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Mold releasing resin composition and molding of curable resin using the same

Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1992-06-12
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Granted: 1994-05-31
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Expires: 2012-06-12
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Abstract

Abstract A mold releasing resin composition is provided which contains at least one fluorinated compound end-blocked with a dimethylhydrogensiloxane group and optionally having a fluorinated polyether linkage. The composition is applied to the inner surface of a silicone rubber mold and cured thereat before a curable resin is admitted into the mold, cured therein, and then removed from the mold.

Inventors

  • 👤 Shinichi Sato
  • 👤 Morio Oohasi
  • 👤 Hiroshi Inomata

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 09:28
CPC Classifications
B; B29; B29C; B29C33/00; B29C33/56; B29C33/60; B29C33/62; B29C33/64; B29K; B29K2083/00

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 46 words
A mold releasing composition comprising at least one compound represented by formula (1) or (2): ##STR9## wherein letter a is an integer of from 0 to 2, n and m are integers meeting n+m=0 to 8, and b is an integer of from 4 to 12.
Claim 2
Dependent Claim 46 words
A mold releasing composition comprising at least one compound represented by formula (1) or (2): ##STR9## wherein letter a is an integer of from 0 to 2, n and m are integers meeting n+m=0 to 8, and b is an integer of from 4 to 12.
Claim 3
Dependent Claim 92 words
A process of molding a curable resin, comprising the steps of: applying a composition comprising at least one compound represented by formula (1) or (2): ##STR10## wherein letter a is an integer of from 0 to 2, n and m are integers meeting n+m=0 to 8, and b is an integer of from 4 to 12, to the inner surface of a silicone rubber mold, curing the composition thereat, admitting a curable resin into the mold, causing the resin to cure in the mold, and removing the cured resin from the mold.
Claim 4
Dependent Claim 92 words
A process of molding a curable resin, comprising the steps of: applying a composition comprising at least one compound represented by formula (1) or (2): ##STR10## wherein letter a is an integer of from 0 to 2, n and m are integers meeting n+m=0 to 8, and b is an integer of from 4 to 12, to the inner surface of a silicone rubber mold, curing the composition thereat, admitting a curable resin into the mold, causing the resin to cure in the mold, and removing the cured resin from the mold.
Claim 5
Dependent Claim 27 words
The mold releasing composition according to claim 1, wherein said composition further comprises a dimethylsilicone oil having a viscosity of at least 1,000 centistokes at 25° C.
Claim 6
Dependent Claim 50 words
The mold releasing composition according to claim 3, wherein said dimethylsilicone oil is represented by the formula: ##STR11## wherein R is a hydrogen, vinyl, hydroxyl, or methyl group and c is a sufficiently large number so as to provide for a viscosity of at least 1,000 centistokes at 25° C.
Claim 7
Dependent Claim 65 words
The mold releasing composition according to claim 1, wherein said composition further comprises a silicone varnish obtained by dissolving a methyl series silicone which comprises a trifunctional siloxane unit as an essential component and siloxane units selected from the group consisting of CH 3 SiO 3/2 , (CH 3 )SiO, CH 2 ═CHSiO 3/2 , and (CH 2 ═CH)CH 3 SiO into an organic solvent.
Claim 8
Dependent Claim 65 words
The mold releasing composition according to claim 3, wherein said composition further comprises a silicone varnish obtained by dissolving a methyl series silicone which comprises a trifunctional siloxane unit as an essential component and siloxane units selected from the group consisting of CH 3 SiO 3/2 , (CH 3 )SiO, CH 2 ═CHSiO 3/2 , and (CH 2 ═CH)CH 3 SiO into an organic solvent.
Claim 9
Dependent Claim 42 words
The mold releasing composition according to claim 1, wherein said composition further comprises a base catalyst selected from the group consisting of hydroxides, alkoxides of alkali metals, silanolates of alkali metals, quaternary ammonium salts, phosphonium salts and silanolates thereof, amines, and imidazoles.
Claim 10
Dependent Claim 42 words
The mold releasing composition according to claim 3, wherein said composition further comprises a base catalyst selected from the group consisting of hydroxides, alkoxides of alkali metals, silanolates of alkali metals, quaternary ammonium salts, phosphonium salts and silanolates thereof, amines, and imidazoles.
Claim 11
Dependent Claim 42 words
The mold releasing composition according to claim 5, wherein said composition further comprises a base catalyst selected from the group consisting of hydroxides, alkoxides of alkali metals, silanolates of alkali metals, quaternary ammonium salts, phosphonium salts and silanolates thereof, amines, and imidazoles.
Claim 12
Dependent Claim 42 words
The mold releasing composition according to claim 6, wherein said composition further comprises a base catalyst selected from the group consisting of hydroxides, alkoxides of alkali metals, silanolates of alkali metals, quaternary ammonium salts, phosphonium salts and silanolates thereof, amines, and imidazoles.
Claim 13
Dependent Claim 24 words
The mold releasing composition according to claim 1, wherein a is 0, n+m=2 to 6, and b is an integer from 6 to 10.
Claim 14
Dependent Claim 25 words
The mold releasing resin composition according to claim 1, wherein said compound of formulae (1) or (2) is selected from the group consisting of ##STR12##
Claim 15
Dependent Claim 25 words
The mold releasing resin composition according to claim 10, wherein said compound of formulae (1) or (2) is selected from the group consisting of ##STR13##
Claim 16
Dependent Claim 16 words
The mold releasing composition according to claim 1, wherein said composition further comprises an organic solvent.
Claim 17
Dependent Claim 24 words
The mold releasing composition according to claim 14, wherein said organic solvent is selected from aliphatic hydrocarbons, ethers, ketones, esters, alcohols, and halogenated solvents.
Claim 18
Dependent Claim 16 words
The mold releasing composition according to claim 14, wherein said organic solvent is n-hexane or trichlorotrifluoroethane.
Claim 19
Dependent Claim 13 words
The process according to claim 2, wherein said composition comprises an organic solvent.
Claim 20
Dependent Claim 14 words
The process according to claim 17, wherein said organic solvent is n-hexane or trichlorotrifluoroethane.
Claim 21
Dependent Claim 28 words
The process according to claim 17, wherein said curing step is carried out at a temperature of about 50° to 150° C. until said solvent is volatilized off.
Claim 22
Dependent Claim 31 words
The process according to claim 19, wherein said curing step is carried out at a temperature of about 60° to 100° C. for a duration of about 1 to 3 hours.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-05-30 1997-11-29 1998-05-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-05-30 2001-11-29 2002-05-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-05-30 2005-11-29 2006-05-31 $7700.00 Window Closed / Lapsed

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