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US5290381A Expired / Lapsed US ⏱️ 0.0 years remaining

Plasma etching apparatus

Assignee: Toshiba Corp
•
Filing: 1991-11-27
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Granted: 1994-03-01
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Expires: 2011-11-27
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Abstract

Abstract A plasma etching apparatus comprising a susceptor for holding a semiconductive wafer, a cooling jacket having a coolant of a large cooling capacity and capable of quickly cooling said susceptor to an intended low temperature, a process chamber enclosing the susceptor and the cooling jacket, a gas discharging mechanism for evacuating the process chamber, an insulating member interposed between the susceptor and the cooling jacket, a gas supply device for supplying gas to an O-ring holding groove arranged on the interface regions of the susceptor, the insulating member and the cooling section and a pressure control mechanism for controlling the pressure of the supplied gas.

Inventors

  • 👤 Toshihisa Nozawa
  • 👤 Junichi Arami
  • 👤 Keiji Horioka
  • 👤 Isahiro Hasegawa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:41
CPC Classifications
H; H10; H10P; H10P50/00; H10P72/00; H10P72/04; H10P72/0402; H10P72/0418; H10P72/0421; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H10P72/70; H10P72/78; H01J2237/00; H01J2237/20; H01J2237/2001; H01J2237/32; H01J2237/33; H01J2237/334

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 91 words
A plasma etching apparatus comprising: a susceptor for holding an object to be etched; a cooling section for cooling said susceptor; a process chamber enclosing the susceptor and the cooling section; exhausting means for exhausting a gas in the process chamber; gas supply means for supplying a heat transfer gas at a interface region between the susceptor and the cooling section; heating means for heating the susceptor; and temperature detecting means for detecting a temperature of the susceptor, to thereby control heating of said heating means based on the detected temperature.
Claim 2
Dependent Claim 91 words
A plasma etching apparatus comprising: a susceptor for holding an object to be etched; a cooling section for cooling said susceptor; a process chamber enclosing the susceptor and the cooling section; exhausting means for exhausting a gas in the process chamber; gas supply means for supplying a heat transfer gas at a interface region between the susceptor and the cooling section; heating means for heating the susceptor; and temperature detecting means for detecting a temperature of the susceptor, to thereby control heating of said heating means based on the detected temperature.
Claim 3
Dependent Claim 39 words
A plasma etching apparatus according to claim 1, further comprising pressure control means for controlling the pressure to supply the heat transfer gas to the interface region, on the basis of a temperature detected by said temperature detecting means.
Claim 4
Dependent Claim 35 words
A plasma etching apparatus according to claim 1, whereby the pressure of the heat transfer gas supplied to an interface region between said heating means and the susceptor is controlled by said pressure control means.
Claim 5
Dependent Claim 24 words
A plasma etching apparatus according to claim 1, wherein a gas supply region is isolated and sealed against the atmosphere in the process chamber.
Claim 6
Dependent Claim 16 words
A plasma etching apparatus according to claim 1, wherein said heat transfer gas is inert gas.
Claim 7
Dependent Claim 21 words
A plasma etching apparatus according to claims 1, further comprising an insulation frame interposed between the susceptor and the cooling section.
Claim 8
Dependent Claim 28 words
A plasma etching apparatus according to claim 1, wherein the susceptor has an upper susceptor member and a lower susceptor member which are in a state of contact.
Claim 9
Dependent Claim 31 words
A plasma etching apparatus according to claim 7, further comprising means for adjusting the state of contact of the upper and lower susceptor members of the susceptor in the interface region.
Claim 10
Dependent Claim 37 words
A plasma etching apparatus according to claim 1, further comprising means for supplying gas to an interface region between the object and the susceptor, thereby controlling pressure of the heat transfer gas by said pressure control means.
Claim 11
Dependent Claim 47 words
A plasma etching apparatus according to claim 7, wherein the heat transfer gas is supplied to an interface region between the lower susceptor and the upper susceptor member, through an inner surface side of an O-ring holding groove formed in an upper surface of the lower susceptor.
Claim 12
Dependent Claim 38 words
A plasma etching apparatus according to claim 7, whereby the pressure of the heat transfer gas supplied to an interface region between the upper and lower susceptor members of the susceptor is controlled by said pressure control means.
Claim 13
Dependent Claim 36 words
A plasma etching apparatus according to claim 6, whereby the pressure of the heat transfer gas supplied to an interface region between the insulation frame and the cooling section is controlled by said pressure control means.
Claim 14
Dependent Claim 25 words
A plasma etching apparatus according to claim 6, wherein said insulation frame is made of material for electrically insulating said susceptor from said cooling section.
Claim 15
Dependent Claim 47 words
A plasma etching apparatus according to claim 6, wherein the heat transfer gas is supplied to the interface region between the insulation frame and the cooling section, and to that between the insulation frame and the susceptor, via an inner surface side of an O-ring holding groove.
Claim 16
Dependent Claim 37 words
A plasma etching apparatus according to claim 6, further comprising means for supplying gas to an interface region between the object and the susceptor, thereby controlling pressure of the heat transfer gas by said pressure control means.
Claim 17
Dependent Claim 35 words
A plasma etching apparatus according to claim 6, whereby the pressure of the heat transfer gas supplied to an interface region between the insulation frame and the susceptor is controlled by said pressure control means.

References Cited (Backward Citations)

US4508161A Cited
US4565601A Cited
US4609037A Cited
US4771730A Cited
JPS63141317A Cited
JPS63227021A Cited
JPS63229716A Cited
US4931135A Cited
JPH01268030A Cited
EP0339580A2 Cited
US5078851A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-02-28 1997-08-30 1998-03-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-02-28 2001-08-30 2002-03-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-02-28 2005-08-30 2006-03-01 $7700.00 Window Closed / Lapsed

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