Surface treatment method and apparatus for a semiconductor wafer

Claim 1

A surface treatment apparatus for a semiconductor wafer comprising: a treatment tank body made of anti-corrosion material having a cylindrical inside with a vertical axis line, a circular recess substantially coaxial with the cylindrical inside and formed on upper surface of the bottom wall of the treatment tank body, a plurality of lower fluid holes opened in the recess and a horizontally long opening provided at a lower part of side wall of the treatment tank body, an anti-corrosion movable wall which is tightly and slidably inserted in the cylindrical inside of the treatment tank body, forming a closed room with the recess when contacting with the bottom wall of the treatment tank body and is provided with a plurality of upper fluid holes communicated with said closed room, an actuation means for moving the movable wall, at least three support pins vertically penetrating the bottom wall of the treatment tank body for horizontally supporting the wafer inserted in the recess, a first passage member through which the support pin slidably penetrates at near the top end and secured in the lower fluid holes, a second passage member secured at near the bottom end of the support pin, a lift body in a form of a short cylinder secured to the second passage member, a bellows made of anti-corrosion material and provided between the lift body and near the lower fluid holes of the treatment tank body, a connecting member for lifting as one body fitted onto outer surface of the lift body, a lifting means connected to the center of horizontal bottom surface of the connecting member, and a treatment fluid supply/discharge means connected to upper fluid holes and lower end of the lift body.