US5372848A
Expired / Lapsed
US
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Process for creating organic polymeric substrate with copper
Assignee: International Business Machines Corp
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Filing: 1992-12-24
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Granted: 1994-12-13
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Expires: 2012-12-24
Abstract
Abstract A copper layer is coated onto an organic polymeric substrate in the presence of a gas containing nitrogen and a noble gas.
Inventors
- 👤 Kim J. Blackwell
- 👤 Luis J. Matienzo
- 👤 Allan R. Knoll
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/14; H05K3/16; C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/20; C23C14/205; H05K3/38
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
71 words
A method for depositing copper onto an organic polymer substrate and for improving the adhesion of the copper on the organic polymeric substrate which comprises providing an organic polymer substrate; coating onto said organic polymeric substrate a layer of copper by sputtering or evaporation in the presence of a gas containing nitrogen and a noble gas, wherein the volume percentage of nitrogen in said gas is about 0.09 to about 50%.
Claim 2
Independent Claim
71 words
A method for depositing copper onto an organic polymer substrate and for improving the adhesion of the copper on the organic polymeric substrate which comprises providing an organic polymer substrate; coating onto said organic polymeric substrate a layer of copper by sputtering or evaporation in the presence of a gas containing nitrogen and a noble gas, wherein the volume percentage of nitrogen in said gas is about 0.09 to about 50%.
Claim 3
Dependent Claim
14 words
The method of claim 1 wherein the copper is sputter coated onto said substrate.
Claim 4
Dependent Claim
21 words
The method of claim 2 wherein the voltage of the target during coating is about 300 to about 700 volts D.C.
Claim 5
Dependent Claim
19 words
The method of claim 2 wherein the pressure during coating is about 8×10 -4 to about 3×10 -3 torr.
Claim 6
Dependent Claim
21 words
The method of claim 1 wherein the coating of said substrate is carried out in the presence of a magnetic field.
Claim 7
Dependent Claim
11 words
The method of claim 1 wherein the noble gas is argon.
Claim 8
Dependent Claim
20 words
The method of claim 1 wherein the volume percentage of nitrogen in said gas is about 1 to about 20%.
Claim 9
Dependent Claim
20 words
The method of claim 1 wherein the volume percentage of nitrogen in said gas is about 5% to about 12%.
Claim 10
Dependent Claim
19 words
The method of claim 1 wherein the temperature of the substrate during coating is about 60° C. or less.
Claim 11
Dependent Claim
20 words
The method of claim 1 wherein the rate of deposition of said copper is about 50 to about 150 angstroms/second.
Claim 12
Dependent Claim
16 words
The method of claim 1 wherein said copper is about 150 to about 1000 angstroms thick.
Claim 13
Dependent Claim
13 words
The method of claim 1 wherein said copper is about 1000 angstroms thick.
Claim 14
Dependent Claim
13 words
The method of claim 1 wherein said substrate is a polyimide containing substrate.
Claim 15
Dependent Claim
25 words
The method of claim 1 which further includes plating an additional layer of copper onto the layer of copper coated by said sputtering or evaporation.
Claim 16
Dependent Claim
20 words
The method of claim 14 wherein said additional layer of copper is about 0.3 mil to about 3 mils thick.
Claim 17
Dependent Claim
76 words
The method of claim 1 wherein said layer of copper is coated by sputtering wherein the voltage of the target during sputtering is about 300 to about 700 volts D.C., the pressure during coating to about 8×10 -4 to about 3×10 -3 torr; said noble gas is argon; the temperature of the substrate during sputtering is about 60° C. or less, and the volume percentage of nitrogen in said gas is about 5 to about 12%.
Claim 18
Dependent Claim
24 words
The method of claim 16 wherein said substrate is a polyimide and said sputtering is carried out in the presence of a magnetic field.
Claim 19
Dependent Claim
17 words
The method of claim 17 wherein the copper layer is about 150 to about 1000 angstroms thick.
Claim 20
Dependent Claim
15 words
The method of claim 1 wherein the sputtering is carried out using a planar magnetron.
Claim 21
Dependent Claim
13 words
The method of claim 14 wherein said plating is carried out using electroplating.
Claim 22
Dependent Claim
14 words
The method of claim 17 wherein sputtering is carried out using a planar magnetron.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-12-12 | 1998-06-13 | 1998-12-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-12-12 | 2002-06-13 | 2002-12-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-12-12 | 2006-06-13 | 2006-12-13 | $7700.00 | Window Closed / Lapsed |