US5329733A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer slicing and grinding machine and a method of slicing and grinding wafers
Assignee: Silicon Technology Corp Japan
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Filing: 1993-02-24
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Granted: 1994-07-19
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Expires: 2013-02-24
Abstract
Abstract A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.
Inventors
- 👤 Robert E. Steere, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:10
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/0082; B28D5/0094; B28D1/00; B28D1/003; B28D5/02; B28D5/022; B28D5/028
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
101 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ground face of the ingot in said slicing position; moving the wafer sliced from the ingot to a holding station; thereafter transferring the wafer from said holding station to a position with an unground face thereof in a plane common to the face of the ingot; and thereafter grinding the unground face of the wafer and the face of the ingot in said plane.
Claim 2
Independent Claim
101 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ground face of the ingot in said slicing position; moving the wafer sliced from the ingot to a holding station; thereafter transferring the wafer from said holding station to a position with an unground face thereof in a plane common to the face of the ingot; and thereafter grinding the unground face of the wafer and the face of the ingot in said plane.
Claim 3
Dependent Claim
45 words
A method as set forth in claim 1 which further comprises the steps of measuring the thickness of a ground wafer and adjusting the position of a subsequently positioned wafer relative to said plane in dependence on a measured thickness deviating from a present value.
Claim 4
Dependent Claim
25 words
A method as set forth in claim 1 which further comprises the steps of conveying the ground wafer from said plane to an unloading position.
Claim 5
Independent Claim
137 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot on a longitudinal axis in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer sliced form the ingot at said slicing position to a holding station; moving a previously sliced wafer to a position with a second face thereof in a plane common to an unground face of the ingot in said slicing position; and thereafter grinding the second face of the previously sliced wafer and the face of the ingot in said plane.
Claim 6
Independent Claim
137 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot on a longitudinal axis in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer sliced form the ingot at said slicing position to a holding station; moving a previously sliced wafer to a position with a second face thereof in a plane common to an unground face of the ingot in said slicing position; and thereafter grinding the second face of the previously sliced wafer and the face of the ingot in said plane.
Claim 7
Dependent Claim
27 words
A method as set forth in claim 4 wherein the face of the second wafer is ground sequentially before the face of the ingot in said plane.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |