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Electroplating process and composition

Assignee: Shipley Co Inc
•
Filing: 1992-09-10
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Granted: 1994-01-04
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Expires: 2012-09-10
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Abstract

Abstract A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.

Inventors

  • 👤 John J. Bladon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 15:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/423; H05K3/424; C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K3/425; H05K3/427

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 65 words
A printed circuit board having metallized through holes providing electrical contact from one side of the board to the other, said metallized through holes consisting essentially of electroplated copper on the walls of the holes and having an adsorbed layer of colloidal particles of a catalytic metal sulfide disposed between the circuit board base material and the copper on the walls of the through holes.
Claim 2
Dependent Claim 65 words
A printed circuit board having metallized through holes providing electrical contact from one side of the board to the other, said metallized through holes consisting essentially of electroplated copper on the walls of the holes and having an adsorbed layer of colloidal particles of a catalytic metal sulfide disposed between the circuit board base material and the copper on the walls of the through holes.
Claim 3
Dependent Claim 14 words
The circuit board of claim 1 where the catalytic metal is a noble metal.
Claim 4
Dependent Claim 12 words
The circuit board of claim 2 where the noble metal is palladium.
Claim 5
Dependent Claim 12 words
The circuit board of claim 1 where the catalytic metal is copper.

References Cited (Backward Citations)

US844304A Cited
US2474502A Cited
US3011920A Cited
US3934335A Cited
US4303798A Cited
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EP0298298A2 Cited
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US4919768A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-01-03 1997-07-05 1998-01-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-01-03 2001-07-05 2002-01-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-01-03 2005-07-05 2006-01-04 $7700.00 Window Closed / Lapsed

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