Abstract A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.
A method for single wafer processing in which a semiconductor wafer is subjected to contact with a fluid, comprising the following steps: engaging the edge of a wafer by releasable gripper means centered about a central axis on a portable housing; moving the portable housing to the location of a complementary open bowl formed about a bowl axis on a support surface; mounting the portable housing to the support surface with the wafer perpendicular to the bowl axis; and subjecting the wafer to contact with a fluid at the bowl interior.
Claim 2
Independent Claim
91 words
A method for single wafer processing in which a semiconductor wafer is subjected to contact with a fluid, comprising the following steps: engaging the edge of a wafer by releasable gripper means centered about a central axis on a portable housing; moving the portable housing to the location of a complementary open bowl formed about a bowl axis on a support surface; mounting the portable housing to the support surface with the wafer perpendicular to the bowl axis; and subjecting the wafer to contact with a fluid at the bowl interior.
Claim 3
Dependent Claim
33 words
The method of claim 1 and further comprising the step of rotating the grippers to rotate the wafer about the central axis of the portable housing while contacting the wafer with the fluid.
Claim 4
Dependent Claim
28 words
The method of claim 1 and further comprising the step of supporting the wafer by the grippers while immersing the wafer in a liquid contained in the bowl.
Claim 5
Dependent Claim
29 words
The method of claim 1 and further comprising the step of supporting the wafer by the grippers while the wafer is subjected to a liquid spray within the bowl.
Claim 6
Dependent Claim
33 words
The method of claim 1 and further comprising the step of rotating the grippers to rotate the wafer about the central axis of the bowl while spraying the wafer with a liquid spray.