Patent US5280409A successfully refreshed from Google Patents.
US5280409A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink and cover for tab integrated circuits
Assignee: Sun Microsystems Inc
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Filing: 1992-10-09
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Granted: 1994-01-18
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Expires: 2012-10-09
Abstract
Abstract An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.
Inventors
- 👤 Erich Selna
- 👤 Ehsan Ettehadieh
- 👤 James LaGassa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 10:41
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/641; H10W40/20; H10W40/231; H10W40/233
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
171 words
An apparatus for efficiently dissipating heat generated by integrated circuits mounted on printed circuit boards, said apparatus comprising: a printed circuit board, said printed circuit board having a first side, a second side, and a plurality of edges, said printed circuit board having at least one opening through said printed circuit board, said opening having a thermal conductive material placed therein; an integrated circuit mounted on said first side of said printed circuit board over said opening and being adjacent to said thermal conductive material; and a heat dissipation device located on said second side of said printed circuit board over said opening and contacting said thermal conductive material; wherein heat generated by said integrated circuit is conducted from said first side through said printed circuit board opening via said thermal conductive material to said second side where it is dissipated by said heat dissipation device, a cover which encloses said integrated circuit, said cover having a ledge; and, a spring clip that couples said cover to said printed circuit board.
Claim 2
Independent Claim
171 words
An apparatus for efficiently dissipating heat generated by integrated circuits mounted on printed circuit boards, said apparatus comprising: a printed circuit board, said printed circuit board having a first side, a second side, and a plurality of edges, said printed circuit board having at least one opening through said printed circuit board, said opening having a thermal conductive material placed therein; an integrated circuit mounted on said first side of said printed circuit board over said opening and being adjacent to said thermal conductive material; and a heat dissipation device located on said second side of said printed circuit board over said opening and contacting said thermal conductive material; wherein heat generated by said integrated circuit is conducted from said first side through said printed circuit board opening via said thermal conductive material to said second side where it is dissipated by said heat dissipation device, a cover which encloses said integrated circuit, said cover having a ledge; and, a spring clip that couples said cover to said printed circuit board.
Claim 3
Dependent Claim
68 words
The apparatus as set forth in claim 1, wherein: said printed circuit board includes a first notch on a first edge of said printed circuit board and a second notch on a second edge of said printed circuit board; and said cover includes a pair of locator pins located on a first and a second end of said cover for aligning said cover onto said printed circuit board.
Claim 4
Dependent Claim
13 words
The apparatus of claim 1 wherein: said cover has at least one window.
Claim 5
Dependent Claim
16 words
The apparatus as set forth in claim 1, wherein said thermal conductive material is a vias.
Claim 6
Dependent Claim
14 words
The apparatus as claimed in claim 4, wherein the thermal conductive material comprises copper.
Claim 7
Dependent Claim
49 words
The apparatus as set forth in claim 1 wherein said thermal conductive material comprises a heat slug which fits within the opening; said heat slug containing said first surface and said second surface, said first surface contacting said integrated circuit and said second surface contacting said heat dissipation device.
Claim 8
Dependent Claim
17 words
The apparatus as set forth in claim 1, wherein said heat dissipation device comprises a heat sink.
Claim 9
Dependent Claim
24 words
The apparatus as claimed in claim 7, wherein a layer of thermal grease is placed between said printed circuit board and said heat sink.
Claim 10
Dependent Claim
42 words
The apparatus as claimed in claim 1 wherein said printed circuit board has at least one notch in an edge of said printed circuit board and said cover has at least one locator pin which fits within a recess of said notch.
Claim 11
Independent Claim
105 words
A method for constructing an integrated circuit package efficiently cooling the integrated circuit and protecting the integrated circuit, said method comprising the steps of: creating a via in a printed circuit board; mounting an integrated circuit to a first side of said printed circuit board and adjacent to said via; placing a cover over said integrated circuit on said first side of said printed circuit board; placing a heat dissipation device to a second side of said printed circuit board and adjacent to said via; and, clasping said heat dissipation device to said printed circuit board with a spring clip that hooks onto said cover.
Claim 12
Independent Claim
105 words
A method for constructing an integrated circuit package efficiently cooling the integrated circuit and protecting the integrated circuit, said method comprising the steps of: creating a via in a printed circuit board; mounting an integrated circuit to a first side of said printed circuit board and adjacent to said via; placing a cover over said integrated circuit on said first side of said printed circuit board; placing a heat dissipation device to a second side of said printed circuit board and adjacent to said via; and, clasping said heat dissipation device to said printed circuit board with a spring clip that hooks onto said cover.
Claim 13
Dependent Claim
44 words
The method for mounting an integrated circuit onto a printed circuit board as claimed in claim 10 wherein said heat dissipation device is mounted to said printed circuit board using a bolt which screws through said printed circuit board and into said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-17 | 1997-07-19 | 1998-01-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-17 | 2001-07-19 | 2002-01-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-17 | 2005-07-19 | 2006-01-18 | $7700.00 | Window Closed / Lapsed |