Patent US1140313A successfully refreshed from Google Patents.
Patent US5329733A successfully refreshed from Google Patents.
US5329733A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer slicing and grinding machine and a method of slicing and grinding wafers
Assignee: Silicon Technology Corp Japan
•
Filing: 1993-02-24
•
Granted: 1994-07-19
•
Expires: 2013-02-24
Abstract
Abstract A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.
Inventors
- 👤 Robert E. Steere, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:40
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/0082; B28D5/0094; B28D1/00; B28D1/003; B28D5/02; B28D5/022; B28D5/028
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
101 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ground face of the ingot in said slicing position; moving the wafer sliced from the ingot to a holding station; thereafter transferring the wafer from said holding station to a position with an unground face thereof in a plane common to the face of the ingot; and thereafter grinding the unground face of the wafer and the face of the ingot in said plane.
Claim 2
Independent Claim
101 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ground face of the ingot in said slicing position; moving the wafer sliced from the ingot to a holding station; thereafter transferring the wafer from said holding station to a position with an unground face thereof in a plane common to the face of the ingot; and thereafter grinding the unground face of the wafer and the face of the ingot in said plane.
Claim 3
Dependent Claim
45 words
A method as set forth in claim 1 which further comprises the steps of measuring the thickness of a ground wafer and adjusting the position of a subsequently positioned wafer relative to said plane in dependence on a measured thickness deviating from a present value.
Claim 4
Dependent Claim
25 words
A method as set forth in claim 1 which further comprises the steps of conveying the ground wafer from said plane to an unloading position.
Claim 5
Independent Claim
137 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot on a longitudinal axis in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer sliced form the ingot at said slicing position to a holding station; moving a previously sliced wafer to a position with a second face thereof in a plane common to an unground face of the ingot in said slicing position; and thereafter grinding the second face of the previously sliced wafer and the face of the ingot in said plane.
Claim 6
Independent Claim
137 words
A method of slicing and grinding a wafer from an ingot comprising the steps of positioning an ingot on a longitudinal axis in a slicing position; grinding a face of the ingot in said slicing position; slicing a wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer from the ingot positioned at said slicing position after grinding of the face of the ingot; moving the wafer sliced form the ingot at said slicing position to a holding station; moving a previously sliced wafer to a position with a second face thereof in a plane common to an unground face of the ingot in said slicing position; and thereafter grinding the second face of the previously sliced wafer and the face of the ingot in said plane.
Claim 7
Dependent Claim
27 words
A method as set forth in claim 4 wherein the face of the second wafer is ground sequentially before the face of the ingot in said plane.
References Cited (Backward Citations)
US3740900A
Cited
US4420909A
Cited
US4420909B1
Cited
US4420909B2
Cited
US4896459A
Cited
JPS62264835A
Cited
US4852304A
Cited
US4881518A
Cited
US4930262A
Cited
US5025593A
Cited
JPH029535A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |