame embedded therein, wherein said leads and said signal shielding component ar in substantial alignment an said leads are electrically insulated from said shielding component and are connected to said bonding pads.

Claim 11

A method of forming a semiconductor package comprising a) providing a prefired ceramic base component having a first portion and a second portion outward of said first portion, b) depositing an electrically conductive material over a first segment of said second portion adjacent said first portion, to provide a plurality of electrically conductive bonding pads, c) forming a signal shielding component by depositing, in sequence and in substantial alignment, a first layer of an electrically conductive metallic material, a layer of a first dielectric material and a second layer of an electrically conductive metallic material, d) bonding an external surface of said signal shielding component to said ceramic base component, e) depositing a layer of a second dielectric material on the opposing external surface of said shielding component, f) depositing a layer of glass frit upon the layer of said second dielectric material and between said bonding pad and said shielding component and positioning a metallic lead frame having its leads extending therefrom substantially in alignment with said signal shielding component and g) firing said package to melt said frit thereby embedding said leads [frame] into said glass frit.

Claim 12

A method of forming a semiconductor package comprising a) providing a prefired ceramic base component having a first portion and a second portion outward of said first portion, b) depositing an electrically conductive material over a first segment of said second portion adjacent said first portion, to provide a plurality of electrically conductive bonding pads, c) forming a signal shielding component by depositing, in sequence and in substantial alignment, a first layer of an electrically conductive metallic material, a layer of a first dielectric material and a second layer of an electrically conductive metallic material, d) bonding an external surface of said signal shielding component to said ceramic base component, e) depositing a layer of a second dielectric material on the opposing external surface of said shielding component, f) depositing a layer of glass frit upon the layer of said second dielectric material and between said bonding pad and said shielding component and positioning a metallic lead frame having its leads extending therefrom substantially in alignment with said signal shielding component and g) firing said package to melt said frit thereby embedding said leads [frame] into said glass frit.