Patent US2175179A successfully refreshed from Google Patents.
Patent US5323533A successfully refreshed from Google Patents.
US5323533A
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US
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Method of producing coaxial connections for an electronic component, and component package
Assignee: Thales SA
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Filing: 1992-03-17
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Granted: 1994-06-28
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Expires: 2012-03-17
Abstract
Abstract An object of the invention is the production of coaxial connections for the input/output links of the component and/or of the housing which encapsulates it. More precisely, the component placed in a package (B), is conventionally connected by wires to its package; the wires are next covered by a first insulating layer (21) then by a second conducting layer (24) in such a way that this second layer is linked to the earth pads (P E1 ) of the package. The layers (21, 24) thus form collectively-produced coaxial structures with the connection wires (F). A similar process is used for the input/output connections (P) of the package itself.
Inventors
- 👤 Christian Val
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 08:58
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09809; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W44/203; H10W44/206; H10W44/209; H10W44/212; H10W70/682; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/30; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/5363; H10W72/5366; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W76/00; H10W76/10; H10W76/17; H10W76/18; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49123; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
169 words
Method of producing connections for an electronic component (Cl) placed on a base (E) of a package (B), the base (E) further comprising input-output connection pins (P), the method being characterised in that it successively comprises the following steps: a first step of electrical linking of each pad (P Cl ) of the component (Cl) to a pad (P E2 ) of the base (E) by means of a wire (F); a second step of depositing a layer (21; 41) of an electrically-insulating material on the wires (F) and at least those of the pads (P E2 ) of the base to which the wires are linked, and/or on the pins (P) of the package; a third step of depositing a layer (24; 42) of electrically-conducting material on the part of the insulating layer which covers the wires (F) and/or the pins (P), the conducting layer being linked to a reference potential, the said insulating and conducting layers thus forming with the wires and/or the pins coaxial-structure electrical connections.
Claim 2
Dependent Claim
169 words
Method of producing connections for an electronic component (Cl) placed on a base (E) of a package (B), the base (E) further comprising input-output connection pins (P), the method being characterised in that it successively comprises the following steps: a first step of electrical linking of each pad (P Cl ) of the component (Cl) to a pad (P E2 ) of the base (E) by means of a wire (F); a second step of depositing a layer (21; 41) of an electrically-insulating material on the wires (F) and at least those of the pads (P E2 ) of the base to which the wires are linked, and/or on the pins (P) of the package; a third step of depositing a layer (24; 42) of electrically-conducting material on the part of the insulating layer which covers the wires (F) and/or the pins (P), the conducting layer being linked to a reference potential, the said insulating and conducting layers thus forming with the wires and/or the pins coaxial-structure electrical connections.
Claim 3
Dependent Claim
25 words
Method according to claim 1, characterised in that the deposition of a layer of an electrically-insulating material is carried out by condensation at reduced pressure.
Claim 4
Dependent Claim
13 words
Method according to claim 1, characterised in that the insulating material is parylene.
Claim 5
Dependent Claim
25 words
Method according to claim 1, characterised in that the deposition of a layer of electrically-conducting material is carried out by cathodic pulverisation in a vacuum.
Claim 6
Dependent Claim
25 words
Method according to claim 1, characterised in that the conducting material comprises copper, nickel, chrome, gold, nickel or aluminium or a composite of these metals.
Claim 7
Dependent Claim
35 words
Method according to claim 1, characterised in that the conducting layer (24) which covers the wires (F) covers at least one pad (P E1 ) of the base which is linked to the reference potential.
Claim 8
Dependent Claim
40 words
Method according to claim 6, characterised in that it comprises, before the second step, a supplementary step of connecting, to the pad assigned to the reference potential (P E1 ), a wire (35) which is substantially normal to the pad.
Claim 9
Dependent Claim
29 words
Method according to claim 1, characterised in that the second and third steps are carried out after connection of the pins (P) of the base to an external circuit.
Claim 10
Dependent Claim
94 words
A package comprising a base (E) bearing an electronic component (C1) and a cap (C) arranged on a base, with pads (P C1 ) of the component being connected to pads (P E2 ) of the base by conducting wires (F); the package being characterized in that the wires are covered by a layer (21) of an insulating material and the latter by a layer (24) of a conducting material, the conducting layer being linked to a reference potential, and the electrical connections of the component to the base thus having a coaxial structure.
Claim 11
Dependent Claim
94 words
A package comprising a base (E) bearing an electronic component (C1) and a cap (C) arranged on a base, with pads (P C1 ) of the component being connected to pads (P E2 ) of the base by conducting wires (F); the package being characterized in that the wires are covered by a layer (21) of an insulating material and the latter by a layer (24) of a conducting material, the conducting layer being linked to a reference potential, and the electrical connections of the component to the base thus having a coaxial structure.
Claim 12
Dependent Claim
74 words
A package comprising a base (E) bearing an electronic component (C1), a cap (C) arranged on the base and having input-output connection pins (P); the package being characterized in that the pins are covered by a layer (41) of an insulating material and the latter by a layer (42) of a conducting material, the conducting layer being linked to a reference potential, and the connection pins of the package thus having a coaxial structure.
Claim 13
Dependent Claim
74 words
A package comprising a base (E) bearing an electronic component (C1), a cap (C) arranged on the base and having input-output connection pins (P); the package being characterized in that the pins are covered by a layer (41) of an insulating material and the latter by a layer (42) of a conducting material, the conducting layer being linked to a reference potential, and the connection pins of the package thus having a coaxial structure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |