Patent US5331204A successfully refreshed from Google Patents.
US5331204A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane
Assignee: Niterra Co Ltd
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Filing: 1992-10-19
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Granted: 1994-07-19
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Expires: 2012-10-19
Abstract
Abstract An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.
Inventors
- 👤 Masao Kuroda
- 👤 Ryuji Imai
- 👤 Toshiya Asano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W44/00; H10W70/611; H10W72/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
140 words
An integrated circuit package comprising: a multilayer part including: a plurality of wiring layers each having a plurality of signal lines; a pair of ground layers; a conductor pad; and a plurality of insulating layers through which said wiring layers and said ground layer are laminated, wherein an inner size of the conductor pad is selected to be not less than five times as large as a trace width of the signal lines in the plurality of wiring layers, said inner size being the maximum diameter of an inscribing circle in an outline of the conductor pad, and wherein an area defined by the pair of ground layers and existing in a vertical direction from the conductor pad is not larger than a region defined by extending a width of the signal lines over a circumference of the conductor pad.
Claim 2
Dependent Claim
140 words
An integrated circuit package comprising: a multilayer part including: a plurality of wiring layers each having a plurality of signal lines; a pair of ground layers; a conductor pad; and a plurality of insulating layers through which said wiring layers and said ground layer are laminated, wherein an inner size of the conductor pad is selected to be not less than five times as large as a trace width of the signal lines in the plurality of wiring layers, said inner size being the maximum diameter of an inscribing circle in an outline of the conductor pad, and wherein an area defined by the pair of ground layers and existing in a vertical direction from the conductor pad is not larger than a region defined by extending a width of the signal lines over a circumference of the conductor pad.
Claim 3
Dependent Claim
50 words
An integrated circuit package as claimed in claim 1, wherein there is no ground layer in a region defined by vertically extending the portion of the conductor pad that does not include the region defined by extending a width of the signal lines over a circumference of the conductor pad.
Claim 4
Dependent Claim
26 words
An integrated circuit package as claimed in claim 1, wherein each insulating layer includes one of said wiring layers, said ground layers, and said conductor pad.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-07-18 | 1998-01-17 | 1998-07-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-07-18 | 2002-01-17 | 2002-07-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-07-18 | 2006-01-17 | 2006-07-19 | $7700.00 | Window Closed / Lapsed |