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US5330862A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for forming resist mask pattern by light exposure having a phase shifter pattern comprising convex forms in the resist

Assignee: Sharp Corp
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Filing: 1992-04-28
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Granted: 1994-07-19
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Expires: 2012-04-28
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Abstract

Abstract A method for forming a resist mask pattern by light exposure providing the steps of forming a resist layer on a semiconductor substrate, forming a phase shifter pattern for inverting a phase of exposed light in an upper portion of the resist layer itself or over the surface of the resist layer, exposing the surface of the semiconductor substrate including the phase shifter pattern, and forming a fine mask pattern below the edge of the phase shifter pattern.

Inventors

  • 👤 Hiroki Tabuchi
  • 👤 Katsuji Iguchi
  • 👤 Makoto Tanigawa
  • 👤 Takayuki Taniguchi
  • 👤 Hiroyuki Moriwaki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 11:39
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/54; G03F1/56; G03F1/26; G03F7/00; G03F7/0035; G03F7/004; G03F7/09; G03F7/095; G03F7/20; G03F7/2022; G03F7/26; G03F7/40

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 115 words
A method for forming a resist pattern by light exposure comprising the steps of: i) forming a resist layer having an upper surface on a semiconductor substrate, ii) forming a phase shifter pattern for inverting the phase of exposure light, said phase shifter pattern comprising convex forms in an upper portion of the resist layer itself, iii) exposing the whole upper surface of the resulting resist layer including the phase shifter pattern to form unexposed portions positioned below and adjacent to side walls of the convex forms of the phase shifter pattern, and iv) developing the resist layer, thereby forming a desired resist pattern having a width shorter than a wavelength of the exposure light.
Claim 2
Independent Claim 115 words
A method for forming a resist pattern by light exposure comprising the steps of: i) forming a resist layer having an upper surface on a semiconductor substrate, ii) forming a phase shifter pattern for inverting the phase of exposure light, said phase shifter pattern comprising convex forms in an upper portion of the resist layer itself, iii) exposing the whole upper surface of the resulting resist layer including the phase shifter pattern to form unexposed portions positioned below and adjacent to side walls of the convex forms of the phase shifter pattern, and iv) developing the resist layer, thereby forming a desired resist pattern having a width shorter than a wavelength of the exposure light.
Claim 3
Dependent Claim 41 words
The method for forming a resist pattern by light exposure according to claim 1 wherein forming the phase shifter pattern in the upper portion of the resist layer is conducted by light exposure using a mask provided above the resist layer.
Claim 4
Independent Claim 105 words
A method for forming a resist pattern by light exposure comprising the steps of: i) forming a resist layer on a semiconductor substrate, ii) forming a phase shifter pattern for inverting the phase of exposure light, said phase shifter pattern comprising convex forms, over the resist layer, iii) exposing the resist layer including the phase shifter pattern to form unexposed portions in the resist layer which are below and adjacent to side walls of the convex forms of the phase shifter pattern, iv) developing the resultant resist layer to form a desired resist pattern having a width shorter than a wavelength of the exposure light.
Claim 5
Independent Claim 105 words
A method for forming a resist pattern by light exposure comprising the steps of: i) forming a resist layer on a semiconductor substrate, ii) forming a phase shifter pattern for inverting the phase of exposure light, said phase shifter pattern comprising convex forms, over the resist layer, iii) exposing the resist layer including the phase shifter pattern to form unexposed portions in the resist layer which are below and adjacent to side walls of the convex forms of the phase shifter pattern, iv) developing the resultant resist layer to form a desired resist pattern having a width shorter than a wavelength of the exposure light.
Claim 6
Dependent Claim 31 words
The method for forming a resist pattern by light exposure according to claim 3, wherein the phase shifter pattern comprises a thin film pattern which is transparent to the exposure light.
Claim 7
Dependent Claim 42 words
The method for forming a resist pattern by light exposure according to claim 4, wherein the phase shifter pattern is formed after the thin film layer, which is transparent to the exposure light, is laminated over the surface of the resist layer.
Claim 8
Dependent Claim 45 words
The method for forming a resist pattern by light exposure according to claim 4, further comprising forming between the resist layer and the thin film, an intermediate layer which is transparent for the exposure light and is soluble in a developer for the resist layer.
Claim 9
Dependent Claim 70 words
The method for forming a resist pattern by light exposure according to claim 4, wherein the resist layer is made of a novolak resin, its surface is treated with a diluted developing solution and a film which is insoluble for the developing solution is then formed on the surface of the resist layer, and the phase shifter pattern is formed on the film which is insoluble for the developing solution.
Claim 10
Dependent Claim 68 words
The method for forming a resist pattern by light exposure according to claim 4, wherein the resist layer is made of a novolak resin, its surface is irradiated with ultraviolet rays and a film which is insoluble for the developing solution is then formed on the surface of the resist layer, and the phase shifter pattern is formed on the film which is insoluble for the developing solution.

References Cited (Backward Citations)

JPS5651738A Cited
JPS6459884A Cited
US5015559A Cited
JPH03237458A Cited
JPH03259257A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-07-18 1998-01-17 1998-07-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-07-18 2002-01-17 2002-07-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-07-18 2006-01-17 2006-07-19 $7700.00 Window Closed / Lapsed

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